Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
Product Features
• DC – 6 GHz
• +12.5 dBm P1dB at 1 GHz
• +25 dBm OIP3 at 1 GHz
• 22 dB Gain at 1 GHz
• 3.4 dB Noise Fi gu re at 2 GHz
• Available in lead-free / green
SOT-89 / SOT-363 pkg styles
• Internally matched to 50 Ω
Applications
• Mobile Infrastru cture
• CATV / DBS
• W-LAN / ISM
• RFID
• Defense / Homeland Security
• Fixed Wireless
Product Description
The ECG001 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG001 typically provides 22
dB of gain, +25 dBm Output IP3, and +12.5 dBm P1dB.
The ECG001 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low-
cost, surface-mountable lead-free/green/RoHS-compliant
SOT-89 or SOT-363 package. All devices are 100% RF
and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG001 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and fixed
wireless.
Functional Diagram
RF IN GND RF OUT
GND
1 23
4
ECG001B / ECG001B-G
RF IN
GND
RF OUT
GND
GND
GND 1
2
3 4
6
5
ECG001F / ECG001F-G
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz DC 6000
Test Frequency MHz 1000
Gain dB 22.2
Output P1dB dBm +12.5
Output IP3 (2) dBm +25
Test Frequency MHz 2000
Gain dB 20.45 21.2 21.95
Input Return Loss dB 35
Output Return Loss dB 18
Output P1dB dBm +12.5
Output IP3 (2) dBm +23 +25
Noise Figure dB 3.4 4
Device Voltage V 3.0 3.4 3.8
Device Current mA 30
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 51 Ω, 50 Ω Sy s tem.
2. 3OIP measured with two tones at an output power of –1 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 °C
Storage Temperature -55 to +150 °C
Device Current 150 mA
RF Input Power (continuous) +12 dBm
Junction Temperature +250 °C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (4)
Parameter Units Typical
Frequency MHz 500 900 1900 2140
S21 dB 22.6 22.4 21.4 21.0
S11 dB -46 -42 -35 -29
S22 dB -29 -24 -18 -17
Output P1dB dBm +12 +12.5 +12.5 +12.5
Output IP3 (2) dBm +23 +25 +26 +26
Noise Figure dB 3.4 3.4 3.4 3.4
4. Test conditions: T = 2 5º C, Sup ply Voltage = +5 V, De vice Voltage = +3.4 V, Rbias = 51 Ω, 50 Ω Sy stem.
Ordering Information
Part No. Description
ECG001B (4) InGaP HBT Gain Block
(lead-tin SOT-89 Pkg)
ECG001B-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG001F (4) InGaP HBT Gain Block
(lead-tin SOT-363 Pkg)
ECG001F-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 Pkg)
ECG001B-PCB 700 – 2400 MHz Fully Assembled Eval. Bo ard
ECG001F-PCB 700 – 2400 MHz Fully Assembled Eval. Board
4. This package is being phased out in favor of the green package type which is backward compatible
for existing designs.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 51 Ω, Icc = 30 mA
Frequency MHz 100 500 900 1900 2140 2400 3500 5800
S21 dB 22.8 22.6 22.4 21.4 21.0 20.7 19.2 16.1
S11 dB -48 -46 -42 -35 -29 -28 -22 -14
S22 dB -34 -29 -24 -18 -17 -16 -13 -8
Output P1dB dBm +11.6 +11.6 +12.6 +12.6 +12.6 +12.8 +12.2 +11
Output IP3 dBm +23.6 +23.5 +24.8 +26 +25.6 +25.4 +23
Noise Figure dB 3.4 3.4 3.4 3.4 3.4 3.4
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.4 V, Rbias = 51 Ω, Icc = 30 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain
14
16
18
20
22
24
0123456
Frequency (GHz)
Gain
(
dB
)
Return Loss
-40
-30
-20
-10
0
0123456
Frequency (GHz)
S11, S22
(
dB
)
S11 S22
Icc vs. Vde
0
20
40
60
80
100
3.23.33.43.53.6
Vde (V)
Ic c
(
mA
)
O IP3 vs. Frequency
20
22
24
26
28
500 1000 1500 2000 2500 3000
Frequency (M Hz)
OIP3
(
dBm
)
+25C -40C +85C
Noise Figure vs. Frequency
0
1
2
3
4
5
500 1000 1500 2000 2500 3000
Frequency (MHz)
NF
(
dB
)
P1dB vs. Frequency
6
8
10
12
14
16
18
500 1000 1500 2000 2500 3000
Frequency (MH z)
P1dB
(
dBm
)
+25C -40C +85C
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
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e TM
Recommended Application Circuit
ECG001B-PCB ECG001F-PCB
Recommended Component Values
Reference Frequency (MHz)
Designator 50 500 900 1900 2200 2500 3500
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH
C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The follow ing values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. Value / Type Size
L1 39 nH wirewound inductor 0603
C1, C2 56 pF chip capacitor 0603
C3 0.018 μF chip capacitor 0603
C4 Do Not Place
R4 51Ω 1% tolerance 0805
Recommended Bias Resistor Values
Supply
Voltage R1 value Size
5 V 53.3 ohms 0805
6 V 86.7 ohms 0805
8 V 153 ohms 1210
9 V 187 ohms 1210
10 V 220 ohms 2010
12 V 287 ohms 2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
R4
Bias
Resisto
r
RF IN
C4
Bypass
Capacito
r
C2
Blocking
Ca
p
acito
r
Vcc
Icc = 30 m
ECG001
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
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e TM
ECG001B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E001” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the prope r performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the p art to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 5 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
ECG001B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E001G” designator with an alphanumeric lot
code on the top surface of the package. The
obsoleted model – ECG001C – was housed
in a SOT-86 package with an “xxG”
nomenclature, where the “xx” is a 2-digit
number.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the prope r performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the p art to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 6 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
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e TM
ECG001F (SOT-363 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “0” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 7 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
g
e TM
ECG001F-G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “4” designator on the top
surface of the package. The obsoleted
model – ECG001C – was housed in a SOT-
86 package with an “xxG” nomenclature,
where the “xx” is a 2-digit number.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 8 of 8 October 2005
ECG001
InGaP HBT Gain Block Product Information
The Communications Ed
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e TM
Typical Device S-Parameters – ECG001B / ECG001B-G
S-Parameters (Vdevice = +3.4 V, ICC = 30 mA, T = 25°C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang ) S22 (dB) S22 (ang)
50 -51.06 -78.50 22.77 177.87 -24.25 -0.35 -34.47 -14.76
500 -45.85 -105.39 22.61 158.52 -23.97 -2.11 -28.80 -88.38
1000 -41.11 -132.48 22.25 137.66 -23.88 -7.72 -23.20 -124.85
1500 -35.04 -155.82 21.78 117.56 -23.47 -11.71 -19.45 -147.22
2000 -32.25 -149.35 21.22 98.36 -23.29 -15.07 -17.31 -176.10
2500 -27.68 161.65 20.56 80.02 -22.64 -22.26 -15.75 160.80
3000 -25.13 146.56 19.94 62.40 -22.19 -28.01 -14.33 143.60
3500 -22.38 130.02 19.24 44.75 -21.46 -36.02 -12.76 119.33
4000 -20.32 112.40 18.52 27.97 -21.48 -45.09 -12.00 102.25
4500 -17.95 95.14 17.91 10.80 -21.10 -54.41 -10.35 83.68
5000 -14.93 76.82 17.08 -5.29 -20.43 -62.18 -9.12 67.46
5500 -14.55 61.65 16.46 -20.95 -20.18 -74.36 -8.97 52.66
6000 -12.63 48.56 15.70 -37.55 -19.59 -85.56 -7.38 34.72
Typical Device S-Parameters – ECG001F / ECG001F-G
S-Parameters (Vdevice = +3.4 V, ICC = 30 mA, T = 25°C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang ) S22 (dB) S22 (ang)
50 -33.58 15.96 22.85 178.01 -24.47 -1.35 -28.60 3.58
500 -24.53 12.09 22.63 162.01 -24.14 1.89 -22.29 -35.35
1000 -32.76 32.44 22.20 144.90 -23.99 4.76 -25.75 -100.14
1500 -28.56 153.22 21.54 129.42 -23.56 7.59 -20.80 -165.24
2000 -25.13 172.50 20.74 114.94 -23.12 9.11 -17.59 175.89
2500 -28.01 -117.92 20.11 103.13 -22.71 7.41 -20.44 169.69
3000 -28.65 -133.85 19.33 91.28 -22.14 7.37 -18.13 154.41
3500 -28.35 -142.02 18.59 79.59 -21.68 4.16 -16.41 140.24
4000 -25.99 -171.80 17.77 68.13 -20.88 2.49 -14.29 124.73
4500 -22.91 160.22 17.05 57.38 -20.50 2.47 -12.47 116.41
5000 -19.69 153.85 16.39 48.12 -20.03 -0.55 -11.36 113.60
5500 -17.30 152.52 15.78 39.49 -19.55 -5.36 -11.30 114.22
6000 -15.88 144.43 15.21 30.49 -19.14 -6.76 -11.31 113.24
Device S-parameters are available for download off of the website at: http://www.wj.com