Data sheet acquired from Harris Semiconductor SCHS109B - Revised June 2003 The CD4059A-series types are supplied in 24-lead dual-in-line plastic packages (E suffix), and 24-lead small-outline packages (M and M96 suffixes). Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated Copyright 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD4059AD3 ACTIVE CDIP SB JD 24 1 TBD Call TI N / A for Pkg Type CD4059AE ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD4059AEE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD4059AM ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4059AM96 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4059AM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4059AME4 ACTIVE SOIC DW 24 CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MCDI005 - JANUARY 1998 JD (R-CDIP-T**) CERAMIC SIDE-BRAZE DUAL-IN-LINE PACKAGE 24 PINS SHOWN A 24 13 0.590 (15,00) TYP 1 12 0.065 (1,65) 0.045 (1,14) 0.620 (15,75) 0.590 (14,99) 0.175 (4,45) 0.140 (3,56) 0.075 (1,91) MAX (4 Places) Seating Plane 0.020 (0,51) MIN 0.021 (0,53) 0.015 (0,38) 0.100 (2,54) PINS ** DIM A MAX 0- 15 0.125 (3,18) MIN 0.012 (0,30) 0.008 (0,20) 24 28 40 48 52 1.250 (31,75) 1.450 (36,83) 2.050 (52,07) 2.435 (61,85) 2.650 (67,31) 4040087/B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package is hermetically sealed with a metal lid. The terminals are gold-plated. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI006B - SEPTEMBER 2001 - REVISED APRIL 2002 N (R-PDIP-T24) PLASTIC DUAL-IN-LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0'-15' 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051-3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-010 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI008 - OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0- 15 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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