Surface Mount PTC
0ZC
N
Series
belfuse.com/
circuit
-
protection
N
Series
–
2016
Chip
RoHS 2 Compliant
Application
All high
-
density boards
Product Features
-
2016 Dime
nsion, Surface mountable, Solid
state, Faster time to trip than standard
SMD devices
.
-
AEC
-
Q
Compliant
-
Meets Bel
automotive qualification*
*
-
Largely based on internal AEC
-
Q test plan
Operating (Hold Current) Range
300mA
-
2
A
Maximum Voltage
6
-
60V (per table)
Temperature Range
-
40
℃
to 85
℃
Agency Approval
TUV (Std. EN60738
-
1
-
1, Cert. R50102117)
UL Recognized Component
(Std. UL1434, File E305051)
UL Conditions of
Acceptability:
1. These devices have been investigated for use in safety circuits and are suitable
as a limiting device.
2. These devices have been calibrated to limit the current to 8 amps within 5
seconds, per ANSI/NFPA 70, “National Electrical
Code”.
LEAD FREE =
HALOGEN FREE =
Electrical Characteristics (23
℃
)
Part Number
Hold
Current
Current
Rated
Voltage
Maximum
Current
Typical
Power
Max
Time to Trip
Resistance Tolerance
Agency Approvals
Current
Time
R
min
R1
max
I
H
, A
I
T
, A
V
max
, V
dc
I
max
, A
P
d
, W
A
Ohms
Ohms
A
0ZCN0030FF2C
0.30
0.60
60
100
1.4
1.5
3.0
0.500
2.300
Y
Y
B
0ZCN0055FF2A
0.55
1.10
60
100
1.4
2.5
5.0
0.200
1.000
Y
Y
C
0ZCN0075FF2A
0.75
1.50
60
100
1.4
8.0
0.5
0.130
0.900
Y
Y
D
0ZCN0110FF2C
1.10
2.20
15
100
1.4
8.0
0.5
0.100
0.400
Y
Y
0ZCN0110AF2C
1.10
2.20
33
100
1.4
8.0
0.5
0.100
0.400
Y
Y
E
0ZCN0150FF2C
1.50
3.00
15
100
1.4
8.0
0.8
0.070
0.180
Y
Y
F
0ZCN0200FF2C
2.00
4.20
6
100
1.4
8.0
3.0
0.048
0.100
Y
Y
I
H
Hold Current
-
maximum current at which the device will not trip in still air at 23
℃
.
I
T
Trip current
-
minimum current at which the device will always trip in still air at 23
℃
.
I
max
Maximum fault current device can withstand without damage at rated voltage (Vmax).
V
max
Maximum voltage device can withstand without damage a
t its rated current.
Pd
Typical power dissipated by device when in tripped state in 23
℃
still air
environment.
R
min
Minimum device resistance at 23
℃
.
R1
max
Maximum device resistance at 23
℃
, 1 hour after initial device trip, or after being soldered to PCB in end application.
Spe
cifications subject to change without notice
AEC
-
Q
Compliant
Type 0ZC
N
Series
2
/
4
Bel Fuse Inc.
206 Van Vorst
Street
Jersey City, NJ 07302 USA
+1
201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit
-
protection
© 201
9
Bel
Fuse, Inc.
Rev. 0ZC
N
J
an
2019
PTC’s
–
Basic Theory of Operation / “Tripped” Resistance Explanation
Fundamentally, a Bel PTC consists of a block of polymeric material containing conductive filler and bonded
between two conductive, planar terminations.
At currents below the device IHOLD
rating, AND at temperatures below 100C, the PTC maintains a
resistance value below its R1 MAX rating.
As the device's temperature approaches 130C, either due to an increase in ambient temperature or a
current exceeding its I TRIP rating, volumetric expans
ion of the filled polymer breaks apart the majority of
conductive pathways across the terminals created by chain contact of adjacent filler particles or device
resistance increases sharply by several orders of magnitude.
At the much higher “Tripped” resis
tance, there is just enough leakage current to allow internal heating to
“hold” the device in its tripped state (around 125C) until power is interrupted. Once power is removed, the
PTC's core cools and contracts allowing conductive chains to reform and ret
urn the device to its low
resistance state.
The catalog data for each device specifies a "Typical Power" value. This is the power required to exactly
match the heat lost by the tripped device to its ambient surroundings at 23C. By Ohm's Law, power can be
stated as: W = E^2/R. Thus the approximate resistance of a “Tripped” PTC can be determined by: R =
E^2/W, where "E" is the voltage appearing across the PTC (usually the supply's open circuit voltage), and
"W" is the Typical Power value for the particular P
TC.
Since the PPTC acts to maintain a constant internal temperature, its apparent resistance will change based
upon applied voltage and, to a lesser degree, ambient conditions. Consider the following example....
A PTC with a Typical Power of 1 watt protec
ting a circuit using a 60V supply will demonstrate an apparent,
tripped resistance "R" of:
R = 60^2/1 = 3,600 ohms
This same tripped device when used to protect a 12V circuit would now present an apparent resistance of:
R = 12^2/1 = 144 ohms
The valu
e for Typical Power is "typical" because any physical factors that affect heat loss (such as ambient
temperature or air convection) will somewhat alter the level of power that the PTC needs to maintain its
internal temperature. In short, PTCs do not exhibi
t a constant, quantifiable tripped resistance value.
Type Time
–
To
–
Trip at 23
℃
.
Spe
cifications subject to change without notice
Type 0ZC
N
Series
3
/
4
Bel Fuse Inc.
206 Van Vorst
Street
Jersey City, NJ 07302 USA
+1
201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit
-
protection
© 201
9
Bel
Fuse, Inc.
Rev. 0ZC
N
J
an
2019
Pad Layout
Termination Pad Materials
The
dimensions in the table below provide the recommended
Matte Tin
–
Plated Copper
pad layout.
Mechanical Dimensions and Marking
All dimensions in
mm.
Thermal Derating Curve
Cautionary Notes
1.
Operation beyond the specified maximum ratings
or improper use may result in damage and
possible ele
ctrical arcing and/or flame.
2.
These Polymer PTC (PPTC) devices are intended
for protection against occasional
overcurrent/overtemperature fault conditions and
may not be suitable for use in applications where
repeated and/or prolonged fault
conditions are
anticipated.
3.
Avoid con
tact of PTC device with chemical
solvent. Prolonged contact may adversely impact
the PTC
performance.
4.
These PTC devices may not be suitable for use in
circuits with a large inductance, as the PTC trip
can generate circuit voltage spikes above the PT
C
rated
voltage.
5.
These devices are intended for use in DC voltage
applications only. Use in AC voltage applications
should be first discusse
d with Bel Fuse
engineering.
6.
Not recommended for use on potted or conformal
coated PCB’s. Restriction of
free air flow could
affect electrical performance a
nd/or result in
device failure.
C
onsult Bel Fuse engineering.
7. MSL
: 2a (According to IPC J
-
Std
-
020).
P
S
W
Nominal
Nominal
Nominal
mm
Inch
mm
Inch
mm
Inch
3.40
0.133
1.50
0.059
4.60
0.181
Part Number
Dimensions
Marking Code
C
“b”, IH code
Min
Max
0ZCN0030FF2C
0.40
1.15
0030
0ZCN0055FF2A
0.40
1.70
0055
0ZCN0075FF2A
0.40
1.70
0075
0ZCN0110FF2C
0.30
0.70
0110
0ZCN0110AF2C
0.30
0.70
110
33
0ZCN0150FF2C
0.25
0.65
0150
0ZCN0200FF2C
0.25
0.65
0200
Spe
cifications subject to change without notice
Type 0ZC
N
Series
4
/
4
Bel Fuse Inc.
206 Van Vorst
Street
Jersey City, NJ 07302 USA
+1
201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit
-
protection
© 201
9
Bel
Fuse, Inc.
Rev. 0ZC
N
J
an
2019
Environmental Specifications
Temperature
cycling
JESD22 Method JA
-
Biased humidity
MIL
-
STD
-
202 Method 103
Operational life
MIL
-
STD
-
202 Method 108
Resistance to solvents
MIL
-
STD
-
202 Method 215
Mechanical shock
MIL
-
STD
-
202 Method 213
Vibration
MIL
-
STD
-
202 Method 204
Resistance to
soldering heat
MIL
-
STD
-
202 Method 210
Thermal shock
MIL
-
STD
-
202 Method 107
Solderability
ANSI/J
-
STD
-
002
Board flex(SMD)
AEC
-
Q200
-
005
Terminal strength
AEC
-
Q200
-
006
Solder Reflow and Rework Recommendations
Profile Feature
Pb
-
Free Assembly
Average
Ramp
-
Up Rate (Tsmax to Tp)
3
℃
/second max
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150
℃
200
℃
60
-
180 seconds
Time maintained above:
Temperature(T
L
)
217
℃
Time (
tL
)
60
-
150 seconds
Peak/Classification
Temperature(Tp) :
260
℃
T
ime within 5
℃
of actual Peak :
Temperature (tp)
20
-
40 seconds
Ramp
-
Down Rate :
6
℃
/second max.
Time 25
℃
to Peak Temperature :
8 minutes max
Solder Reflow
Due to “
lead free / RoHS
2
” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ”
zone of the
reflow profile are greater than those used for non
-
RoHS devices.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. Not Recom
mended For Wave Solder / Direct Immersion.
3. Recommended paste thickness range
–
0.20
–
0.25mm.
4. Devices are compatible with standard industry cl
eaning solvents and methods.
5. MSL
: 2a (According to IPC J
-
Std
-
020).
Caution
If reflow temperature / dwell
times exceed the recommended profile, the electrical performance of the PTC may be affected.
Rework
: MIL
-
STD
-
202G Method 210F, Test Condition A.
Standard Packaging
P/N
Explanation and Ordering Information
Part Number
Tape/Reel Qty
0ZCN0030FF2C
2,000
0ZCN0055FF2A
1,000
0ZCN0075FF2A
1,000
0ZCN0110FF2C
Thru
0ZCN0200FF2C
2,000
2000 or 1000 fuses in
7 inches dia. Reel, 8mm wide
tape, 4mm pitch, per EIA
-
481(equivalent
IEC
-
286 part 3).
Spe
cifications subject to change without notice