Advanced 12 Channel Constant Current LED Driver IC BD18379EFV-M General Description The BD18379EFV-M is a serial input controlled constant current LED driver with 8 V output rating. 6 bit current calibration is available for each output while a selected PWM input performs dimming on the corresponding output. The BD18379EFV-M is able to perform diagnostic (open / short / temperature) checks to detect LED failure and over temperature on chip. Fault detection is performed also during LED deactivated state. The settings of all internal registers can be read out to verify written information at any time. Key Specifications Input voltage range: Output voltage range: Output Current range: Output Current accuracy Maximum clock frequency: Operating current: Operating temperature range: Package HTSSOP-B28 Features (Note1) AEC-Q100 Qualified Current capability: 50mA per output channel. 4-line SPI Control. External resistor current setting. Limp Home capability. PWM dimming 0.2-99.2% at 200Hz Diagnostic of all PWM inputs. Programmable output mapping to each PWM input. 6 Bit LED brightness adjustment on each channel. Diagnostic output on LED OPEN and SHORT for each channel during PWM on & off time. True LED voltage measurement. Over Temperature Protection and Thermal Feedback. Open Drain Fault indicator. Read-back of all register settings. Outputs can be connected in parallel to achieve more than 50mA into the load. Slew Rate limited switching reduces radiated Noise (EMI). Daisy chain compatible. 3V to 5.5V 0.5V to 8V 10mA to 50mA 3.5% 1.25MHz 4mA (Typ.) - 40C to +105C L(Typ.) x W(Typ.) x H(Max.) 9.70mm x 6.40mm x 1.00mm Applications Automotive illumination & ambient light Consumer electronics illumination (Note1: Operating Temperature Grade 2) Typical Application Circuit Diagram 8V max RP VCC to Controller LEDs CLED 0 ERR 1 2 3 4 5 6 7 8 9 10 11 VLED SENSE CHANNEL 5.5V max VCC BD18379EFV-M CIN Heat Sink Noisy ground line PG ND Quiet ground line PWM IREF AG ND 0 REX T 1 2 3 4 5 SDI CLK SDO LATCH to Controller Figure 1. Typical application diagram Product structureSilicon monolithic integrated circuit .www.rohm.co (c) m 2016 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product is not designed protection against radioactive rays 1/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Pin Configuration HTSSOP-B28 (TOP VIEW) AGND 1 28 PGND IREF 2 27 VCC ERR 3 26 SDO PWM0 4 25 PWM5 CH0 5 24 CH11 CH1 6 23 CH10 CH2 7 22 CH9 CH3 8 21 CH8 CH4 9 20 CH7 CH5 10 19 CH6 PWM1 11 18 SENSE PWM2 12 17 PWM4 SDI 13 16 PWM3 CLK 14 15 LATCH Heat Sink Bottom Side Figure 2. Pin Configuration Pin Description Pin No. Symbol Pin No. Symbol 1 AGND Analog ground terminal 28 PGND Power ground terminal 2 IREF Current setting terminal 27 VCC Power supply terminal 3 ERR Open drain fault indicator 26 SDO Serial data output terminal 4 PWM0 PWM 0 input terminal 25 PWM5 PWM 5 input terminal 5 CH0 Output channel 0 24 CH11 Output channel 11 6 CH1 Output channel 1 23 CH10 Output channel 10 7 CH2 Output channel 2 22 CH9 Output channel 9 8 CH3 Output channel 3 21 CH8 Output channel 8 9 CH4 Output channel 4 20 CH7 Output channel 7 10 CH5 Output channel 5 19 CH6 Output channel 6 11 PWM1 PWM 1 input terminal 18 SENSE LED supply sensing terminal 12 PWM2 PWM 2 input terminal 17 PWM4 PWM 4 input terminal 13 SDI Serial data input terminal 16 PWM3 PWM 3 input terminal 14 CLK Serial communication clock 15 LATCH Latch signal input terminal Function www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/25 Function TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Absolute Maximum Ratings Item Symbol Absolute Maximum value Unit VCC 7 V VDmax 10 V Input Voltage (Pin No: 4,11 to 17, 25) VIN -0.3 to VCC V Open Drain Fault Indicator(Pin No: 3) VERR 7 V Operating Temperature Range TOPR -40 to +105 C Storage Temperature Range TSTG -55 to +150 C Junction Temperature TJmax 150 C VSENSE 10 V ESD HBM 2000 V ESD MM 200 V PWM 100 % Power Supply Voltage(Pin No: 27) Output Voltage (Pin No: 5 to 9, 19 to 24) LED Voltage(Pin No: 18) Electrostatic-Discharge Capability Human Body Model Electrostatic-Discharge Capability Machine Model PWM duty cycle Recommended Operating Ratings Item Power Supply Voltage Drive Current at full brightness*1 Output Voltage*1 LED Voltage*1*3 Open Drain Fault Indicator PWM duty cycle*2 Symbol VCC ID VD VSENSE VERR PWM Min 3.0 9.66 0.2 Standard Value Typ 29.0 - Max 5.5 48.33 8 8 5.5 99.2 Unit V mA V V V % *1 Check Power de-rating curves of the package before applying maximum values. *2 99.2% max and 0.2% min duty cycle at a 200Hz PWM frequency is recommended in order to have complete diagnostic capability; please note that the PWM signal is active LOW. *3 Please make sure the VSENSE voltage is always connected to the LEDs supply voltage - at a higher potential than VD. (see also the I/O equivalent circuits) Thermal Information *4 Item Symbol Value Unit JA 107 C/W JT 6 C/W JA 26 C/W JT 3 C/W Junction to Case Thermal Resistance JC-TOP 13 C/W Junction to Case Thermal Resistance JC-BOT 4 C/W Junction to Ambient Thermal Resistance (1 layer Board) Junction to TOP Thermal characterization Parameter (1 layer Board) Junction to Ambient Thermal Resistance (4 layer Board) Junction to TOP Thermal characterization Parameter (4 layer Board) *4 Measured as per JEDEC Standard Board as per JESD51-3/-5/-7 Environment as per JESD51-2A The above mentioned data is measurement data to be used only as reference not guaranteed values. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Block Diagram Shift Register SDI CLK SDO Over Temperature 16 LATCH Weak LED Supply Control Logic ERR 48 PWM0-5 PWM Maping/ 6 SENSE LED Open/ Short Short to GND Pull up PWM Fault Detection CH0-11 12 VCC UVLO PWM 72 CAL BandGap IREF Diag/ Current Mirror Iref 12 Constant Current Driver x12 AGND IREF PGND Figure 3. Block diagram Description of Blocks Functionality Constant current driver The chip uses a constant current output driver with a provision for individual calibration per channel. The constant current ID is derived from referring an internal reference voltage over the external resistor R EXT. The resistor is chosen to set the reference current IREF. The global reference current, IREF, is mirrored into the channel current to generate a local reference. The output device is scaled to give 6 bit output range. = ( + ) where VREF is the reference voltage measured at the IREF pin. Output currents are timed by the assigned PWM input. The drivers have a low leakage current to keep the LED in firm OFF condition when the channel is inactive. Full Scale current setting example table: REXT IDmax 12k 48.33mA 20k 29.00mA 30k 19.33mA 60k 9.66mA Active pull up circuit A pull up current can be activated to avoid LED flicker during activated and deactivated state. This can be done by changing the corresponding bit in the EN_PULL_UP@ON and EN_PULL_UP@OFF registers. Please see also the description of the WRITE_EN_PULL_UP commands. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Protection circuitry and diagnostic o LED Short Detection A short event is detected when the voltage across the LED falls below the short detection threshold VSCth. The SHORT detection current which is flowing during LED active (PWM ="LOW"), will cause a typical output current offset of 20A. After a detected LED short event, the corresponding bit of the Gen_SHORT detection register and the ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by the controller. The SHORT detection is also performed, when the LED is not activated, using small sink currents for small time intervals (20us) to avoid LED flicker. In order for the detection to be available at non-activated LED state the PWM duty cycle must be <99.2% at a frequency of 200Hz. o LED Open Detection During an open event the output device will be fully ON, pulling V Dx low. An open event is detected when voltage VDx at the output pin falls below VOth. The OPEN detection current, I pulldown which is flowing during LED active (PWM = "LOW"), will cause a typical output current offset of 20A. After a LED open event has been detected the corresponding bit of the Gen_OPEN detection register and ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by the controller. The OPEN detection is also performed, when the LED is not activated, using small sink currents for small time intervals (20us) to avoid LED flicker. In order for the detection to be available at non-activated LED state the PWM duty cycle must be <99.2% at a frequency of 200Hz. Note: In order to distinguish between diagnostics (LED Short Detection and LED Open Detection) at ON and OFF, the corresponding detection must be enabled and corresponding state of the channel must be checked (enabled/disabled). o Short to Ground Detection The chip can perform output short to ground diagnosis during non-activated LED state. After LED short and open at channel off diagnosis, a short to ground can be also detected. In order for the detection to be available at non-activated LED state the PWM duty cycle must be <99.2% at a frequency of 200Hz. The diagnostic is activated or deactivated by the EN_SHORT_TO_GND register. After an output short to ground has been detected the corresponding bit of the SHORT_TO_GND detection register and ANY_SHORT_TO_GND_FLAG from the STATUS register remain high until cleared by the controller. Note: In case both the Open Detection and Short to GND Detection are active at the same time and the voltage VDx at the output pin falls below VSGth also the corresponding bit of the Gen_OPEN detection register and ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by the controller. EN_CHANNEL CHANNEL NOT ACTIVE CHANNEL ACTIVE PWM PWM ACTIVE PWM NOT ACTIVE Diagnostic SHORT/OPEN @ON PULL_UP@ON PULL_UP@OFF SHORT/ OPEN SHORT @OFF TO GND tdiag_off 20us Figure 4. Diagnostic diagram o IREF Fault Detection (Limp Home functionality) The chip can perform IREF short and open diagnostic on the external resistor. In case of an error the REXT_FAULT flag is set and latched and an internal current reference is used to set a typical output current of IREF_LH. If the fault condition is removed the chip can be reset to the normal operating state by a POR event. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M o PWM Fault Detection PWM fault diagnostic can be performed at startup to test for wire connectivity. The chip is initialized with a PWM fault condition that changes to PWM_OK immediately after the first falling edge on the PWM input(s). o UVLO Under Voltage LockOut By monitoring the Vcc pin an UVLO event can be detected. If Vcc is below UVLO_L then the chip is turned off. If the Vcc voltage increases over the UVLO_H threshold then the chip is turned back on. o Weak LED Supply Voltage Detection By monitoring VSENSE pin, a low LED supply voltage can be detected. After a Weak LED Supply voltage has been detected a corresponding one bit register flag is set and remains high until cleared by the controller. The detection has its own status bit and is mapped to Open Drain Fault Indicator. Note that this circuit is always active. A masking command that can be locked and read back is implemented. V Case I VLED VCC WLS detect POINT UVLO_L Lockout POINT UVLO_H realease POINT time V Case II VCC = VLED WLS detect POINT UVLO_H realease POINT UVLO_L Lockout POINT time Figure 5. Startup diagram Note: In Case II when the MASK_WLS will be activated a Weak LED Supply event will be signaled to the internal logic. This is because the detection circuit itself is not disabled by the MASK_WLS command but only the diagnostic is masked. o Open Drain Fault Indicator An emergency warning pin is available (ERR) to signal to the controller the most important faults of the system. The ERR output is activated (active="LOW") when a fault flag in the STATUS register or a flag in the UNLOCK register is set. The flags can be masked using the WRITE_EN_ERR_PIN command. The content of the EN_ERR_PIN register shows the flags that will activate the Open Drain Fault Indicator (ERR). The picture below shows the ERR pin functionality: ERR All STATUS and UNLOCK bits Figure 6. Open Drain fault indicator (ERR) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M o Over temperature TSD130C: When the die temperature exceeds 130C a warning flag is set and latched. The controller can take action to reduce power. A hysteresis of 10C is implemented from the point where the warning flag is set until the warning is released. The chip functionality is not changed. TSD180C: When the die temperature exceeds 180C, the driver disables the output currents. The logic remains functional and the controller is still able to read the status. This allows the controller to take action and avoid a repeated thermal shutdown. A hysteresis of 10C is implemented from the point where the warning flag is set until the warning is released. If the temperature drops below the hysteresis value then the device will resume its previously set functionality. POR (Power ON Reset) A POR event can occur in one of the following situations: 1. Low supply voltage at Startup or UVLO (Under Voltage LockOut). 2. When the controller sends a command SOFTWARE_POR (Software Reset) o POR at Startup or UVLO At startup, which is defined here as first application of supply voltage VCC, or when VCC recovers from an under voltage event, a POR will occur. The ERR pin will be set to LOW and the POR_FLAG is set HIGH. All registers are set to default values. o POR SWR (SPOR) The controller can send a reset command SOFTWARE_POR. The POR flag in the STATUS register is set HIGH. All registers are set to default values. The ERR pin will be set LOW. Description of Commands Command [WRITE_PWM_MAPx] is used to assign for each channel output one single PWM input. Command [READ_PWM_MAPx] is used to read back the data and ensure it was received correctly. Command [WRITE_CALx] is used to set the calibration of each output during operation. Command [READ_CALx] is used to read back the data and ensure it was received correctly. Command [WRITE_EN_CHANNEL] is used to enable/disable the output channels. Command [READ_EN_CHANNEL] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_SHORT@ON] is used to enable/disable the short detection at channel on. Command [READ_EN_SHORT@ON] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_OPEN@ON] is used to enable/disable the open detection at channel on. Command [READ_EN_OPEN@ON] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_SHORT@OFF] is used to enable/disable the short detection at channel off. Command [READ_EN_SHORT@OFF] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_OPEN@OFF] is used to enable/disable the open detection at channel off. Command [READ_EN_OPEN@OFF] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_SHORT_TO_GND] is used to enable/disable the short to ground fault detection. Command [READ_EN_SHORT_TO_GND] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_PULL_UP@ON] is used to enable/disable the pull up current at channel on. Command [READ_EN_PULL_UP@ON] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_PULL_UP@OFF] is used to enable/disable the pull up current at channel off. Command [READ_EN_PULL_UP@OFF] is used to read back the data to ensure it was received correctly. Command [WRITE_EN_ERR] is used to enable/disable the bits that activate the emergency warning pin. Command [READ_EN_ERR] is used to read back the data to ensure it was received correctly. Command [WRITE_MASK_WLS] is used to mask/unmask the weak LED supply detection. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Command [READ_MASK_WLS] is used to read back data to ensure it was received correctly. Command [WRITE_LOCK] is used to lock the important registers. Command [WRITE_UNLOCK] is used to unlock the important registers. Command [READ_UNLOCK] is used to read back the data to ensure it was received correctly. Command [RESET_STATUS] can reset all bits in the STATUS register except for the REXT_FAULT_FLAG, based on command parameters, and resets the PWM_OK register (see RESET_STATUS command description). Command [READ_STATUS] is used to access all bits in the STATUS register. Command [SOFTWARE_POR] resets the chip and sets all registers to default values. POR_FLAG is set HIGH. Command [READ_PWM_OK] is used to read the PWM detection. Command [READ_Gen_SHORT] is used to read the LED short detection. Command [READ_Gen_OPEN] is used to read the LED open detection. Command [READ_SHORT_TO_GND] is used to read the short to ground detection. WRITE_PWM_MAP command & READ_PWM_MAP command: Register Name Address PWM_MAPk 40 to 45 b7 b6 b5 b4 b3 b2 b1 b0 PWM_MAPk 80 to 85 b7 b6 b5 b4 b3 b2 b1 b0 o Code: 8bit CMD (for all channels) PWM0 PWM1 PWM2 PWM3 PWM4 PWM5 PWM0 Default for invalid data Comments Assign CH2k+1 and CH2k to PWMx, k=0 to 5 Read CH2k+1 and CH2k to PWMx, k=0 to 5 Data<7:4>or<3:0> 0000 0001 0010 0011 0100 0101 0110 to 1111 WRITE_CALx command & READ_CALx command (where x = 0 to 11): Register Name CALx CALx o Data Code<7:0> Address 48 to 53 88 to 93 x u x u Data Code<7:0> b5 b4 b3 b2 b5 b4 b3 b2 b1 b1 b0 b0 Comments Write calibration setting of CH0 to CH11 Read calibration setting of CH0 to CH11 Code: 1=enable Cal bit 0=disable Cal bit x=don't care u=unchanged WRITE_EN_CHANNEL command & READ_EN_CHANNEL command: Register Name EN_CHANNEL EN_CHANNEL Address 56 57 x x x x Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b0 b6 Comments Enable Channel CH5 to CH0 Enable Channel CH11 to CH6 EN_CHANNEL 96 u u b5 b3 b2 b1 b0 Read Enable Channel CH5 to CH0 EN_CHANNEL 97 u u b11 b10 b9 b8 b7 b6 Read Enable Channel CH11 to CH6 o b4 Code: 1=enable Channel 0=disable Channel x=don't care u=unchanged www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M WRITE_EN_SHORT@ON command & READ_EN_SHORT@ON: Register Name EN_SHORT@ON EN_SHORT@ON EN_SHORT@ON EN_SHORT@ON o Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b1 b7 b0 b6 b0 b6 Comments Enable Short@on CH5 to CH0 Enable Short@on CH11 to CH6 Read Enable Short@on CH5 to CH0 Read Enable Short@on CH11 to CH6 Register Name EN_OPEN@ON EN_OPEN@ON Address 5A 5B x x x x Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b0 b6 Comments Enable Open@on CH5 to CH0 Enable Open@on CH11 to CH6 EN_OPEN@ON 9A u u b5 b3 b2 b1 b0 Read Enable Open@on CH5 to CH0 EN_OPEN@ON 9B u u b11 b10 b9 b8 b7 b6 Read Enable Open@on CH11 to CH6 b4 Code: 1=enable Open 0=disable Open x=don't care u=unchanged WRITE_EN_SHORT@OFF command & READ_EN_SHORT@OFF command: o Address 5C 5D 9C 9D x x u u x x u u Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b1 b7 b0 b6 b0 b6 Comments Enable Short@off CH5 to CH0 Enable Short@off CH11 to CH6 Read Enable Short@off CH5 to CH0 Read Enable Short@off CH11 to CH6 Code: 1=enable Short 0=disable Short x=don't care u=unchanged WRITE_EN_OPEN@OFF command & READ_EN_OPEN@OFF command: Register Name Address EN_OPEN@OFF 5E EN_OPEN@OFF 5F EN_OPEN@OFF 9E EN_OPEN@OFF 9F o Code: 1=enable Open 0=disable Open x=don't care u=unchanged x x u u Code: 1=enable Short 0=disable Short x=don't care u=unchanged Register Name EN_SHORT@OFF EN_SHORT@OFF EN_SHORT@OFF EN_SHORT@OFF x x u u WRITE_EN_OPEN@ON command & READ_EN_OPEN@ON command: o Address 58 59 98 99 x x u u x x u u Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b1 b7 b0 b6 b0 b6 Comments Enable Open@off CH5 to CH0 Enable Open@off CH11 to CH6 Read Enable Open@off CH5 to CH0 Read Enable Open@off CH11 to CH6 WRITE_EN_SHORT_TO_GND command & READ_EN_SHORT_TO_GND command: Register Name EN_SHORT_TO_ GND EN_SHORT_TO_ GND EN_SHORT_TO_ GND EN_SHORT_TO_ GND Address Data Code<7:0> 60 x x b5 b3 b2 b1 b0 Enable Short to gnd CH5 to CH0 61 x x b11 b10 b9 b8 b7 b6 Enable Short to gnd CH11 to CH6 A0 u u b5 b3 b2 b1 b0 Read Enable Short to gnd CH5 to CH0 A1 u u b11 b10 b9 b8 b7 b6 Read Enable Short to gnd CH11 to CH6 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 b4 Comments b4 9/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M o Code: 1=enable Short to ground 0=disable Short to ground x=don't care u=unchanged WRITE_EN_PULL_UP@ON command & READ_EN_PULL_UP@ON command: Register Name Address EN_PULL_UP@ON 62 EN_PULL_UP@ON 63 EN_PULL_UP@ON A2 EN_PULL_UP@ON A3 o Code: 1=enable pull up 0=disable pull up x=don't care u=unchanged x x u u Data Code<7:0> b5 b4 b3 b2 b11 b10 b9 b8 b5 b4 b3 b2 b11 b10 b9 b8 b1 b7 b1 b7 Data Code<7:0> Comments Enable pull up@on CH5 to CH0 Enable pull up@on CH11 to CH6 Read Enable pull up@on CH5 to CH0 Read Enable pull up@on CH11 to CH6 b4 Comments x x b5 b3 b2 b1 b0 Enable pull up@off CH5 to CH0 x x b11 b10 b9 b8 b7 b6 Enable pull up@off CH11 to CH6 u u b5 b3 b2 b1 b0 Read Enable pull up@off CH5 to CH0 u u b11 b10 b9 b8 b7 b6 Read Enable pull up@off CH11 to CH6 b4 WRITE_EN_ERR_PIN command & READ_EN_ERR_PIN command: Register Name Address Data Code<7:0> EN_ERR_PIN 66 x s6 s5 s4 s3 s2 s1 EN_ERR_PIN 67 x x x u4 u3 u2 u1 EN_ERR_PIN A6 u s6 s5 s4 s3 s2 s1 EN_ERR_PIN A7 u u u u4 u3 u2 u1 o Code: 1=enable 0=disable x= don't care u=unchanged (see also STATUS/UNLOCK Register Flag Description) b0 b6 b0 b6 WRITE_EN_PULL_UP@OFF command & READ_PULL_UP@OFF command: Register Name Address EN_PULL_UP@ 64 OFF EN_PULL_UP@ 65 OFF EN_PULL_UP@ A4 OFF EN_PULL_UP@ A5 OFF o Code: 1=enable pull up 0=disable pull up x=don't care u=unchanged x x u u s0 u0 s0 u0 Comments En ERR pin for status bit6 to bit0 En ERR pin for unlock bit4 to bit0 Read En ERR pin for status bit6 to bit0 Read En ERR pin for unlock bit4 to bit0 WRITE_MASK_WLS command: Register Name Address Data Code<7:0> Comments MASK_WLS 68 x x x x x x b1 b0 Make the WLS detection visible o Code: 01=enable detection 10=disable detection 00=don't touch 11=don't touch x=don't care (Note: b1 and b2 are used as code to change the 1bit MASK_WLS register) READ_MASK_WLS command: Register Name Address Data Code<7:0> Comments MASK_WLS AB u u u u u u u b0 Read Make the WLS detection visible o Code: www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M 1=visible 0=not visible u=unchanged WRITE_LOCK command: Register Name UNLOCK x x x EN_ERR Data Code<7:0> PWM_MAP EN_CH CAL Comments Lock All DIAG o Code: default "11111"=unlocked 1=lock 0=don't touch x=don't care o o o o o EN_ERR locks EN_ERR_PIN register CAL locks CALx registers EN_CH locks EN_CHANNEL register PWM MAP locks PWM_MAPx registers All DIAG locks EN_SHORT@ON, EN_OPEN@ON, EN_SHORT@OFF, EN_OPEN@OFF, EN_SHORT_TO_GND, EN_PULL_UP@ON, EN_PULL_UP@OFF, EN_WLS registers WRITE_UNLOCK command & READ_UNLOCK command: Register Name UNLOCK UNLOCK o o o o o o Address 69 Address 6A A9 x x u u x u EN_ERR EN_ERR Data Code<7:0> PWM_MAP EN_CH PWM_MAP EN_CH CAL CAL All DIAG All DIAG Comments unlock reg. Read Unlock Code for write: Code for read: default "11111"=unlocked 1=unlock 1=unlocked 0=don't touch 0=locked x=don't care u=unchanged EN_ERR unlocks EN_ERR_PIN register CAL unlocks CALx registers EN_CH unlocks EN_CHANNEL register PWM MAP unlocks PWM_MAPx registers All DIAG unlocks EN_SHORT@ON, EN_OPEN@ON, EN_SHORT@OFF, EN_OPEN@OFF, EN_SHORT_TO_GND, EN_PULL_UP@ON, EN_PULL_UP@OFF, EN_WLS registers RESET_STATUS command: Register Name RESET_STATUS Address 6B x x Data Code<7:0> ANY SHORT WLS PWM_OK OPEN SHORT to GND Comments TSD POR Clear status flags Code: 1=reset 0=don't touch x=don't care (Note1: TSD clears bot TSD130 and TSD180 flags) (Note2: After clearing the flags with the RESET_STATUS command the registers will immediately reflect the actual status) o SOFTWARE_POR command: Register Name SOFTWARE_POR Address 6C Data Code<7:0> 1 0 1 0 0 0 0 1 Comments Resets all registers and sets POR flag HIGH Default Register setting: Register Default values after POR CALIBRATION<5:0> (of all channels) <000000> www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/25 Comments Set all currents to min value TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M PWM_MAP<3:0> (of all channels) <0000> all channels assigned to PWM0 Assign all channels to PWM0 Gen_OPEN <11:0> <000000000000> Default: no fault. Gen_SHORT <11:0> SHORT_TO_GND <11:0> PWM_OK <5:0> <000000000000> <000000000000> <000000> Default: no fault. Default: no fault. Default: fault EN_CHANNEL<11:0> <000000000000> All channels off EN_OPEN@ON<11:0> <000000000000> Open @ on de-activated for all channels EN_SHORT@ON<11:0> <000000000000> Short @ on de-activated for all channels EN_OPEN@OFF<11:0> <000000000000> Open @ off de-activated for all channels EN_SHORT@OFF<11:0> <000000000000> Short @ off de- activated for all channels EN_SHORT_TO_GND <11:0> <000000000000> Short to ground detection de-activated EN_PULL_UP@ON<11:0> <000000000000> All pull-ups de-activated EN_PULL_UP@OFF<11:0> <000000000000> All pull-ups de-activated EN_ERR_PIN <11:0> <111111111111> All warnings activated UNLOCK<4:0> <11111> All groups unlocked MASK_WLS <0> Default: Detection is not visible STATUS<6:0> <0000001> Default: POR detected STATUS / UNLOCK Register Flag Description: NAME POR_FLAG TSD130_FLAG TSD180_FLAG WLS_FAULT_FLAG REXT_FAULT_FLAG ANY_SHORT_OPEN_FLAG STATUS 0 1 2 3 4 5 Default <1> <0> <0> <0> <0> <0> ANY_SHORT_TO_GND_FLAG 6 <0> Comment POR flag (1 = POR detected) Die temperature >130C (1 = over temp) Die temperature >180C (1 = over temp) Weak LED Supply (1 = below threshold) Fault on external reference resistor (1 = out of range) At least one short/open detected at any output (1 = short/open detected) Short to GND(1=short to ground detected) NAME DIAG_UNLOCK_FLAG CAL_UNLOCK_FLAG CH_EN_UNLOCK_FLAG PWM_MAP_UNLOCK_FLAG EN_ERR_PIN_UNLOCK_ FLAG UNLOCK 0 1 2 3 4 Default <1> <1> <1> <1> <1> Comment DIAG UNLOCK (1 = unlocked) CALIBRATION UNLOCK (1 =unlocked) Channel Enable UNLOCK (1 = unlocked) PWM MAP UNLOCK (1 = unlocked) ERR PIN enable UNLOCK (1=unlocked) {POR_FLAG} indicates that a POR event has happen (UVLO or Software POR). {TSD130_FLAG} indicates the junction temperature is higher than 130C. {TSD180_FLAG} indicates the junction temperature is higher than 180C. {WLS_FAULT_FLAG} indicates a LED supply voltage less than normal. {REXT_FAULT_FLAG} indicates either an open or short fault event at the IREF pin. {ANY_SHORT_OPEN_FLAG} indicates that at least one output channel has detected a short/open event and represents the result of a wired-OR function from Gen SHORT detection, Gen OPEN detection registers content. {ANY_SHORT_TO_GND_FLAG} indicates that at least one output channel has detected a short to ground event and represents the result of a wired-OR function from SHORT_TO_GND detection registers content. {DIAG_UNLOCK_FLAG} indicates that the enabling of the diagnostics has been locked/unlocked. {CAL_UNLOCK_FLAG} indicates that channel calibration settings have been locked/unlocked. {CH_EN_UNLOCK_FLAG} indicates that channel enabling settings have been locked/unlocked. {PWM_MAP_UNLOCK_FLAG} indicates that PWM _MAP settings have been locked/unlocked. {EN_ERR_PIN_UNLOCK_FLAG} indicates that the error pin warning settings have been locked/unlocked. Note: All flags in the STATUS register are asynchronous events. After clearing the flags with the RESET_STATUS command the registers will immediately reflect the actual status. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Electrical Characteristic(s) (Unless otherwise specified, Ta=-40~+105C VCC=3.0~5.5V) Symbol IDx(Temp) Output current *8 temperature shift Output current supply voltage shift 0 - 3.2 0 - 0.5 IDx(Vcc) Unit - 0.5 - - 0.1 - - 0.75 - - 0.51 % % IDLeak Minimum output voltage level VDmin Rising time of ID ST1 0.3 0.5 1.2 us Falling time of ID ST2 0.2 0.5 1.2 us RT -1 0 1 us DT - 0.26 1 us *4 Delay time PWM to ID *1 (%) = *2 (%) = - - *3 (%) = - , where = VCC = 3.3V REXT = 20K A/C Output leakage Current Ton error Ta = 25C VCC = 3.3V REXT = 60K Ta = 25C VCC = 3.3V REXT = 20K Ta = 25C VCC = 3.3V REXT = 12K Ta = 25C VCC = 3.3V REXT = 60K Ta = 25C VCC = 3.3V REXT = 20K Ta = 25C VCC = 3.3V REXT = 12K Ta = 25C VCC = 3.3V REXT = 60K Ta = 25C VCC = 3.3V REXT = 20K Ta = 25C VCC = 3.3V REXT = 12K % mA/V 0 Conditions uA V VSENSE=5V Measured across a 82ohm load resistor Standard Value Min Typ Max [Output D0~D11] (Pin No: 5 to 10, 19 to 24) 15 14 16 5 IDxA Output current accuracy, 3.5 *1 Channel to Channel 6 6 7 7 8 8 8 3 IAN Output current accuracy 2.5 *2 Average to Nominal 3.5 4 4 4 16 15 17 5 I Output current accuracy DxN 4 *3 Channel to Nominal 7 7 8 8 Item Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Cal 42 Cal 20 Cal 63 Ta = 25C VCC=3.0-3.6V Cal 63 REXT = 20K Ta = 25C VCC=4.5-5.5V Cal 63 REXT = 20K VD = VSENSE =8V Ta=25C ID drops to VCC=3.3V Cal 80%IDmax, 63 VCC=5V REXT = 20K From 10% to 90% of IDmax, REXT = 20K From 90% to 10% of IDmax, REXT = 20K Measured at 50% of IDmax, REXT = 20K From PWM0=10% of VCC to ID=10% of ID max (rising edge), REXT = 20K Cal 63 Cal 63 Cal 63 Cal 63 ++ , this represents Device to Device accuracy *4 between pulse width of ID relative to the pulse width of PWM, this item represents PWM duty cycle Linearity(%) = || www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M [Logic input] (Pin No: 4, 11 to 17, 25) *9 High going threshold voltage Low going threshold voltage VTH Hysteresis width VHYS - 0.1 x VCC - V Pull up resistance Rpullup 100 200 300 k fCLK - - 1250 kHz Output Voltage high VOH 0.9 x VCC Output voltage Low VOL 0 0.95 x VCC 0.05 x VCC 1x VCC 0.1 x VCC IODH_leak - - VODL - Circuit Current ICC Under voltage lockout Under voltage release SHORT detection Threshold Diag. detection pull down current SHORT_to_GND pull-up current *5*8 Serial clock frequency [Logic output] (Pin No: 26) VTL 0.35 x VCC 0.25 x VCC - 0.45 x VCC 0.35 x VCC V V Only for Pins:4,11,12,16, 17, 25 V ISDO = -4mA V ISDO = 4mA 0.2 uA VCC = 3.3V - 0.1x VCC V IOD = 4mA VCC = 3.3V - 4 7.5 mA UVLO_L UVLO_H 2.2 2.4 2.5 2.7 2.8 3.0 V V VSCth 0.6 - 1.0 V Ipulldown 14 20 30 uA Measured at Channel OFF Ipullup 14 20 30 uA Measured at Channel OFF tglitch_reject - - 7.5 us tON 8 - - us LED Short/Open detection window tdiag_off 12 20 31 us OPEN detection threshold VOth 100 - 330 mV SHORT_to_GND detection threshold VSGth 100 - 330 mV VWLSth_L 4.0 4.15 4.3 V Measured at VSENSE Ishort Iopen 120 2 - 180 16 uA uA IREF Limp Home IREF_LH 6 10 16 mA Reference Voltage VREF 1.13 1.16 1.19 V Measured at IREF pin Measured at IREF pin Measured at Output in case of short or open at IREF pin REXT = 20k connected to IREF pin TMON -15 - 15 % At 130C and 180C Thyst ISENSE 7 - 10 18 13 - C uA At 130C and 180C VSENSE=5V [Open Drain] (Pin No: 3) HIGH LEVEL Output Leakage Current LOW LEVEL Output Voltage [DEVICE] Minimum glitch Reject ON Time *6*7 Weak LED Supply detection threshold IREF short threshold IREF open threshold Temperature monitoring *8 accuracy *8 Temperature hysteresis SENSE pin input current Pin 3 = OPEN Pin 26 = OPEN REXT = 20K Falling VCC Rising VCC Measured across LED VSENSE=5V For OPEN / SHORT detection Minimum requirement for OPEN/SHORT detection. At Channel OFF and PWMY="HIGH" Measured from Output to AGND, VSENSE=5V At Channel OFF and PWMY="HIGH", VSENSE=5V *5 An OPEN or SHORT that lasts for less than this time will be rejected. *6 Please note that the PWM signal is active LOW therefore, the tON time denotes the period when the signal is at LOW level. *7 This period is derived from a PWM frequency of 200Hz and a minimum duty cycle of 0.2%. *8 Guaranteed by design. *9 The input circuitry operates as a Schmitt trigger and the operation is not affected by the rise and fall times of the input signals. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Typical Performance Curve(s) 4,9 1,22 1,22 4,7 Reference Voltage VIREF [V] Circuit Current Icc [mA] 1,21 4,5 1,21 1,20 4,3 1,20 4,1 1,19 3,9 1,19 Temp= 25C Temp = 25C 1,18 Temp= - 40C 3,7 Temp = -40C 1,18 Temp= 125C Temp= 125C 3,5 1,17 2 3 4 5 6 2 3 Supply voltage Vcc [V] 5 6 Supply Voltage Vcc [V] Figure 7. Circuit current vs. supply voltage Figure 8. Ref voltage vs. supply voltage 60 20% 15% 50 10% Vcc=3.3V 40 Linearity [%] Output Curret ID [mA] 4 30 5% 0% 0,1 1,0 10,0 100,0 -5% 20 Temp = 25C 10 -10% Temp = - 40C -15% Temp = 125C Temp = 25 C Temp = -40C Temp = 125C 0 -20% 0 0,2 0,4 0,6 0,8 1 1,2 PWM Duty Cycle Log[%] Output Voltage VD[V] Figure 9. Output current vs. output voltage www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 10. Output current linearity(RT) vs. PWM 15/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M SPI Timing Chart Figure 11. Write/access data for typical use case Figure 12. SPI timing diagram SPI TIMING RULE (Ta=-40~+105C VCC=3.0~5.5V) Parameter Symbol Min Max Unit CLK period TCK 800 - ns CLK high pulse width TCKH 300 - ns CLK low pulse width TCKL 300 - ns SERIN high and low pulse width TSEW 780 - ns SERIN setup time prior to CLK rise TSEST 150 - ns SERIN hold time after CLK rise TSEHD 150 - ns LATCH high pulse time TLAH 380 - ns LAST CLK rise to LATCH rise TLADZ 200 - ns SEROUT propagation delay time (L->H) TDSOH 250 ns SEROUT propagation delay time (H->L) TDSOL 250 ns The timings are valid for a 1.25MHz clock signal. The input High Going threshold voltage (V TH) is 0.4 VCC on the rising edge and (VTH) 0.3 VCC on the falling edge for all digital pins. See electrical characteristics. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M SPI Communication The serial port is used to write data, read diagnostic status and configure settings of the chip by transferring the input data to the desired address. During normal operation an 8-bit serial address and 8-bit serial data is written into the 16-bit shift register. The clock idle state is zero and the data on the SDI and SDO lines must be stable while the clock is high and can be changed when the clock is low. The data is sampled by on the clock's rising edge and propagated on the clock's falling edge, converting the 16 most recent inputs to parallel signals on the LATCH rising edge. At the rising edge on the LATCH input addresses are interpreted by a decoder which controls data transfer between shift and storage registers. Depending on the address, valid data is conveyed from or to the appropriate latch or a command is interpreted. When a read address is latched data is read out from a storage register and shifted out of SDO to the microcontroller or daisy chained chips. Since for each address the chip shifts out a fixed amount of data at the end of a write/read cycle it is possible to send different address codes to each IC in a daisy chain. During the exchange of information the LED outputs do not flicker or dim. Command Set Address IN<15:8> HEX 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F Data IN <7:0> d7 PWM_MAP01<3> PWM_MAP03<3> PWM_MAP05<3> PWM_MAP07<3> PWM_MAP09<3> PWM_MAP11<3> Not USED Not USED X X X X X X X X X X X X Not USED Not USED X X X X X X X X X X X X X X X X X X X X X X 1 Not USED Not USED Not USED d6 d5 PWM_MAP01<2> PWM_MAP01<1> PWM_MAP03<2> PWM_MAP03<1> PWM_MAP05<2> PWM_MAP05<1> PWM_MAP07<2> PWM_MAP07<1> PWM_MAP09<2> PWM_MAP09<1> PWM_MAP11<2> PWM_MAP11<1> Not USED Not USED Not USED Not USED X CAL0<5> X CAL1<5> X CAL2<5> X CAL3<5> X CAL4<5> X CAL5<5> X CAL6<5> X CAL7<5> X CAL8<5> X CAL9<5> X CAL10<5> X CAL11<5> Not USED Not USED Not USED Not USED X EN_CHANNEL<5> X EN_CHANNEL<11> X EN_SHORT@ON<5> X EN_SHORT@ON<11> X EN_OPEN@ON<5> X EN_OPEN@ON<11> X EN_SHORT@OFF<5> X EN_SHORT@OFF<11> X EN_OPEN@OFF<5> X EN_OPEN@OFF<11> X EN_SHORT_TO_GND<5> X EN_SHORT_TO_GND<11> X EN_PULL_UP@ON<5> X EN_PULL_UP@ON<11> X EN_PULL_UP@OFF<5> X EN_PULL_UP@OFF<11> s<6> s<5> X X X X X X X X X RST_ANY_SHRT_GND<5> 0 1 Not USED Not USED Not USED Not USED Not USED Not USED d4 PWM_MAP01<0> PWM_MAP03<0> PWM_MAP05<0> PWM_MAP07<0> PWM_MAP09<0> PWM_MAP11<0> Not USED Not USED CAL0<4> CAL1<4> CAL2<4> CAL3<4> CAL4<4> CAL5<4> CAL6<4> CAL7<4> CAL8<4> CAL9<4> CAL10<4> CAL11<4> Not USED Not USED EN_CHANNEL<4> EN_CHANNEL<10> EN_SHORT@ON<4> EN_SHORT@ON<10> EN_OPEN@ON<4> Comments d3 PWM_MAP00<3> PWM_MAP02<3> PWM_MAP04<3> PWM_MAP06<3> PWM_MAP08<3> PWM_MAP10<3> Not USED Not USED CAL0<3> CAL1<3> CAL2<3> CAL3<3> CAL4<3> CAL5<3> CAL6<3> CAL7<3> CAL8<3> CAL9<3> CAL10<3> CAL11<3> Not USED Not USED EN_CHANNEL<3> EN_CHANNEL<9> EN_SHORT@ON<3> EN_SHORT@ON<9> d2 PWM_MAP00<2> PWM_MAP02<2> PWM_MAP04<2> PWM_MAP06<2> PWM_MAP08<2> PWM_MAP10<2> Not USED Not USED CAL0<2> CAL1<2> CAL2<2> CAL3<2> CAL4<2> CAL5<2> CAL6<2> CAL7<2> CAL8<2> CAL9<2> CAL10<2> CAL11<2> Not USED Not USED EN_CHANNEL<2> EN_CHANNEL<8> EN_SHORT@ON<2> EN_SHORT@ON<8> d1 PWM_MAP00<1> PWM_MAP02<1> PWM_MAP04<1> PWM_MAP06<1> PWM_MAP08<1> PWM_MAP10<1> Not USED Not USED CAL0<1> CAL1<1> CAL2<1> CAL3<1> CAL4<1> CAL5<1> CAL6<1> CAL7<1> CAL8<1> CAL9<1> CAL10<1> CAL11<1> Not USED Not USED EN_CHANNEL<1> EN_CHANNEL<7> EN_SHORT@ON<1> EN_SHORT@ON<7> d0 PWM_MAP00<0> PWM_MAP02<0> PWM_MAP04<0> PWM_MAP06<0> PWM_MAP08<0> PWM_MAP10<0> Not USED Not USED CAL0<0> CAL1<0> CAL2<0> CAL3<0> CAL4<0> CAL5<0> CAL6<0> CAL7<0> CAL8<0> CAL9<0> CAL10<0> CAL11<0> Not USED Not USED EN_CHANNEL<0> EN_CHANNEL<6> EN_SHORT@ON<0> EN_SHORT@ON<6> EN_OPEN@ON<10> EN_SHORT@OFF<4> EN_SHORT@OFF<10> EN_OPEN@OFF<4> EN_OPEN@OFF<10> EN_OPEN@ON<3> EN_OPEN@ON<9> EN_SHORT@OFF<3> EN_SHORT@OFF<9> EN_OPEN@OFF<3> EN_OPEN@OFF<9> EN_OPEN@ON<2> EN_OPEN@ON<8> EN_SHORT@OFF<2> EN_SHORT@OFF<8> EN_OPEN@OFF<2> EN_OPEN@OFF<8> EN_OPEN@ON<1> EN_OPEN@ON<7> EN_SHORT@OFF<1> EN_SHORT@OFF<7> EN_OPEN@OFF<1> EN_OPEN@OFF<7> EN_OPEN@ON<0> EN_OPEN@ON<6> EN_SHORT@OFF<0> EN_SHORT@OFF<6> EN_OPEN@OFF<0> EN_OPEN@OFF<6> EN_SHORT_TO_GND<4> EN_SHORT_TO_GND<10> EN_SHORT_TO_GND<3> EN_SHORT_TO_GND<2> EN_SHORT_TO_GND<1> EN_SHORT_TO_GND<0> EN_SHORT_TO_GND<9> EN_SHORT_TO_GND<8> EN_SHORT_TO_GND<7> EN_SHORT_TO_GND<6> EN_PULL_UP@ON<4> EN_PULL_UP@ON<10> EN_PULL_UP@OFF<4> EN_PULL_UP@OFF<10> EN_PULL_UP@ON<3> EN_PULL_UP@ON<9> EN_PULL_UP@OFF<3> EN_PULL_UP@OFF<9> EN_PULL_UP@ON<2> EN_PULL_UP@ON<8> EN_PULL_UP@OFF<2> EN_PULL_UP@OFF<8> EN_PULL_UP@ON<1> EN_PULL_UP@ON<7> EN_PULL_UP@OFF<1> EN_PULL_UP@OFF<7> EN_PULL_UP@ON<0> EN_PULL_UP@ON<6> EN_PULL_UP@OFF<0> EN_PULL_UP@OFF<6> s<4> u<4> X EN_ERR_PIN_LOCK<4> EN_ERR_PIN_UNLOCK<4> RST_ANY_SHRT_OPEN<4> 0 Not USED Not USED Not USED s<3> u<3> X MAP_LOCK<3> MAP_UNLOCK<3> RST_WLS<3> 0 Not USED Not USED Not USED s<2> u<2> X CH_EN_LOCK<2> CH_EN_UNLOCK<2> RST_PWM_OK<2> 0 Not USED Not USED Not USED s<1> u<1> MASK_WLS<1> CAL_LOCK<1> CAL_UNLOCK<1> RST_TSD<1> 0 Not USED Not USED Not USED s<0> u<0> MASK_WLS<0> DIAG_LOCK<0> DIAG_UNLOCK<0> RST_POR<0> 1 Not USED Not USED Not USED Configures Output Ch1&Ch0 to PWMy Configures Output Ch3&Ch2 to PWMy Configures Output Ch5&Ch4 to PWMy Configures Output Ch7&Ch6 to PWMy Configures Output Ch9&Ch8 to PWMy Configures Output Ch11&Ch10 to PWMy Not USED Not USED Current configuration Ch0 Current configuration Ch1 Current configuration Ch2 Current configuration Ch3 Current configuration Ch4 Current configuration Ch5 Current configuration Ch6 Current configuration Ch7 Current configuration Ch8 Current configuration Ch9 Current configuration Ch10 Current configuration Ch11 Not USED Not USED Configure enable channel register for Ch 5 to Ch0 Configure enable channel register for Ch 11 to Ch6 Configure enable short for activated Ch5 to Ch0 Configure enable short for activated Ch11 to Ch6 Configure enable open for activated Ch5 to Ch0 Configure enable open for activated Ch11 to Ch6 Configure enable short for unactivated Ch5 to Ch0 Configure enable short for unactivated Ch11 to Ch6 Configure enable open for unactivated Ch5 to Ch0 Configure enable open for unactivated Ch11 to Ch6 Enable short to GND for Ch5 to Ch0 Enable short to GND for Ch11 to Ch6 Enable pull up @ ON for Ch5 to Ch0 Enable pull up @ ON for Ch11 to Ch6 Enable pull up @ OFF for Ch5 to Ch0 Enable pull up @ OFF for Ch11 to Ch6 Enable ERR PIN for STATUS bit6 to bit0 Enable ERR PIN for UNLOCK bit4 to bit0 Mask WLS detection LOCK UNLOCK Clear STATUS register flags Software reset (reset all and set POR flag) Not USED Not USED Not USED X= don't care www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Adress OUT <15:8> HEX 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 d7 PWM_MAP01<3> PWM_MAP03<3> PWM_MAP05<3> PWM_MAP07<3> PWM_MAP09<3> PWM_MAP11<3> Not USED Not USED U U U U U U U U U U U U Not USED Not USED U U U U U U U U U U U U U U U U U U U U U U U U U U U U Not USED Not USED Not USED d6 PWM_MAP01<2> PWM_MAP03<2> PWM_MAP05<2> PWM_MAP07<2> PWM_MAP09<2> PWM_MAP11<2> Not USED Not USED U U U U U U U U U U U U Not USED Not USED U U U U U U U U U U U U U U U U s<6> U AnyShortGND<6> U U U U U U U U U Not USED Not USED Not USED d5 PWM_MAP01<1> PWM_MAP03<1> PWM_MAP05<1> PWM_MAP07<1> PWM_MAP09<1> PWM_MAP11<1> Not USED Not USED CAL0<5> CAL1<5> CAL2<5> CAL3<5> CAL4<5> CAL5<5> CAL6<5> CAL7<5> CAL8<5> CAL9<5> CAL10<5> CAL11<5> Not USED Not USED EN_CHANNEL<5> EN_CHANNEL<11> EN_SHORT@ON<5> EN_SHORT@ON<11> EN_OPEN@ON<5> EN_OPEN@ON<11> EN_SHORT@OFF<5> EN_SHORT@OFF<11> EN_OPEN@OFF<5> EN_OPEN@OFF<11> EN_SHORT_TO_GND<5> EN_SHORT_TO_GND<11> EN_PULL_UP@ON<5> EN_PULL_UP@ON<11> EN_PULL_UP@OFF<5> EN_PULL_UP@OFF<11> s<5> U AnyShortOpen<5> U PWM_OK<5> U Gen_SHORT<5> Gen_SHORT<11> Gen_OPEN<5> Gen_OPEN<11> SHORT_TO_GND<5> SHORT_TO_GND<11> Not USED Not USED Not USED d4 PWM_MAP01<0> PWM_MAP03<0> PWM_MAP05<0> PWM_MAP07<0> PWM_MAP09<0> PWM_MAP11<0> Not USED Not USED CAL0<4> CAL1<4> CAL2<4> CAL3<4> CAL4<4> CAL5<4> CAL6<4> CAL7<4> CAL8<4> CAL9<4> CAL10<4> CAL11<4> Not USED Not USED EN_CHANNEL<4> EN_CHANNEL<10> EN_SHORT@ON<4> EN_SHORT@ON<10> EN_OPEN@ON<4> EN_OPEN@ON<10> EN_SHORT@OFF<4> EN_SHORT@OFF<10> EN_OPEN@OFF<4> EN_OPEN@OFF<10> Data OUT <7:0> d3 PWM_MAP00<3> PWM_MAP02<3> PWM_MAP04<3> PWM_MAP06<3> PWM_MAP08<3> PWM_MAP10<3> Not USED Not USED CAL0<3> CAL1<3> CAL2<3> CAL3<3> CAL4<3> CAL5<3> CAL6<3> CAL7<3> CAL8<3> CAL9<3> CAL10<3> CAL11<3> Not USED Not USED EN_CHANNEL<3> EN_CHANNEL<9> EN_SHORT@ON<3> EN_SHORT@ON<9> d2 PWM_MAP00<2> PWM_MAP02<2> PWM_MAP04<2> PWM_MAP06<2> PWM_MAP08<2> PWM_MAP10<2> Not USED Not USED CAL0<2> CAL1<2> CAL2<2> CAL3<2> CAL4<2> CAL5<2> CAL6<2> CAL7<2> CAL8<2> CAL9<2> CAL10<2> CAL11<2> Not USED Not USED EN_CHANNEL<2> EN_CHANNEL<8> EN_SHORT@ON<2> EN_SHORT@ON<8> d1 PWM_MAP00<1> PWM_MAP02<1> PWM_MAP04<1> PWM_MAP06<1> PWM_MAP08<1> PWM_MAP10<1> Not USED Not USED CAL0<1> CAL1<1> CAL2<1> CAL3<1> CAL4<1> CAL5<1> CAL6<1> CAL7<1> CAL8<1> CAL9<1> CAL10<1> CAL11<1> Not USED Not USED EN_CHANNEL<1> EN_CHANNEL<7> EN_SHORT@ON<1> EN_SHORT@ON<7> d0 PWM_MAP00<0> PWM_MAP02<0> PWM_MAP04<0> PWM_MAP06<0> PWM_MAP08<0> PWM_MAP10<0> Not USED Not USED CAL0<0> CAL1<0> CAL2<0> CAL3<0> CAL4<0> CAL5<0> CAL6<0> CAL7<0> CAL8<0> CAL9<0> CAL10<0> CAL11<0> Not USED Not USED EN_CHANNEL<0> EN_CHANNEL<6> EN_SHORT@ON<0> EN_SHORT@ON<6> EN_OPEN@ON<3> EN_OPEN@ON<9> EN_SHORT@OFF<3> EN_SHORT@OFF<9> EN_OPEN@OFF<3> EN_OPEN@OFF<9> EN_OPEN@ON<2> EN_OPEN@ON<8> EN_SHORT@OFF<2> EN_SHORT@OFF<8> EN_OPEN@OFF<2> EN_OPEN@OFF<8> EN_OPEN@ON<1> EN_OPEN@ON<7> EN_SHORT@OFF<1> EN_SHORT@OFF<7> EN_OPEN@OFF<1> EN_OPEN@OFF<7> EN_OPEN@ON<0> EN_OPEN@ON<6> EN_SHORT@OFF<0> EN_SHORT@OFF<6> EN_OPEN@OFF<0> EN_OPEN@OFF<6> Comments EN_SHORT_TO_GND<4> EN_SHORT_TO_GND<3> EN_SHORT_TO_GND<2> EN_SHORT_TO_GND<1> EN_SHORT_TO_GND<0> EN_SHORT_TO_GND<10> EN_SHORT_TO_GND<9> EN_SHORT_TO_GND<8> EN_SHORT_TO_GND<7> EN_SHORT_TO_GND<6> EN_PULL_UP@ON<4> EN_PULL_UP@ON<10> EN_PULL_UP@OFF<4> EN_PULL_UP@OFF<10> EN_PULL_UP@ON<3> EN_PULL_UP@ON<9> EN_PULL_UP@OFF<3> EN_PULL_UP@OFF<9> EN_PULL_UP@ON<2> EN_PULL_UP@ON<8> EN_PULL_UP@OFF<2> EN_PULL_UP@OFF<8> EN_PULL_UP@ON<1> EN_PULL_UP@ON<7> EN_PULL_UP@OFF<1> EN_PULL_UP@OFF<7> EN_PULL_UP@ON<0> EN_PULL_UP@ON<6> EN_PULL_UP@OFF<0> EN_PULL_UP@OFF<6> s<4> u<4> REXT<4> EN_ERR_PIN_UNLOCK<4> PWM_OK<4> U Gen_SHORT<4> Gen_SHORT<10> Gen_OPEN<4> Gen_OPEN<10> SHORT_TO_GND<4> SHORT_TO_GND<10> Not USED Not USED Not USED s<3> u<3> WLS<3> MAP_UNLOCK<3> PWM_OK<3> U Gen_SHORT<3> Gen_SHORT<9> Gen_OPEN<3> Gen_OPEN<9> SHORT_TO_GND<3> SHORT_TO_GND<9> Not USED Not USED Not USED s<2> u<2> TSD180<2> CH_EN_UNLOCK<2> PWM_OK<2> U Gen_SHORT<2> Gen_SHORT<8> Gen_OPEN<2> Gen_OPEN<8> SHORT_TO_GND<2> SHORT_TO_GND<8> Not USED Not USED Not USED s<1> u<1> TSD130<1> CAL_UNLOCK<1> PWM_OK<1> U Gen_SHORT<1> Gen_SHORT<7> Gen_OPEN<1> Gen_OPEN<7> SHORT_TO_GND<1> SHORT_TO_GND<7> Not USED Not USED Not USED s<0> u<0> POR<0> DIAG_UNLOCK<0> PWM_OK<0> MASK_WLS<0> Gen_SHORT<0> Gen_SHORT<6> Gen_OPEN<0> Gen_OPEN<6> SHORT_TO_GND<0> SHORT_TO_GND<6> Not USED Not USED Not USED Read output Ch1&Ch0 to PWMy configuration Read output Ch3&Ch2 to PWMy configuration Read output Ch5&Ch4 to PWMy configuration Read output Ch7&Ch6 to PWMy configuration Read output Ch9&Ch8 to PWMy configuration Read output Ch11&Ch10 to PWMy configuration Not USED Not USED Read output configuration Ch0 Read output configuration Ch1 Read output configuration Ch2 Read output configuration Ch3 Read output configuration Ch4 Read output configuration Ch5 Read output configuration Ch6 Read output configuration Ch7 Read output configuration Ch8 Read output configuration Ch9 Read output configuration Ch10 Read output configuration Ch11 Not USED Not USED Read enable channel register for Ch 5 to Ch0 Read enable channel register for Ch 11 to Ch6 Read enable short for activated Ch5 to Ch0 Read enable short for activated Ch11 to Ch6 Read enable open for activated Ch5 to Ch0 Read enable open for activated Ch11 to Ch6 Read enable short for unactivated Ch5 to Ch0 Read enable short for unactivated Ch11 to Ch6 Read enable open for unactivated Ch5 to Ch0 Read enable open for unactivated Ch11 to Ch6 Read enable short to GND for Ch5 to Ch0 Read enable short to GND for Ch11 to Ch6 Read enable pull up @ ON for Ch5 to Ch0 read enable pull up @ ON for Ch11 to Ch6 read enable pull up @ OFF for Ch5 to Ch0 read enable pull up @ OFF for Ch11 to Ch6 read ERR PIN for STATUS bit6 to bit0 read ERR PIN for UNLOCK bit4 to bit0 Read STATUS register bits 6to 0 Read UNLOCKED Read PWM OK register for PWM5 to PWM0 Read Mask WLS Detection Read short register for Ch5 to Ch0 Read short register for Ch11 to Ch6 Read open register for Ch5 to Ch0 Read open register for Ch11 to Ch6 Read Short to GND register for Ch5 to Ch0 Read Short to GND register for Ch11 to Ch6 Not USED Not USED Not USED U=unchanged Note: The IC has also reserved addresses for internal test modes not shown in the above register map. All test modes are digital and are protected by security codes. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Power Dissipation The maximum current specification per output ID max = 50mA. However when all channels are sinking this maximum the total power dissipation exceeds the value set by the package limit. The power dissipation can be estimated using Equation 1. Maximum power dissipation. In case of high current and high voltage it is possible to exceed the maximum power dissipation even at a single channel. Because these situations do not occur often the current limit per channel is set higher such that the flexibility of the system is improved. It is recommended to connect the LEDs to a 5V supply voltage (V LED) for an optimal thermal performance. If the LEDs are connected to a higher voltage care should be taken because power dissipation will increase. LED series resistors ( R D ) may be added to reduce the voltage drop over the IC output. These resistors are an optional safeguard against exceeding the dissipation limit of BD18379EFV-M. The maximum power rating of the BD18379EFV-M can be read from the figure below. 11 Pdiss,max (VLED V f ,i I D ,i RD ,i ) I D ,i i 0 11 (VD ,i I D ,i ) i 0 TON TPWM TON TPWM Equation 1. Maximum power dissipation Pdiss,max: Maximum power dissipation of the package VLED: Supply voltage of LEDs. Vf: LED forward voltage RD: Optional series resistance. TPWM: Period of PWM TON: ON time (duty) of PWM Figure 13. Maximum power dissipation of HTSSOPB28 Note 1: Power dissipation calculated when mounted on 70mm X 70mm X 1.6mm glass epoxy substrate (1-layer platform/copper thickness 18m) Note 2: Power dissipation changes with the copper foil density of the board. This value represents only observed values, not guaranteed values. HTSSOP-B28 Pd=1.85W (0.97W) Board copper foil area 225m Pd=3.30W (1.72W) Board copper foil area 4900m Pd=4.70W (2.44W) Board copper foil area 4900m (Value within parentheses represents power dissipation when Ta=85C) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M I/O equivalence circuit(s) Input Pin: 4,11,12, 16, 17, 25 VCC Output Pin: 26 VCC Pin: 13,14,15 Pin: 3 VCC Pin: 5 to 10, 19 to 24, Pin : 18 Pin 18 Figure 14. Input/output equivalent circuits www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure 15. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Ordering Information B D 1 8 3 7 9 E F V - Package EFV: HTSSOP-B28 ME2 Packaging M: High Reliability E2: Embossed carrier tape (HTSSOP-B28) Figure 16. Ordering Information Marking Diagram HTSSOP-B28 (TOP VIEW) Part Number Marking BD18379EFV LOT Number 1PIN MARK Figure 17. Marking Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Physical Dimensions, Tape And Reel Information for HTSSOP-B28 Figure 18. Physical dimensions for HTSSOP-B28 Figure 19. Tape and reel information www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 BD18379EFV-M Revision History Date Revision 16.Nov.2016 001 Author / Comments Adrian Joita - First version Status of this document The English version of this document is formal specification. A customer may use the translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/25 TSZ02201-0W1W0C500020-1-2 16. Nov. 2016 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD18379EFV-M - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD18379EFV-M HTSSOP-B28 2500 2500 Taping inquiry Yes