© Semiconductor Components Industries, LLC, 2011
August, 2011 Rev. 3
1Publication Order Number:
ASM3P2183A/D
ASM3P2183A
EMI Reduction IC
Description
The ASM3P2183A is a versatile spread spectrum frequency
modulator designed specifically for a wide range of input clock
frequencies from 6 MHz to 90 MHz. (Refer to Input Frequency and
Modulation Rate Table). The ASM3P2183A can generate an EMI
reduced clock from an OSC or a system generated clock. The
ASM3P2183A offers a Down Spread clock with a percentage
deviation of 1.25% and a Center Spread clock with a percentage
deviation of ± 0.42%.
The ASM3P2183A reduces electromagnetic interference (EMI) at
the clock source, allowing system wide reduction of EMI of down
stream clock and data dependent signals. The ASM3P2183A allows
significant system cost savings by reducing the number of circuit
board layers ferrite beads, shielding and other passive components that
are traditionally required to pass EMI regulations.
The ASM3P2183A uses the most efficient and optimized
modulation profile approved by the FCC and is implemented in a
proprietary all digital method.
The ASM3P2183A modulates the output of a single PLL in order to
“spread” the bandwidth of a synthesized clock, and more importantly,
decreases the peak amplitudes of its harmonics. This results in
significantly lower system EMI compared to the typical narrow band
signal produced by oscillators and most frequency generators.
Lowering EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation.’
Applications
The ASM3P2183A is targeted towards EMI management for
memory and LVDS interfaces in mobile graphic chipsets and
highspeed digital applications such as PC peripheral devices,
consumer electronics, and embedded controller systems.
Features
FCC Approved Method of EMI Attenuation
Provides up to 15 dB EMI Reduction
Generates a 1X Low EMI Spread Spectrum Clock of the Input
Frequency
Input Frequency Range: 6 MHz to 90 MHz
Internal Loop Filter Minimizes External Components and Board
Space
Selectable Spread Options: Down and Center Spread
2 Spread Frequency Deviation Selections: 1.25% or ± 0.42%
Low Inherent CycletoCycle Jitter
Supply Voltage: 3.3 V ± 0.3 V
Low Power CMOS Design
Supports Notebook VGA and Other LCD Timing Controller
Applications
Products are Available for Industrial Temperature Range
Available in 8pin SOIC and TSSOP Packages
These are PbFree Devices
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SOIC8
S SUFFIX
CASE 751BD
PIN CONFIGURATION
(Top View)
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
FS1
FS0
VDD
ModOUT
XOUT
VSS
XIN / CLKIN
1
SS%
TSSOP8
T SUFFIX
CASE 948AL
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Figure 1. Block Diagram
ModOUT
PLL
XIN/CLKIN
Crystal
Oscillator
VSS
SS%
VDD
FS0 FS1
VCO Output
Divider
Loop
Filter
Phase
Detector
Modulation
Frequency
Divider
Feedback
Divider
XOUT
Table 1. PIN DESCRIPTION
Pin# Pin Name Type Description
1XIN / CLKIN ICrystal connection or external frequency input. This pin has dual functions. It can be con-
nected to either an external crystal or an external reference clock.
2 XOUT I Crystal connection. Input connection for an external crystal. If using an external reference,
this pin must be left unconnected.
3 VSS PGround to entire chip.
4 SS% I Spread range select. Digital logic input used to select frequency deviation
(Refer to Spread Deviation Selection Table). This pin has an internal pullup resistor.
5 ModOUT O Spread spectrum low EMI output.
6 VDD PPower supply for the entire chip.
7 FS0 I Frequency range select. Digital logic input used to select frequency range
(Refer to Input Frequency and Modulation Rate Table). This pin has an internal
pullup resistor.
8 FS1 I Frequency range select. Digital logic input used to select frequency range
(Refer to Input Frequency and Modulation Rate Table). This pin has an internal
pullup resistor.
Table 2. INPUT FREQUENCY AND MODULATION RATE TABLE
FS1 (pin 8) FS0 (pin 7) Frequency Range
0 0 6 MHz to 13 MHz
0 1 12 MHz to 25 MHz
1 0 25 MHz to 50 MHz
1 1 50 MHz to 90 MHz
Table 3. SPREAD DEVIATION SELECTION TABLE
SS% (pin 4) Spread Deviation (%)
0 1.25
1± 0.42
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Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Rating Unit
VDD, VIN Voltage on any pin with respect to Ground 0.5 to +4.6 V
TSTG Storage temperature 65 to +125 °C
TsMax. Soldering Temperature (10 sec) 260 °C
TJJunction Temperature 150 °C
TDV Static Discharge Voltage (As per JEDEC STD22 A114B) 2 KV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 5. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
TAOperating Temperature 0 +70 °C
VDD Core Voltage +3.0 +3.3 +3.6 V
Table 6. DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Min Typ Max Unit
VIL Input low voltage VSS 0.3 0.8 V
VIH Input high voltage 2.0 VDD + 0.3 V
IIL Input low current 35 mA
IIH Input high current 35 mA
IXOL XOUT Output low current
(@ 0.4 V, VDD = 3.3 V)
3mA
IXOH XOUT Output high current
(@ 2.5 V, VDD = 3.3 V)
3mA
VOL Output low voltage (VDD = 3.3 V, IOL = 20 mA) 0.4 V
VOH Output high voltage (VDD = 3.3 V, IOH = 20 mA) 2.5 V
ICC Dynamic supply current
Normal mode (3.3 V, 90 MHz and 10 pF loading)
28 mA
IDD Static supply current (Note 1) 7.0 mA
VDD Operating voltage 3.0 3.3 3.6 V
tON Power up time (first locked clock cycle after power up) 0.18 mS
ZOUT Clock out impedance 50 W
1. XIN /CLKIN pin is pulled low.
Table 7. AC ELECTRICAL CHARACTERISTICS
Symbol Parameter Min Typ Max Unit
fIN Input frequency 690 MHz
ModOUT Output frequency 690 MHz
tLH (Note 2) Output rise time (measured at 0.8 V to 2.0 V) 0.3 0.9 1.1 nS
tHL (Note 2) Output fall time (measured at 2.0 V to 0.8 V) 0.5 1.0 1.2 nS
tJC Jitter (cycle to cycle) 200 pS
TDOutput duty cycle 45 50 55 %
2. tLH and tHL are measured with a capacitive load of 15 pF at 27 MHz.
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PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL01
ISSUE O
E1 E
A2
A1
e
b
D
c
A
TOP VIEW
SIDE VIEW END VIEW
q1
L1 L
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
SYMBOL
θ
MIN NOM MAX
A
A1
A2
b
c
D
E
E1
e
L1
L
0.05
0.80
0.19
0.09
0.50
2.90
6.30
4.30
0.65 BSC
1.00 REF
1.20
0.15
1.05
0.30
0.20
0.75
3.10
6.50
4.50
0.90
0.60
3.00
6.40
4.40
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PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD01
ISSUE O
E1 E
A
A1
h
θ
L
c
eb
D
PIN # 1
IDENTIFICATION
TOP VIEW
SIDE VIEW END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
SYMBOL MIN NOM MAX
θ
A
A1
b
c
D
E
E1
e
h
0.10
0.33
0.19
0.25
4.80
5.80
3.80
1.27 BSC
1.75
0.25
0.51
0.25
0.50
5.00
6.20
4.00
L0.40 1.27
1.35
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Table 8. ORDERING INFORMATION
Part Number Marking Package Type Temperature
ASM3P2183A08ST 3P2183A 8Pin SOIC, TUBE Commercial
ASM3P2183A08SR 3P2183A 8Pin SOIC, TAPE & REEL Commercial
ASM3P2183A08TT 3P2183A 8Pin TSSOP, TUBE Commercial
ASM3P2183A08TR 3P2183A 8Pin TSSOP, TAPE & REEL Commercial
ASM3P2183AF08ST 3P2183AF 8Pin SOIC, TUBE, Pb Free Commercial
ASM3P2183AF08SR 3P2183AF 8Pin SOIC, TAPE & REEL, Pb Free Commercial
ASM3P2183AF08TT 3P2183AF 8Pin TSSOP, TUBE, Pb Free Commercial
ASM3P2183AF08TR 3P2183AF 8Pin TSSOP, TAPE & REEL, Pb Free Commercial
ASM3P2183AG08ST 3P2183AG 8Pin SOIC, TUBE, Green Commercial
ASM3P2183AG08SR 3P2183AG 8Pin SOIC, TAPE & REEL, Green Commercial
ASM3P2183AG08TT 3P2183AG 8Pin TSSOP, TUBE, Green Commercial
ASM3P2183AG08TR 3P2183AG 8Pin TSSOP, TAPE & REEL, Green Commercial
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ASM3P2183A/D
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