TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 D D D D D D D D D D D Qualified for Automotive Applications Rail-To-Rail Output Wide Bandwidth . . . 3 MHz High Slew Rate . . . 2 .4 V/s Supply Voltage Range . . . 2.7 V to 16 V Supply Current . . . 550 A/Channel Input Noise Voltage . . . 39 nV/Hz Input Bias Current . . . 1 pA Specified Temperature Range -40C to 125C . . . Automotive Grade Ultrasmall Packaging - 5-Pin SOT-23 (TLV271) Ideal Upgrade for TLC27x Family Operational Amplifier + - description The TLV27x takes the minimum operating supply voltage down to 2.7 V over the extended automotive temperature range while adding the rail-to-rail output swing feature. This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x also provides 3-MHz bandwidth from only 550 A. Like the TLC27x, the TLV27x is fully specified for 5-V and 5-V supplies. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (8 V supplies down to 1.35 V). The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications. The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micropower microcontrollers available today including Texas Instruments MSP430. SELECTION OF SIGNAL AMPLIFIER PRODUCTS VDD (V) VIO (V) Iq/Ch (A) IIB (pA) GBW (MHz) SR (V/s) SHUTDOWN RAILTORAIL SINGLES/DUALS/QUADS 2.7-16 500 550 1 3 2.4 -- O S/D/Q TLC27x 3-16 1100 675 1 1.7 3.6 -- -- S/D/Q TLV237x 2.7-16 500 550 1 3 2.4 Yes I/O S/D/Q TLC227x 4-16 300 1100 1 2.2 3.6 -- O D/Q TLV246x 2.7-6 150 550 1300 6.4 1.6 Yes I/O S/D/Q TLV247x 2.7-6 250 600 2 2.8 1.5 Yes I/O S/D/Q TLV244x 2.7-10 300 725 1 1.8 1.4 -- O D/Q DEVICE TLV27x Typical values measured at 5 V, 25C Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 FAMILY PACKAGE TABLE{ PACKAGE TYPES} NUMBER OF CHANNELS SOIC TLV271 1 TLV272 2 TLV274 4 DEVICE SOT-23 TSSOP MSOP 8 5 -- -- 8 -- -- 8 14 -- 14 -- UNIVERSAL EVM BOARD See the EVM Selection Guide (SLOU060) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. Product Preview TLV271 AVAILABLE OPTIONS PACKAGED DEVICES VIOMAX AT 25C TA -40C to 125C SOT-23 SMALL OUTLINE (D) 5 mV TLV271QDRQ1 (DBV) SYMBOL TLV271QDBVRQ1 271Q TLV272 AVAILABLE OPTIONS PACKAGED DEVICES VIOMAX AT 25C TA -40C to 125C 5 mV MSOP SMALL OUTLINE (D) (DGK) TLV272QDRQ1 TLV272QDGKRQ1 SYMBOL Product Preview TLV274 AVAILABLE OPTIONS PACKAGED DEVICES 2 TA VIOMAX AT 25C SMALL OUTLINE (D) TSSOP (PW) -40C to 125C 5 mV TLV274QDRQ1 TLV274QPWRQ1 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TLV27x PACKAGE PINOUTS(1) TLV271 D PACKAGE (TOP VIEW) TLV271 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 5 VDD NC IN - IN + GND 2 3 4 IN - 1 8 2 7 3 6 4 5 8 2 7 3 6 4 5 NC VDD OUT NC TLV274 D OR PW PACKAGE TLV272 D OR DGK PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + GND 1 (TOP VIEW) VDD 2OUT 2IN - 2IN+ 1OUT 1IN - 1IN+ VDD 2IN+ 2IN - 2OUT 1 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN - 4IN+ GND 3IN+ 3IN - 3OUT NC - No internal connection (1) SOT-23 may or may not be indicated TYPICAL PIN 1 INDICATORS Pin 1 Printed or Molded Dot Pin 1 Stripe Pin 1 Bevel Edges POST OFFICE BOX 655303 Pin 1 Molded "U" Shape * DALLAS, TEXAS 75265 3 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2 V to VDD + 0.2 V Input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA Output current range, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 125C Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential voltages, are with respect to GND. DISSIPATION RATING TABLE PACKAGE JC (C/W) JA (C/W) TA 25C POWER RATING TA = 25C POWER RATING D (8) 38.3 176 710 mW 396 mW D (14) 26.9 122.3 1022 mW 531 mW DBV (5) 55 324.1 385 mW 201 mW DGK (8) 54.23 259.96 481 mW 250 mW PW (14) 29.3 173.6 720 mW 374 mW recommended operating conditions Single supply Supply voltage voltage, VDD Split supply Common-mode input voltage range, VICR Operating free-air temperature, TA 4 Q-suffix POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MIN MAX 2.7 16 UNIT 1.35 8 0 VDD-1.35 V -40 125 C V TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) dc performance PARAMETER TEST CONDITIONS TA MIN 25C VIO Input offset voltage VIO Offset voltage drift /2 VIC = VDD/2, RL = 10 k, k VO = VDD/2 /2, RS = 50 VIC = 0 to VDD-1.35V, 1.35V, RS = 50 CMRR Common mode rejection ratio Common-mode 7V VDD = 2 2.7 VIC = 0 to VDD-1.35V, 1.35V, RS = 50 VDD = 5 V VIC = 0 to VDD-1.35V, 1.35V, RS = 50 VDD = 15 V VDD = 2 2.7 7V AVD Large signal differential voltage Large-signal amplification VO(PP) = VDD/2, RL = 10 k VDD = 5 V VDD = 15 V TYP MAX 0.5 5 Full range 7 25C 53 Full range 54 25C 58 Full range 57 25C 67 Full range 66 25C 95 Full range 76 25C 80 Full range 82 25C 77 Full range 79 mV V/C 2 25C UNIT 70 80 dB 85 106 110 dB 115 Full range is - 40C to 125C. If not specified, full range is - 40C to 125C. input characteristics PARAMETER TEST CONDITIONS TA 25C IIO Input offset current IIB Input bias current ri(d) Differential input resistance CIC Common-mode input capacitance VIC = VDD/2, VDD = 15 V, VO = VDD/2,, RS = 50 MIN TYP 1 125C 25C 1 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT 60 1000 125C f = 21 kHz MAX pA 60 1000 pA 25C 1000 G 25C 8 pF 5 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) output characteristics PARAMETER TEST CONDITIONS VDD = 2 2.7 7V VIC = VDD/2, /2 IOH = -1 1 mA VDD = 5 V VDD = 15 V VOH High level output voltage High-level VDD = 2 2.7 7V /2 IOH = -5 5 mA VIC = VDD/2, VDD = 5 V VDD = 15 V TA MIN TYP 25C 2.55 2.58 Full range 2.48 25C 4.9 Full range 4.85 25C 14.92 Full range 14.9 25C 1.88 Full range 1.42 25C 4.58 Full range 4.44 25C 14.7 Full range 14.6 25C VDD = 2 2.7 7V VIC = VDD/2, /2 IOL = 1 mA VDD = 5 V VDD = 15 V VOL Low level output voltage Low-level VIC = VDD/2, /2 IOL = 5 mA VDD = 5 V VO = 0 0.5 5 V from rail rail, VDD = 2.7 27V IO Output current VO = 0 0.5 5 V from rail rail, VDD = 5 V VO = 0 0.5 5 V from rail rail, VDD = 15 V 0.1 0.15 0.05 0.08 0.1 0.5 0.7 V 1.15 0.28 0.4 0.54 0.19 Full range 0.3 0.35 25C 4 25C 5 Positive rail 25C 7 Negative rail 25C 8 Positive rail 25C 13 Negative rail 25C 12 * DALLAS, TEXAS 75265 0.15 0.22 0.05 Negative rail Full range is - 40C to 125C. If not specified, full range is - 40C to 125C. Depending on package dissipation rating POST OFFICE BOX 655303 0.1 Positive rail 6 14.8 Full range 25C VDD = 15 V 4.68 Full range 25C V 2.1 Full range 25C VDD = 2 2.7 7V 14.96 Full range 25C UNIT 4.93 Full range 25C MAX mA TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) power supply PARAMETER IDD TEST CONDITIONS Supply current (per channel) VO = VDD/2 Supply voltage rejection ratio (VDD /VIO) VDD = 2.7 V to 15 V, No load MIN TYP MAX VDD = 2.7 V 25C 470 560 VDD = 5 V 25C 550 660 25C 750 900 VDD = 15 V PSRR TA VIC = VDD /2, Full range UNIT A 1200 25C 70 Full range 65 80 dB Full range is - 40C to 125C. If not specified, full range is - 40C to 125C. dynamic performance PARAMETER UGBW Unity gain bandwidth TA TEST CONDITIONS k, CL = 10 pF RL = 2 k 25C 2.4 VDD = 5 V to 15 V 25C 3 25C Slew rate at unity gain VO(PP) = VDD/2, CL = 50 pF, RL = 10 k, VDD = 5 V VDD = 15 V m ts TYP VDD = 2.7 V VDD = 2 2.7 7V SR MIN Full range 1.4 MAX MHz 2.1 V/ s V/s 1 25C 1.4 Full range 1.2 25C 1.9 Full range 1.4 UNIT 2.4 V/ s V/s 2.1 V/ s V/s Phase margin RL = 2 k CL = 10 pF 25C 65 Gain margin RL = 2 k CL = 10 pF 25C 18 dB VDD = 2.7 V, V(STEP)PP = 1 V, AV = -1, CL = 10 pF, RL = 2 k 0.1% VDD = 5 V, 15 V, V(STEP)PP = 1 V, AV = -1, CL = 47 pF, RL = 2 k 0.1% Settling time 2.9 ss 25C 2 Full range is - 40C to 125C. If not specified, full range is - 40C to 125C. noise/distortion performance PARAMETER THD + N TEST CONDITIONS VDD = 2.7 V, VO(PP) = VDD/2 V, RL = 2 k, f = 10 kHz AV = 1 VDD = 5 V, 5 V, VO(PP) = VDD/2 V, RL = 2 k, f = 10K AV = 1 Total harmonic distortion plus noise AV = 10 TA Equivalent input noise voltage In Equivalent input noise current UNIT 0.05% 0.02% 25C 25 C AV = 100 0.09% 0.5% 39 25C f = 10 kHz f = 1 kHz POST OFFICE BOX 655303 MAX 0.18% f = 1 kHz Vn TYP 0.02% 25C 25 C AV = 100 AV = 10 MIN 25C * DALLAS, TEXAS 75265 35 0.6 nV/Hz fA /Hz 7 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS Table of Graphs FIGURE CMRR Common-mode rejection ratio vs Frequency Input bias and offset current vs Free-air temperature 1 VOL Low-level output voltage vs Low-level output current 3, 5, 7 VOH High-level output voltage vs High-level output current 4, 6, 8 VO(PP) Peak-to-peak output voltage vs Frequency 9 IDD Supply current vs Supply voltage 10 PSRR Power supply rejection ratio vs Frequency 11 AVD Differential voltage gain & phase vs Frequency 12 Gain-bandwidth product vs Free-air temperature 13 vs Supply voltage 14 vs Free-air temperature 15 2 SR Slew rate m Phase margin vs Capacitive load 16 Vn Equivalent input noise voltage vs Frequency 17 Voltage-follower large-signal pulse response 18, 19 Voltage-follower small-signal pulse response 20 Inverting large-signal response 21, 22 Inverting small-signal response Crosstalk 8 23 vs Frequency POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 24 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS 100 VDD = 5 V, 10 V 80 60 VDD = 2.7 V 40 20 0 10 100 1k 100 k 10 k 1M 250 VDD = 2.7 V, 5 V and 10 V VIC = VDD/2 200 150 100 50 0 -40 -25 -10 5 TA =-40C TA = 125C TA = 70C TA = 25C 0.80 TA = 0C 0.40 TA = 125 C 4.00 TA = 70 C 3.50 3.00 2.50 TA = 25 C 2.00 1.50 TA = 0 C 1.00 TA = -40 C 0.50 1 2 3 4 5 6 7 8 9 10 11 12 IOH - High-Level Output Current - mA 8 TA =70C TA =25C TA =0C TA =-40C 2 80 100 IOL - Low-Level Output Current - mA Figure 7 3.00 2.50 TA = 25C 2.00 1.50 TA = 70C 1.00 TA = 125C 0.50 5 10 10 VDD = 10 V 8 TA = -40C 6 TA = 0C 4 TA = 25C 2 120 TA = 70C TA = 125C 0 20 40 60 80 100 120 IOH - High-Level Output Current - mA Figure 8 POST OFFICE BOX 655303 15 20 25 30 35 40 45 IOH - High-Level Output Current - mA Figure 6 0 0 60 TA = 0C 3.50 0 PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY V O(PP) - Peak-to-Peak Output Voltage - V TA =125C 40 TA = -40C 4.00 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 IOL - Low-Level Output Current - mA HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT V OH - High-Level Output Voltage - V VOL - Low-Level Output Voltage - V VDD = 10 V 20 VCC = 5 V 4.50 Figure 5 10 0 2 4 6 8 10 12 14 16 18 20 22 24 IOL - Low-Level Output Current - mA 0.00 Figure 4 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT TA = 0 C TA = 40 C 5.00 VDD = 5 V 4.50 0.00 4 0.40 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT V OH - High-Level Output Voltage - V VOL - Low-Level Output Voltage - V V OH - High-Level Output Voltage - V 2.40 6 TA = 70 C TA = 25 C 0.80 Figure 3 5.00 VDD = 2.7 V 0 1.20 0 20 35 50 65 80 95 110 125 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 2.80 1.20 1.60 Figure 2 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 1.60 2.00 TA - Free-Air Temperature - C Figure 1 2.00 VDD = 2.7 V 2.40 T = 125 C A 0.00 -50 f - Frequency - Hz 0.00 2.80 300 VOL - Low-Level Output Voltage - V 120 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT INPUT BIAS AND OFFSET CURRENT vs FREE-AIR TEMPERATURE I IB I IO - Input Bias and Offset Current - pA CMRR - Common-Mode Rejection Ratio - dB COMMON-MODE REJECTION RATIO vs FREQUENCY * DALLAS, TEXAS 75265 11 VDD = 10 V 10 9 8 7 6 AV = -10 RL = 2 k CL = 10 pF TA = 25C THD = 5% 5 VDD = 5 V 4 3 2 VDD = 2.7 V 1 0 10 100 1k 10 k 100 k 1M 10 M f - Frequency - Hz Figure 9 9 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS POWER SUPPLY REJECTION RATIO vs FREQUENCY SUPPLY CURRENT vs SUPPLY VOLTAGE AV = 1 VIC = VDD / 2 I DD - Supply Current - mA/ch 0.9 PSRR - Power Supply Rejection Ratio - dB 1.0 TA = 125C 0.8 TA = 70C 0.7 0.6 0.5 0.4 TA = 25C 0.3 TA = 0C 0.2 TA = -40C 0.1 0.0 120 TA = 25C 100 VDD = 5 V, 10 V 80 VDD = 2.7 V 60 40 20 0 10 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VDD - Supply Voltage - V 100 1k 180 100 135 Phase 4.0 90 45 60 0 Gain -45 20 -90 VDD=5 V RL=2 k CL=10 pF TA=25C 0 -20 -40 10 100 -135 1k 10 k 100 k 1 M -180 10 M 3.5 VDD = 10 V 3.0 2.5 2.0 VDD = 5 V VDD = 2.7 V 1.5 1.0 0.5 0.0 -40 -25 -10 5 Figure 13 Figure 12 SLEW RATE vs FREE-AIR TEMPERATURE SLEW RATE vs SUPPLY VOLTAGE SR+ 1.0 AV = 1 RL = 10 k CL = 50 pF TA = 25C 0.5 6.5 8.5 10.5 VCC - Supply Voltage -V Figure 14 10 12.5 80 SR- 2.5 2.0 SR+ 1.5 VDD = 5 V AV = 1 RL = 10 k CL = 50 pF VI = 3 V 1.0 0.5 0.0 14.5 VDD = 5 V RL= 2 k TA = 25C AV = Open Loop 90 0.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C Figure 15 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 Phase Margin - 2.0 4.5 100 3.0 SR - Slew Rate - V/ s SR - Slew Rate - V/ s SR- 2.5 PHASE MARGIN vs CAPACITIVE LOAD 3.5 3.0 1.5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C f - Frequency - Hz 2.5 1M GAIN BANDWIDTH PRODUCT vs FREE-AIR TEMPERATURE GBWP -Gain Bandwidth Product - MHz 120 Phase - AVD - Differential Voltage Gain - dB DIFFERENTIAL VOLTAGE GAIN AND PHASE vs FREQUENCY 40 100 k Figure 11 Figure 10 80 10 k f - Frequency - Hz 70 Rnull = 100 60 50 40 Rnull = 0 30 Rnull = 50 20 10 0 10 100 CL - Capacitive Load - pF Figure 16 1000 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE VDD = 2.7, 5, 10 V TA = 25C 90 4 80 70 60 50 3 2 1 VDD = 5 V AV = 1 RL = 2 k CL = 10 pF VI = 3 VPP TA = 25C VI 0 40 3 30 2 20 1 VO 10 0 0 100 1k 10 k f - Frequency - Hz 0 100 k 2 6 4 2 VO 0 0 2 4 6 8 0.12 0.08 VDD = 5 V AV = 1 RL = 2 k CL = 10 pF VI = 100 mVPP TA = 25C 0.04 VI 0.00 0.04 VO 0.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 10 12 14 16 18 t - Time - s Figure 20 Figure 19 4 VDD = 5 V AV = 1 RL = 2 k CL = 10 pF VI = 3 VPP TA = 25C 1 0 3 2 1 0 VO 0 2 4 6 8 10 12 14 V - Output Voltage - V O VI 16 INVERTING LARGE-SIGNAL RESPONSE V I - Input Voltage - V INVERTING LARGE-SIGNAL RESPONSE 2 0.12 0.08 t - Time - s 3 10 12 14 16 18 V - Output Voltage - mV O 0 V - Output Voltage - V O VDD = 10 V AV = 1 RL = 2 k CL = 10 pF VI = 6 VPP TA = 25C V - Input Voltage - mV I V - Input Voltage - V I 6 VI 8 VOLTAGE-FOLLOWER SMALL-SIGNAL PULSE RESPONSE 8 2 6 Figure 18 VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE 4 4 t - Time - s 8 6 VDD = 10 V AV = VI = -1 RL = 2 k CL = 10 pF TA = 25C 4 2 0 VI 6 VO 4 2 0 0 t - Time - s 2 4 6 8 10 t - Time - s 12 14 V O - Output Voltage - V 10 Figure 17 V - Input Voltage - V I V - Output Voltage - V O 100 V - Input Voltage - V I V n - Equivalent Input Noise Voltage - nV/ Hz EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 16 Figure 22 Figure 21 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS CROSSTALK vs FREQUENCY 0 0.00 -40 VDD = 5 V AV = VI = -1 RL = 2 k CL = 10 pF VI = 100 mVpp TA = 25C VI 0.10 VO 0.05 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Crosstalk - dB 0.05 VDD = 2.7, 5, & 15 V VI = 1 VDD/2 AV = 1 RL = 2 k TA = 25C -20 0.10 V O - Output Voltage - V V I - Input Voltage - V INVERTING SMALL-SIGNAL RESPONSE -60 -80 -100 Crosstalk -120 -140 10 100 1k 10 k f - Frequency - Hz t - Time - s 100 k Figure 24 Figure 23 APPLICATION INFORMATION driving a capacitive load When the amplifier is configured in this manner, capacitive loading directly on the output decreases the device's phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series (RNULL) with the output of the amplifier, as shown in Figure 25. A minimum value of 20 should work well for most applications. RF RG - Input + RNULL Output CLOAD VDD/2 Figure 25. Driving a Capacitive Load 12 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 APPLICATION INFORMATION offset voltage The output offset voltage (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. The following schematic and formula can be used to calculate the output offset voltage: RF IIB- RG + - VI + RS V VO OO +V IO R 1) R F "I G IB) R S 1) R R F G "I IB- R F IIB+ Figure 26. Output Offset Voltage Model general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 27). RG RF V O + V I VDD/2 VI 1) R R F G 1 1 ) sR1C1 - VO + R1 f -3dB + 1 2pR1C1 C1 Figure 27. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task. For the best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to do this can result in phase shift of the amplifier. C1 + _ VI R1 R1 = R2 = R C1 = C2 = C Q = Peaking Factor (Butterworth Q = 0.707) R2 f C2 RF RG -3dB RG = + ( 1 2pRC RF 1 2- Q ) VDD/2 Figure 28. 2-Pole Low-Pass Sallen-Key Filter POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV27x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D Ground planes--It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. D Proper power supply decoupling--Use a 6.8-F tantalum capacitor in parallel with a 0.1-F ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-F ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-F capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. D Sockets--Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. D Short trace runs/compact part placements--Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance at the input of the amplifier. D Surface-mount passive components--Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. 14 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 APPLICATION INFORMATION general power dissipation considerations For a given JA, the maximum power dissipation is shown in Figure 29 and is calculated by the following formula: P D + Where: PD TMAX TA JA T -T MAX A q JA = Maximum power dissipation of TLV27x IC (watts) = Absolute maximum junction temperature (150C) = Free-ambient air temperature (C) = JC + CA JC = Thermal coefficient from junction to case CA = Thermal coefficient from case to ambient air (C/W) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 2 Maximum Power Dissipation - W 1.75 PDIP Package Low-K Test PCB JA = 104C/W 1.5 1.25 SOIC Package Low-K Test PCB JA = 176C/W TJ = 150C MSOP Package Low-K Test PCB JA = 260C/W 1 0.75 0.5 0.25 SOT-23 Package Low-K Test PCB JA = 324C/W 0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 29. Maximum Power Dissipation vs Free-Air Temperature POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 15 TLV271-Q1, TLV272-Q1, TLV274-Q1 FAMILY OF 550-A/Ch 3-MHz RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS SGLS275A - OCTOBER 2004 - REVISED JUNE 2008 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts Release 9.1, the model generation software used with Microsim PSpice . The Boyle macromodel (see Note 2) and subcircuit in Figure 30 are generated using TLV27x typical electrical and operating characteristics at TA = 25C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D Maximum positive output voltage swing D Unity-gain frequency D Maximum negative output voltage swing D Common-mode rejection ratio D Slew rate D Phase margin D Quiescent power dissipation D DC output resistance D Input bias current D AC output resistance D Open-loop voltage amplification D Short-circuit output current limit NOTE 2: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, "Macromodeling of Integrated Circuit Operational Amplifiers," IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). 3 99 VDD + egnd rd1 rd2 rss ro2 css fb rp - c1 7 11 12 + c2 vlim 1 + r2 9 6 IN+ - vc D D 8 + - vb ga 2 G G - IN- ro1 gcm ioff 53 S S OUT dp 91 10 iss GND 4 dlp + dc - ve + 54 vlp - + hlim - 5 92 - vln + de *DEVICE=amp_tlv27x_highVdd,OP AMP,NJF,INT * amp_tlv_27x_highVdd operational amplifier "macromodel" * subcircuit updated using Model Editor release 9.1 on 05/15/00 * at 14:40 Model Editor is an OrCAD product. * * connections: non-inverting input * | inverting input * | | positive power supply * | | | negative power supply * | | | | output * | | | | | .subckt amp_tlv27x_highVdd 1 2 3 4 5 * c1 11 12 457.48E-15 c2 6 7 5.0000E-12 css 10 99 1.1431E-12 dc 5 53 dy de 54 5 dy dlp 90 91 dx dln 92 90 dx dp 4 3 dx egnd 99 0 poly(2) (3,0) (4,0) 0 .5 .5 fb 7 99 poly(5) vb vc ve vlp vln 0 176.02E6 -1E3 1E3 180E6 -180E6 ga gcm iss hlim j1 J2 r2 rd1 rd2 ro1 ro2 rp rss vb vc ve vlim vlp vln .model .model .model .model .ends 6 0 10 90 11 12 6 3 3 8 7 3 10 9 3 54 7 91 0 dx dy jx1 jx2 0 11 12 16.272E-6 6 10 99 6.8698E-9 4 dc 1.3371E-6 0 vlim 1K 2 10 jx1 1 10 jx2 9 100.00E3 11 61.456E3 12 61.456E3 5 10 99 10 4 150.51E3 99 149.58E6 0 dc 0 53 dc .78905 4 dc .78905 8 dc 0 0 dc 14.200 92 dc 14.200 D(Is=800.00E-18) D(Is=800.00E-18 Rs=1m Cjo=10p) NJF(Is=500.00E-15 Beta=198.03E-6 Vto=-1) NJF(Is=500.00E-15 Beta=198.03E-6 Vto=-1) Figure 30. Boyle Macromodel and Subcircuit PSpice and Parts are trademarks of MicroSim Corporation. 16 90 dln POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV271QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV271QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV272QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV272QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV274QDRG4Q1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV274QDRQ1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV274QPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV274QPWRQ1 ACTIVE TSSOP PW 14 Call TI Samples (Requires Login) TLV271QDBVRQ1 TBD (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF TLV271-Q1, TLV272-Q1, TLV274-Q1 : * Catalog: TLV271, TLV272, TLV274 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. 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