NOTES: UNLESS OTHERWISE SPECIFIED
1. MATERIAL: PER IPC-4101/24
1A. LAMINATE: HIGH-TEMPERATURE FR4
1B. FINISHED BOARD: .0020 +/-.0005 INCH OUTSIDE LAYERS, COPPER.
1C. ALL COPPER LAYERS MUST BE SPACED PER DETAIL "A".
1D. BOARD THICKNESS IS MEASURED INCLUDING TOP AND BOTTOM SIDES
FINISHED COPPER. ANY TIN, TIN/LEAD OR GOLD PLATING, SOLDERMASK
AND SILKSCREEN LEGEND MUST NOT BE INCLUDED IN FINISHED BOARD
THICKNESS.
2. THE CONDUCTOR PATTERN MUST BE ETCHED USING ARTWORK 880011846-002
REV A SUPPLIED WITHIN FABRICATION FILES' ARCHIVE 885011846-002 REV A OR
GREATER.
3. ALL CONDUCTOR LAYERS MUST BE REGISTERED WITHIN +/- .005 INCH FROM
TRUE POSITION.
4. ETCH TOLERANCES:
4A. ALL EXTERNAL LAYERS CONDUCTOR WIDTH MUST BE WITHIN +/- .0015
INCH OR +/- 15% OF GERBER DATA, WHICHEVER IS SMALLER.
5. BOARD MUST BE NC DRILLED USING DRILL DATA SUPPLIED.
6. DRILL TOLERANCES AND HOLE SIZES ARE FOR FINISHED BOARD:
ALL PLATED THROUGH HOLES TO .080 INCH ARE +/- .003 INCH.
ALL PLATED THROUGH HOLES OVER .081 INCH ARE +/- .005 INCH.
ALL NON-PLATED THROUGH HOLES ARE +/- .005 INCH.
7. ALL HOLES MUST BE REGISTERED WITHIN +/-.003 INCH FROM TRUE POSITION.
8. MINIMUM ANNULAR RING MUST BE .002 INCH.
9. PLATING:
9A. PER MIL-C-14550, PLATED THROUGH HOLES MUST BE PLATED WITH .0008
MIN. TO .0015 INCH MAX. THICK COPPER.
9B. FINISH: IMMERSION GOLD: 2 TO 8 MICROINCHES GOLD OVER 120-240
MICROINCHES OF ELECTROLESS NICKEL.
10. WARP AND TWIST OF FINISHED BOARDS MUST NOT EXCEED .007 INCH PER INCH.
11. SOLDERMASK: PER IPC-SM-840
11A. SOLDERMASK BOTH TOP AND BOTTOM SIDES.
11B. SOLDERMASK MUST CLEAR ALL LANDS SHOWN ON GERBER SOLDERMASK
LAYERS, EXCEPT FOR BARREL TENTING ON 0.025 INCH VIA PADS.
11C. COLOR GREEN AND SOLVENT FREE.
11D. LIQUID PHOTO-IMAGEABLE MUST BE .0002 MIN. TO .0008 MAX. INCH THICK
MEASURED OVER COPPER PLATING.
12. SILKSCREEN TOP AND BOTTOM SIDES USING A GLOSSY WHITE,
NONCONDUCTIVE, EPOXY BASED INK. NO SILKSCREEN ALLOWED ON GOLD
AREAS, ON PADS OR IN HOLES.
13. ROUTE BOARD OUTLINE, PER DRAWING DIMENSIONS.
14. VENDOR MUST ENTER VENDOR'S IDENTITY, DATE CODE AND ANY OTHER
IDENTIFICATION MARKS ON BOTTOM SIDE ETCH APPROXIMATELY WHERE
SHOWN.
15. OTHER VENDOR NOMENCLATURE OR MARKINGS SHOULD NOT BE ETCHED OR
SILKSCREENED ON BOARD WITHOUT PRIOR PERMISSION.
TopEtch
BotEtch
0.063 +/- 0.007
DETAIL A
LAYER STACKUP
SCALE: NONE
Board Fabrication Information
Smallest Feature
Air Gap .010 inch
Trace Width .015 inch
Hole Size .025 inch
Pad Size .024 x .06 inch
Surface Mount Top & Bottom
16. ALL VENDOR IN-PROCESS MARKINGS, QA STAMPS, ETC. MUST BE PLACED ON
THE BOTTOM SIDE OF BOARD.
17. FINISHED BOARD MUST MEET UL94V-0 RATING AND RoHS COMPLIANCE.
18. DOCUMENTATION THAT MUST BE DELIVERED WITH BOARDS:
18A. CROSS SECTION REPORT (SPACING BETWEEN COPPER LAYERS AND
COPPER THICKNESS)
18B. ELECTRICAL TEST CERTIFICATION OF COMPLIANCE (ACCORDANCE WITH
IPC-ET-652 CLASS II)
18C. CERTIFICATION OF COMPLIANCE (BOARD HAS BEEN MANUFACTURED TO
DRAWING REQUIREMENTS)
18D. RoHS CERTIFICATE OF COMPLIANCE.
REV DESCRIPTION DATE APPD
A Etch 002 Production Release 12/03/07
MATERIAL: DRAWN: DATE:
FINISH: CHECKED: DATE:
ENGINEER: DATE:
TOLERANCES
1 PL 2 PL 3 PL
± .02 ± .01 ± .005
SEE NOTES Ernesto Rey
SEE NOTES
UNLESS OTHERWISE SPECIFIED, ALL DIMENSIONS ARE IN INCHES
03-Dec-07
1
Bob Holtz
B
SCALE:
NONE SHEET OF 2 REV
DRAWING:
551011846-002
A
PCB FABRICATION DRAWING
LMH730036 Eval
BOARD & SYSTEM
BUSINESS OPERATIONS
REVISIONS
DO NOT COPY, DISPLAY, OR USE
DRAWING WITHOUT AUTHORIZATION
DO NOT SCALE DRAWING
2
0.110
0.110
1.490
1.390
1.60
1.50
0.025 YES 8
0.035 YES 4
0.055 YES 23
0.120 YES 4
DRILL CHART
ALL UNITS ARE IN INCHES
SYM SIZE PLATED QTY
14
0
0
B
SCALE:
NONE SHEET OF 2 REV
DRAWING:
551011846-002
A
PCB FABRICATION DRAWING
LMH730036 Eval
BOARD & SYSTEM
BUSINESS OPERATIONS
REVISIONS
DO NOT COPY, DISPLAY, OR USE
DRAWING WITHOUT AUTHORIZATION
DO NOT SCALE DRAWING
SEE SHEET #1
