PACKAGE OUTLINES
Page
SOT78 (TO-220AB) 754
SOT82 755
SOT186(TO-220) 756
SOT186A (Isolated TO-220AB) 757
SOT199 758
SOT399 (TOP3D) 759
SOT429 (TO-247) 760
SOT430 (TOP3L) 761
1998 Sep 23 754
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT78 TO-220AB
D
D1
q
P
L
123
L
2
(1)
b1
ee
b
0 5 10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78
DIMENSIONS (mm are the original dimensions)
AE
A1
c
Note
1. Terminals in this zone are not tinned.
Q
L1
UNIT A1b1D1eP
mm 2.54
qQ
AbD
cL
2
(1)
max.
3.0 3.8
3.6
15.0
13.5 3.30
2.79 3.0
2.7 2.6
2.2
0.7
0.4 15.8
15.2
0.9
0.7 1.3
1.0
4.5
4.1 1.39
1.27 6.4
5.9 10.3
9.7
L1
EL
97-06-11
1998 Sep 23 755
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
Note
1. Terminal dimensions within this zone are uncontrolled to allow for body and terminal irregularities.
SOT82 97-06-11
0 2.5 5 mm
scale
Plastic single-ended package; 3 leads (in-line) SOT82
D
L1
q
E A
P
L
Q
321
c
e1
e
b
UNIT D
bEewqQPL
cL1(1)
max.
e1
0.254
DIMENSIONS (mm are the original dimensions)
A
4.58
mm 2.8
2.3 0.88
0.65 0.58
0.47 11.1
10.5 7.8
7.2 2.29 16.5
15.3 2.54 1.5
0.9 3.9
3.5
3.1
2.5
wM
1998 Sep 23 756
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT186 TO-220
0 5 10 mm
scale
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3 lead TO-220 exposed tabs SOT186
A
A1
Q
c
Note
1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.
D
D1
L
L2
L1
m
q
e1
e
bwM
123
E
1
E
P
b
1
UNIT D
b1D1eqQPL
cL2
e1
A
5.08
mm 4.4
4.0
A1
2.9
2.5
b
0.9
0.7 1.5
1.3 0.55
0.38 17.0
16.4 7.9
7.5
E
10.2
9.6 5.7
5.3
E1
2.54 14.3
13.5 10 0.4
L1(1)
4.8
4.0 1.4
1.2 4.4
4.0
w
3.2
3.0
m
0.9
0.5
DIMENSIONS (mm are the original dimensions)
97-06-11
1998 Sep 23 757
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT186A TO-220
0 5 10 mm
scale
Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 SOT186A
A
A1
Q
c
K
j
Notes
1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.
2. Both recesses are ∅ 2.5 × 0.8 max. depth
D
D1
L
L2L1
b1
b2
e1
e
bwM
123
q
E
P
T
UNIT D
b1D1eqQPL
cL2(1)
max.
e1
A
5.08 3
mm 4.6
4.0
A1
2.9
2.5
b
0.9
0.7 1.1
0.9
b2
1.4
1.2 0.7
0.4 15.8
15.2 6.5
6.3
E
10.3
9.7 2.54 14.4
13.5
T(2)
2.5 0.4
L1
3.30
2.79
j
2.7
2.3
K
0.6
0.4 2.6
2.3 3.0
2.6
w
3.2
3.0
DIMENSIONS (mm are the original dimensions)
97-06-11
1998 Sep 23 758
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT199 97-06-27
D
m
L
L1
b1
0 5 10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads (in-line) SOT199
α
45°
A
A1
Q
c
Note
1. Terminals in this zone are not tinned.
e1
ebwM
123
P
E
1
q
E
α
UNIT DeqQPL
ce1
A
10.9
mm 5.2
4.8
A1
3.4
3.0
b
1.2
1.0
b1
2.1
1.9 0.6
0.5 21.5
20.5
E1
7.8
6.8
E
15.3
14.7 5.45 16.5
15.7 0.4
L1(1)
3.7
3.3 2.1
1.9
m
0.8
0.6 6.2
5.8
w
3.3
3.1
DIMENSIONS (mm are the original dimensions)
1998 Sep 23 759
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT399
D
m
L
b1
L1
0 5 10 mm
scale
Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads SOT399
α
27°
23°
A
A1
Q
c
k
Note
1. Tinning of terminals are uncontrolled within zone L1.
e e
bwM
123
P
q
q
1
D
2
D
1
E
α
UNIT D1eqQPL
c
A
mm 5.8
4.8
A1
3.3
2.7
k
2.2
1.8
b
1.2
0.9
b1
2.2
1.8
b2
4.7
4.2 0.9
0.6 22.5
21.5
D2
10.2
9.9
D
27
26
E
16
15 5.45 19.1
18.1
L1(1)
5.4
4.8
q1
25.7
25.1
3.4
3.2
m
0.8
0.6 4.7
4.3 0.4
w
3.4
3.1
DIMENSIONS (mm are the original dimensions)
b2
98-11-06
1998 Sep 23 760
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT429 TO-247 98-04-07
0 10 20 mm
scale
Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247 SOT429
E
PA
A1
β
wM
b
123
ee
b
1
b
2
c
Q
q
L
Y
R
D
S
L
1
(1)
α
UNIT A1D
bEewSRqQPLY
b
2
b
1
c
L
1
(1)
DIMENSIONS (mm are the original dimensions)
Aβ
α
mm 17°
13°
6°
4°
5.3
4.7 1.9
1.7 2.2
1.8
1.2
0.9 3.2
2.8 0.9
0.6 21
20 16
15 5.45 3.7
3.3 2.6
2.4 5.3 7.5
7.1 0.4 15.7
15.3
16
15 4.0
3.6 3.5
3.3
Note
1. Tinning of terminals are uncontrolled within zone L1.
1998 Sep 23 761
Philips Semiconductors
Power Bipolar Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT430 97-06-23
0 10 20 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead JUMBO TO-247 SOT430
wM
b
123
ee
b
1
c
R
L
1
(1)
R1
R2
R2
Note
1. Terminals are uncontrolled within zone L1.
q
L
Y
D
S
A
A1
UNIT A1D
bE
max. ewSRq
Q
max.
P
L
min. Y
b2
max.
b1
max. c
max. L1
DIMENSIONS (mm are the original dimensions)
A
max.
mm 5.3 2.3 2.5
1.0
0.8 3.5 0.8 26.5
25.5 20.5 5.45 3.5
3.1 3.0 6.0 16 0.4 20.5
19.5
19.5 2.5 4.0
R1
3.0
R2
1.5
Q
E
P
b2