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Document Number: 73009
S-71660-Rev. B, 06-Aug-07
Vishay Siliconix
SUD50P04-13L
New Product
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min Typ Max Unit
Static
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = - 250 µA - 40 V
Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1.0 - 3.0
Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA
Zero Gate Voltage Drain Current IDSS
VDS = - 40 V, VGS = 0 V - 1 µA
VDS = - 40 V, VGS = 0 V, TJ = 125 °C - 50
On-State Drain CurrentaID(on) V
DS = - 5 V, VGS = - 10 V - 50 A
Drain-Source On-State ResistancearDS(on)
VGS = - 10 V, ID = - 30 A 0.0105 0.013
Ω
VGS = - 10 V, ID = - 30 A, TJ = 125 °C 0.020
VGS = - 4.5 V, ID = - 20 A 0.017 0.022
Forward Transconductanceagfs VDS = - 15 V, ID = - 30 A 15 S
Dynamicb
Input Capacitance Ciss
VDS = - 25 V, VGS = 0 V, f = 1 MHz
3120
pFOutput Capacitance Coss 440
Reverse Transfer Capacitance Crss 320
Gate Resistance Rgf = 1 MHz 4.3 Ω
Total Gate ChargecQg
VDS = - 20 V, VGS = - 10 V, ID = - 50 A
63 95
nC
Gate-Source ChargecQgs 13
Gate-Drain ChargecQgd 16
Tur n - O n D e l ay Timectd(on)
VDD = - 20 V, RL = 0.4 Ω
ID ≅ - 50 A, VGEN = - 10 V, Rg = 2.5 Ω
15 25
ns
Rise Timectr18 30
Turn-Off Delay Timectd(off) 60 90
Fall Timectf47 70
Drain-Source Body Diode Characteristics
Pulse Current ISM - 100
Forward VoltageaVSD IF = - 50 A, VGS = 0 V - 1.0 - 1.5 V
Source-Drain Reverse Recovery Time trr IF = - 50 A, di/dT = 100 A/µs 36 55 ns