Sockets and ConnectorsSPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Click here to go back to socket part number overview
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
IC149 - 176 - *66 - B5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
39.00
25.30 x 25.30
39.00
Outline Socket Dimensions (Reference Only)
12.30
12.60
IC149 Series (SMT) QFP/TQFP - 176 Pins (44x44) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated Socket
version.
Remarks
not available
Compatible Emulation-Adapter
Sockets and ConnectorsSPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Click here to go back to socket part number overview
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
IC149 - 272 - *29 - BB5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
51.00
37.90 x 37.90
51.00
Outline Socket Dimensions (Reference Only)
IC - Dimensions
12.30
14.20
IC149 Series (SMT) QFP/TQFP - 272 Pins (68x68) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated Socket
version.
Remarks
not available
Compatible Emulation-Adapter
Socket PCB-Layout Top View from Socket
Detail A
N5
N3
N2
0.20 ±0.05
Detail A
0.15 ±0.05
(37.40)
37.60 ±0.2 1.02
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N2: These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N5: No conduits within this hatched area.
Sockets and ConnectorsSPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Click here to go back to socket part number overview
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
.
IC149 - 208 - *61 - B5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
43.60
29.20 x 29.20
43.60
Outline Socket Dimensions (Reference Only)
12.30
12.60
IC149 Series (SMT) QFP/TQFP - 208 Pins (52x52) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated Socket
version.
Remarks
not available
Compatible Emulation-Adapter
Top View from Socket
N3
IC - Dimensions Socket PCB-Layout
Notes:
N1: Metal soldering Tab Clip.
Socket may be stabilized by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
