NJL6501R-3
-
1
-
Ver.2007-02-08
Ambient Light Sensor
■ GENERAL DESCRIPTION
The NJL6501R-3 is the ambient light sensor with optical filter to solve the interference problem by the infrared.
Also, the spectral response is close to human eye.
■ FEATURES
1. Peak wavelength 560 nm
2. Spectral range 350 to 650 nm
3. Photo current 270nA ±15%
4. Illuminance linearity 0.1 to 100,000 Lux Condition : VR=0V, Ta=25°C
5. COBP Package size : 2.0 x 2.0 x 0.65 mm
■ APPLICATIONS
Cellular phone, PDA, Note PC, TV, PDP, Clock, Refrigerator, Camera, Toy, Room light, Street light, etc.
to adjust the luminance of display
to control ON/OFF
Replacement of CdS
■ ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER SYMBOL RATINGS UNIT
Reverse Voltage VR 3.6 V
Operating Temperature Topr −40 to +85 °C
Storage Temperature Tstg −40 to +100 °C
Soldering Temperature Tsol 260 °C
■ ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER SYMBOL TEST CONDITION MIN TYP MAX UNIT
Forward Current VF I
F=1mA, Ev=0Lux ⎯ ⎯ 0.85 V
Dark Current ID VR=1V, Ev=0Lux ⎯ 0.1 ⎯ nA
IL Ev=1000Lux, Fluorescent light 230 270 310 nA
Photo Current
IL2/I L1
I L1: Fluorescent light,
IL2: Incandescent light ⎯ 1.4 ⎯
Peak Wavelength λP ⎯ ⎯ 560 ⎯ nm
NJL6501R-3
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2
-Ver.2007-02-08
■ OUTLINE (TYP.) UNIT : mm
■ TYPICAL CHARACTERISTICS
Relative Spectral Response
(Ta=25°C)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
200 300 400 500 600 700 800 900 1000 1100
Wavelength (nm)
Relative Response
NJL6501R-3 Human eye
Relative Photocurrent vs. Ambient Temperature
0.8
0.9
1
1.1
1.2
-60 -40 -20 0 20 40 60 80 100
Ta (°C)
Relative Photocurrent
Fluorescent light Incandescent light
2.0
2.0
0.3
0.6
1.0
0.9
0.5
0.5
(1.0)
(0.75)
1
2
0.65
0.7 0.56
0.5
0.7
PCB Patten
0.4
0.2
0.6
0.07
0.5
0.5
0.07
1:Anode
2:Cathode
Center of Receiving Area
1.05
1.15
0.66
1.25
1.35
0.775
Light Receiving Area:0.5×0.5
NJL6501R-3
Ver.2007-02-08
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3
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■ APPLICATION CIRCUITS
Light source : Halogen lamp USHIO, JCV 100V 75W GSN
(a) Linear output type (b) Digital output type
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10 100 1000
Illuminance (Lux)
R=5MΩ
R=1MΩ
R=500KΩ
Vout (V)
Vout vs. Illuminance
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10 100 1000
Illuminance (Lux)
R=5MΩ
R=1MΩ
R=500KΩ
Vout (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10 100 1000
Illuminance (Lux)
R=5MΩ
R=1MΩ
R=500KΩ
Vout (V)
Vout vs. Illuminance
0.01
0.10
1.00
10.00
1 10 100 1000 10000 100000
Illuminance (Lux)
R=5MΩ
R=1MΩ
R=500KΩ
R=100KΩ
Vout (V)
Vout vs. Illuminance
0.01
0.10
1.00
10.00
1 10 100 1000 10000 100000
Illuminance (Lux)
R=5MΩ
R=1MΩ
R=500KΩ
R=100KΩ
Vout (V)
Vout vs. Illuminance
Photo Diode
NJL6501R-3
Light
R
OUT
Operational Amplifier
NJU7008F3
VDD
VSS
3.0V
0.3μF
VREF=0.1V
Vout
＋
－
ILPhoto Diode
NJL6501R-3
Light
R
OUT
Operational Amplifier
NJU7008F3
VDD
VSS
3.0V
0.3μF
VREF=0.1V
Vout
＋
－
IL
Photocurrent Linearity
( Ta=25°C)
1.E-12
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
0.01 0.1 1 10 100 1000 10000 100000
Illuminance （Lux）
Photocurrent (A)
V
R
=0V
V
R
=1V
V
R
=3V
Fluorescent light
Incandescent light
Operati onal Amplifier
NJU7008F3
Vout
OUT
R
＋
－
3.0V
0.3μF
I
L
Lig ht
Phot o Dio de
NJL65 01R- 3
V
DD
V
SS
Vout
OUT
R
＋
－
3.0V
0.3μF
I
L
Lig ht
Phot o Dio de
NJL65 01R- 3
V
DD
V
SS
NJL6501R-3
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4
-Ver.2007-02-08
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
The surface temperature of plastic package is lower than 260°C.
Soldering Method
1) Reflow Method
Soldering to be done within twice under the recommended condition mentioned below
2) Reflow Method (In case of infrared heating)
The temperature profile is same as the above
Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its
surface temperature will be higher than the lead.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
Solder the device in short time as soon as possible.
If the device is heated and kept in high temperature for longer time, its reliability would be affected.
2. Cleaning
Avoid washing the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc.
4. Storage
Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the
moisture at the reflow process, the device is contained in damp proof packaging.
a b c g
e
150°C
260°C
Room
Temp.
f
180°C
230°C
220°C d
a : Temperature ramping rate
: 1 to 4°C/s
b : Pre-heating temperature
time
: 150 to 180°C
: 60 to 120s
c : Temperature ramping rate
: 1 to 4°C /s
d : 220°C or higher time : Shorter than 60s
e : 230°C or higher time : Shorter than 40s
f : Peak temperature : Lower than 260°C
g : Temperature ramping rate
: 1 to 6°C /s
The temperature of the surface of mold package
NJL6501R-3
Ver.2007-02-08
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5
-
8.5
φ
13
φ
60
φ
180
Label
NJL6501R-3 Taping Specification (TE1)
1. Taping Size
1) The material of carrier tape is styrene type plastic with carbon.
2) The cover tape is polyester type with electro statistically prevention.
3) The pull out direction of the tape is as follows.
Pull out direction
UNIT : mm
2. Taping Strength
The peeling-off strength is 20 to 70g in case the cover tape is pulled up from the carrier tape with opening angle 10 to 15
degree.
3. Packing
1) The taped products are rolled up on the taping reel as follows.
2) Rolling up specification
2-1) Start rolling : Carrier tape open space is more than 20 pieces.
2-2) End of rolling : Carrier tape open space is more than 20 pieces with 2 rounds of cover tape.
3) Taping quantity : 2,000 pieces.
4) Each reel is sealed in a damp proof bag with one bag of silica gel.
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
8.0
2.3
0.25
0.85
2.0 4.0
2.2
4.0 Carrier Tape Cover Tape
3.5
(2.75) 1.75
1.5
(1.162)
