DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS8101
1 Mbps HIGH CMR ANALOG OUTPUT TYPE
5-PIN SOP PHOTOCOUPLER
Document No. PN10260EJ02V0DS (2nd edition)
Date Published February 2005 CP(K)
Printed in Japan
−NEPOC Series−
NEC Compound Semiconductor Devices, Ltd. 2003, 2005
DESCRIPTION
The PS8101 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a
PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
This is a plastic SOP (Small Out-line Package) type for high density applications.
FEATURES
• High common mode transient immunity (CMH, CML = ±10 kV/
µ
s MIN.)
• Small package (5-pin SOP)
• High supply voltage (VCC = 35 V)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.8
µ
s MAX., tPLH = 1.2
µ
s MAX.)
• Ordering number of taping product: PS8101-F3, F4: 2 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option)
APPLICATIONS
• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Power supply
The mark shows major revised points.
PIN CONNECTION
(Top View)
1. Anode
2. Cathode
3. GND
4. VO
5. VCC
53
12
4
Data Sheet PN10260EJ02V0DS
2
PS8101
PACKAGE DIMENSIONS (UNIT: mm)
1.27
0.4+0.10
–0.05 0.25 M
0.1±0.1
4.4
7.0±0.3
0.5±0.3
0.15 +0.10
–0.05
3.4 +0.3
–0.1
2.6±0.2
MARKING EXAMPLE
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Rank Code
Year Assembled
(Last 1 Digit)
Week Assembled
N234
Assembly Lot
8101
N234
N*1
*1 Bar : Pb-Free
Data Sheet PN10260EJ02V0DS 3
PS8101
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application Part
Number*1
PS8101 PS8101-A Pb-Free*2 Magazine case 100 pcs Standard products PS8101
PS8101-F3 PS8101-F3-A Embossed Tape 2 500 pcs/reel (UL approved)
PS8101-F4 PS8101-F4-A
PS8101-V PS8101-V-A Magazine case 100 pcs DIN EN60747-5-2
PS8101-V-F3 PS8101-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2)
PS8101-V-F4 PS8101-V-F4-A Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your
nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF 25 mA
Reverse Voltage VR 5.0 V
Power Dissipation*1 PD 45 mW
Detector Supply Voltage VCC 35 V
Output Voltage VO 35 V
Output Current IO 8.0 mA
Power Dissipation*2 PC 100 mW
Isolation Voltage*3 BV 2 500 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +125 °C
*1 Reduced to 0.45 mW/°C at TA = 25°C or more.
*2 Reduced to 1.00 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60 % between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10260EJ02V0DS
4
PS8101
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V
Reverse Current IR VR = 3 V 10
µ
A
Forward Voltage
Temperature Coefficient
∆
VF/
∆
T IF = 16 mA −2.1 mV/°C
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 3 500 nA
High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V 100
µ
A
Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA 0.1 0.4 V
Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 50
µ
A
High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 0.01 2
Coupled Current Transfer Ratio*1 CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 20 35 %
Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60% 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF
Propagation Delay Time
(H → L)*2
tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ,
CL = 15 pF
0.5 0.8
µ
s
Propagation Delay Time
(L → H)*2
tPLH 0.6 1.2
Common Mode
Transient Immunity at
High Level Output*3
CMH IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
10 kV/
µ
s
Common Mode
Transient Immunity at
Low Level Output*3
CML IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
−10
*1 CTR rank
K : 20 to 35 (%)
N : 15 to 35 (%)
Data Sheet PN10260EJ02V0DS 5
PS8101
*2 Test circuit for propagation delay time
Pulse input
47 Ω
(Pulse width = 100 s,
Duty cycle = 1/10)
µ
R
L
= 2.2 kΩ
V
O
(Monitor)
V
CC
= 5 V
Input
(Monitor)
0.1 F
µ
C
L
= 15 pF
Input
Output
50 %
1.5 V
5 V
V
OL
t
PHL
t
PLH
C
L is approximately 15 pF which includes probe and stray wiring capacitance
*3 Test circuit for common mode transient immunity
I
F
R
L
= 4.1 kΩ
V
O
(Monitor)
V
CC
= 5 V
0.1 F
µ
V
CM
90 %
10 %
1.5 kV
0 V
5 V
2 V
0.8 V
V
OL
V
CM
V
O
(I
F
= 0 mA)
V
O
(I
F
= 16 mA)
t
r
t
f
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1
µ
F is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10260EJ02V0DS
6
PS8101
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
50
30
20
10
0
40
25 50 75 100
Ambient Temperature TA (˚C)
Diode Power Dissipation PD (mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
120
100
60
20
0
80
40
25 50 75 100
Ambient Temperature TA (˚C)
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
0.01
0.1
10
1
1.4 1.8 2.0 2.41.0 1.2 1.6 2.2
Forward Voltage VF (V)
Forward Current IF (mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
TA = +100˚C
+50˚C
+25˚C
0˚C
–25˚C
1 000
1
0.1
100
10
50 100–25 0 25 75
Ambient Temperature TA (˚C)
High Level Output Current IOH (nA)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
VCC = VO = 30 V
VCC = VO = 5.5 V
IF = 0 mA
80
20
0
40
60
70
50
10
30
0.5 5 10 501
Forward Current IF (mA)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Current Transfer Ratio CTR (
%
)
VCC = 4.5 V,
VO = 0.4 V
1.6
0.0
1.2
0.4
1.4
1.0
0.8
0.6
0.2
0 50 100–50 –25 25 75
Ambient Temperature TA (˚C)
Normalized Current Transfer Raio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25 ˚C, IF = 16 mA,
VCC = 4.5 V, VO = 0.4 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10260EJ02V0DS 7
PS8101
10
4
0
8
6
2
4 8 18 20162 6 10 12 14
Output Voltage V
O
(V)
Output Current I
O
(mA)
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
20 mA
15 mA
10 mA
5 mA
I
F
= 25 mA
6
5
4
2
0
3
1
12 16 20
4826
10 14 18
Forward Current I
F
(mA)
Output Voltage V
O
(V)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
R
L
= 2.2 kΩ
5.6 kΩ
3.0
0
1.0
2.0
10 15 25
520
Forward Current I
F
(mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
Propagation Delay Time t
PHL
, t
PLH
( s)
µ
V
CC
= 5 V,
R
L
= 2.2 kΩ
t
PHL
t
PLH
10
1
0.1 10 k 100
k
1 k
Load Resistance R
L
(Ω)
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
Propagation Delay Time t
PHL
, t
PLH
( s)
µ
V
CC
= 5 V,
I
F
= 16 mA
t
PLH
t
PHL
5
4
2
0
3
1
–50 0 50 100
–25 7525
Ambient Temperature T
A
(˚C)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Normalized Propagation Delay Time t
PHL
, t
PLH
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 16 mA, V
CC
= 5 V,
R
L
= 2.2 kΩ
t
PLH
t
PHL
Remark The graphs indicate nominal characteristics.
Data Sheet PN10260EJ02V0DS
8
PS8101
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
Taping Direction
Outline and Dimensions (Reel)
Packing: 2 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS8101-F3 PS8101-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
3.9±0.1
3.45 MAX.
7.4±0.1
0.3±0.05
8.0±0.1
1.5
+0.1
–0
5.5±0.1
12.0±0.2
3.0±0.1
Data Sheet PN10260EJ02V0DS 9
PS8101
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
Data Sheet PN10260EJ02V0DS
10
PS8101
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10260EJ02V0DS 11
PS8101
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
M8E 00. 4 - 0110
The information in this document is current as of February, 2005. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
For further information, please contact
PS8101
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
