GE Data Sheet
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 1
ESTW004A2C Stingray* Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
Features
Compliant to RoHS EU Directive 2011/65/EU (-Z versions)
Compliant to REACH Directive (EC) No 1907/2006
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 7.6mm
(2.28 in x 0.9 in x 0.30 in)
Low profile height and reduced component skyline
Wide input voltage range: 36-75 Vdc
Tightly regulated output
Remote sense
Output Voltage adjust: 80% to 110% of Vo,nom
Constant switching frequency
Positive remote On/Off logic
Input under/over voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
No reverse current during output shutdown
Wide operating temperature range (-40°C to 85°C)
Suitable for cold wall cooling using suitable Gap Pad
applied directly to top side of module
UL# 60950-1 2nd Ed. Recognized, CSA† C22.2 No. 60950-1-
07 Certified, and VDE‡ (EN60950-1 2nd Ed.) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3¤
PoE standards
ISO**9001 and ISO 14001 certified manufacturing facilities
Applications
Wireless Networks
Access and Optical Network Equipment
Industrial Equipment
Options
Negative Remote On/Off logic (preferred)
Over current/Over voltage protections (Auto-restart)
(preferred)
Heat plate version (-H)
Surface Mount version (-S)
Description
The ESTW004A2C Series, eighth-brick, low-height power modules are isolated dc-dc converters that provide a single,
precisely regulated output voltage over a wide input voltage range of 36-75Vdc. The ESTW004A2C provides 15Vdc nominal
output voltage rated for 4.2Adc output current. The module incorporates Lineage Power’s vast heritage for reliability and
quality, while also using the latest in technology, and component and process standardization to achieve highly
competitive cost. The open frame module construction, available in both surface-mount and through-hole packaging,
enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater
than 90% at VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage,
overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink
attachment to achieve higher output current in high temperature applications.
* Trademark of General Electric Company
# UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 2.0 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load 90 mA
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 5 8 mA
(VIN = 48V, module disabled)
Inrush Transient All I2t 0.5 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO=
IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a
fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in
this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used.
Refer to the fuse manufacturer’s data sheet for further information.
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN= 48V IO=IO, max, TA=25°C) All VO, set 14.7 15.0 15.3 Vdc
Output Voltage
All VO 14.55 15.45 Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max) All
±0.2 % VO, set
Load (IO=IO, min to IO, max) All ±0.2 % VO, set
Temperature (Tref=TA, min to TA, max) All
±1.0 % VO, set
Output Ripple and Noise
(VIN=48V, IO= IO, max, TA=25°C, see Figure 7.)
RMS (5Hz to 20MHz bandwidth) All 35 60 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 100 180 mVpk-pk
External Capacitance All CO, max 0 2,000 μF
Output Current All IO 0 4.2 Adc
Output Power (IO ≤ IO, max) All PO 0 63 W
Output Current Limit Inception (Hiccup Mode ) All IO, lim 4.6 5.2 6.0 Adc
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 5 Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN=48V, TA=25°C, IO=2.1A, VO = 15V All η 88.0 %
VIN=48V, TA=25°C, IO=4.2A, VO= 15V All η 90.0 %
Switching Frequency All fsw 280 kHz
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = 48V; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk 3 % VO, set
Settling Time (Vo<10% peak deviation) All ts 200 s
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 100 MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc
General Specifications
Parameter Device Symbol Typ Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2:
Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm,
90% confidence)
All FIT 321.5 109/Hours
All MTBF 3,110,164 Hours
Weight (Open Frame) All 19 (0.7) g (oz.)
Weight (with Heatplate) All 30 (1.1) g (oz.)
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (Von/off = -0.7Vdc) All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage (Ion/off = 0Adc) All Von/off 2.5 6.7 Vdc
Logic High maximum allowable leakage current All Ion/off 25 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for at least 1second,
and then the On/Off input is set from OFF to ON
(Tdelay = on/off pin transition until VO = 10% of VO, set)
All Tdelay — 12 — msec
Case 2: On/Off input is set to Module ON, and then input
power is applied
(Tdelay = VIN reaches VIN, min until VO = 10% of VO,set)
All Tdelay — 25 35 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise — 15 25 msec
Output voltage overshoot – Startup All
— 3 % VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment Range All 80 110 % VO, set
Output Overvoltage Protection All VO, limit 17.0 20.0 Vdc
Overtemperature Protection – Hiccup Auto Restart Open
Frame Tref1 135 OC
Heat
Plate Tref2 120 OC
Input Undervoltage Lockout All VUVLO
Turn-on Threshold 34 36 Vdc
Turn-off Threshold 30 32 34 Vdc
Hysteresis 1 2 Vdc
Input Overvoltage Lockout All VOVLO
Turn-on Threshold 76 77 Vdc
Turn-off Threshold 77 79 81 Vdc
Hysteresis 1 2 Vdc
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 5
Characteristic Curves
The following figures provide typical characteristics for the ESTW004A2C (15.0V, 4.2A) at 25oC. The figures are identical for
either positive or negative remote On/Off logic.
EFFICIENCY, (%)
OUTPUT VOLTAGE On/Off VOLTAGE
VO (V) (5V/div) VOn/Off (V) (5V/div)
OUTPUT CURRENT, IO (A) TIME, t (10ms/div)
Figure 1. Converter Efficiency versus Output Current. Figure 4. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = 48V, Io = Io,max).
OUTPUT VOLTAGE
VO (V) (100mV/div)
OUTPUT VOLTAGE INPUT VOLTAGE
VO (V) (5V/div) VIN (V) (10V/div)
TIME, t (2s/div) TIME, t (10ms/div)
Figure 2. Typical output ripple and noise ( Io= Io,max). Figure 5. Typical Start-up Using Input Voltage (VIN = 48V,
Io = Io,max).
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) IO(A) (1A/div)
TIME, t (200µs/div)
Figure 3. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, VIN=48V.
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E. S.R .<0 .1
@ 20 °C 10 0kHz
33-10 0μF
Vi n+
Vin-
NOTE: Measure inpu t reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible batt ery impedance. Measure current as shown
above.
Figure 6. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
+
Figure 7. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 8. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 6 a 33-100μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE0805-
1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be grounded, or
both the input and output pins are to be kept
floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety agencies,
to verify that under a single fault, hazardous
voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the UL60950
A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been evaluated
to the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs.
The input to these units is to be provided with a
maximum 10 A fast-acting fuse in the ungrounded lead.
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
Negative logic is the preferred option.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 9. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and the
VIN(-) terminal (see Figure 9). Logic low is -
0.7Vdc ≤ Von/off ≤ 0.6Vdc. The maximum Ion/off during a logic
low is 0.15mA; the switch should maintain a logic low
level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 6.7Vdc, and the maximum
allowable leakage current is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power
output of the module. Care should be taken to ensure
that the maximum output power of the module remains
at or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).
Figure 10. Circuit Configuration for remote sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
only begin to operate once the input voltage is raised
above the undervoltage lockout turn-on threshold,
VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-
off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions, the
unit is equipped with a thermal shutdown circuit. The
unit will shutdown if the thermal reference point, Tref1
exceeds 135oC (Figure 12, typical), or Tref2 exceeds 120oC
(Figure 13, typical), but the thermal shutdown is not
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the latching
protection feature. If the auto-restart option (4) is
ordered, the module will automatically restart upon an
internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at
least one second.
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 8
Feature Descriptions (continued)
If the unit is configured with the auto-restart option (4), it
will remain in the hiccup mode as long as the
overcurrent condition exists; it operates normally, once
the output current is brought back into its specified
range. The average output current during hiccup is 10%
IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 11. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the VO(-) (or Sense(-)) pin decreases the
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±1.0%. IO, max should
not be exceeded even trimming to a lower output
voltage. Output Current Limit Inception is independent of
trimmed Vout.
The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%
22.10
%
511
downtrim
R
Where 100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 13.8V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases the
output voltage set point. The following equation
determines the required external resistor value to obtain
a percentage output voltage change of ∆%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the module
by 5% to 15.75V, Rtrim-up is calculated is as follows:
5%
22.10
5
511
5225.1 )5100(0.1511.5
uptrim
R
MR uptrim 20.1
The voltage between the VO(+) and VO(–) terminals must
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim. The amount of power delivered by the
module is defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the
module remains at or below the maximum rated power
(Maximum rated power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The thermal
reference point, Tref1, used in the specifications for open
frame modules is shown in Figure 12. For reliable
operation this temperature should not exceed 130oC.
Figure 12. Tref Temperature Measurement Location
for Open Frame Module.
AIRFLOW
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 9
Thermal Considerations (continued)
The thermal reference point, Tref2, used in the
specifications for modules with heatplate is shown in
Figure 13. For reliable operation this temperature should
not exceed 104oC.
Figure 13. Tref Temperature Measurement Location
for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 2m/s (400 ft./min)
forced airflow are shown in Figure 14.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from VOUT(+) to VOUT(-); VIN =48V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from VOUT(+) to VOUT(-); VIN =48V.
Heat Transfer via Conduction
The module can also be used in a sealed environment
with cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 16. This capability is
achieved by insuring the top side component skyline
profile achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 17.
Figure 16. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
COLDPLATE TEMEPERATURE, TC (oC)
Figure 17. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 85C; VIN=48V.
AIRFLOW
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 10
Surface Mount Information
Pick and Place
The ESTW004A2C modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements
for surface mount processing, as well as safety
standards, and is able to withstand reflow temperatures
of up to 300oC. The label also carries product
information such as product code, serial number and the
location of manufacture.
Figure 18. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these modules
have a relatively large mass when compared to
conventional SMT components. Variables such as nozzle
size, tip style, vacuum pressure and placement speed
should be considered to optimize this process. The
minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
The surface mountable modules in the ESTW family use
our newest SMT technology called “Column Pin” (CP)
connectors. Figure 19 shows the new CP connector
before and after reflow soldering onto the end-board
assembly. The CP is constructed from a solid copper pin
with an integral solder ball attached, which is composed
of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu
(SAC) solder for –Z codes.
Figure 19. Column Pin Connector Before and After
Reflow Soldering .
The CP connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable SMT
solder joint. Typically, the eutectic solder melts at 183oC
(Sn/Pb solder) or 217-218 oC (SAC solder), wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the
connection to ensure a reliable
Tin Lead Soldering
The ESTW004A2C power modules are lead free modules
and can be soldered either in a lead-free solder process
or in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules
can be reliably soldered using natural forced convection,
IR (radiant infrared), or a combination of convection/IR.
For reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The –Z version of the ESTW004A2C modules are lead-
free (Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 11
Surface Mount Information (continued)
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 20. Reflow Profile for Tin/Lead (Sn/Pb) process
MAX TEMP SOLDER (C)
Figure 21. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using
MSL Rating
The ESTW004A2C modules have a MSL rating as stated
in the Device Code table, last page of this document.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL
Sn/Ag/Cu solder is shown in Figure 22.
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf
life for dry packed SMT packages will be a minimum of
12 months from the bag seal date, when stored at the
following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with
your Lineage Power representative for more details.
0
50
10 0
15 0
200
250
300
Preheat zone
max 4oCs-1
Soak zone
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Cooling
zo ne
1- 4 oCs-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 203040 5060
Pe r J-STD-020 Rev. C
0
50
100
150
200
250
300
Re flow Time (Se c ond s)
Reflow Temp (°C )
He ating Zone
1°C/Seco nd
Peak Temp 260°C
* Min. Time Above 235°C
15 Se co nds
*Time Above 217°C
60 Seconds
Cooling
Zone
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 12
EMC Considerations
The circuit and plots in Figure 23 shows a suggested configuration to meet the conducted emission limits of EN55022 Class
B.
Figure 23. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
VIN = 48V, Io = Io,max, L Line VIN = 48V, Io = Io,max, N Line
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 13
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
*Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 14
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
* Top side label includes Lineage Power name, product designation and date code.
Side
View
Botto
m View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
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6 TRIM
7 SENS
8 Vo(+)
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Page 15
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GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 16
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
March 8, 2016 ©2016 General Electric Company. All rights reserved. Page 17
Packaging Details
The surface mount versions of the ESTW004A2C (suffix –S)
are supplied as standard in the plastic trays shown in
Figure 24.
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays + 1
empty top tray)
Each tray contains a total of 12 power modules. The trays
are self-stacking and each shipping box for the
ESTW004A2C (suffix –S) surface mount module will contain
4 full trays plus one empty hold down tray giving a total
number of 48 power modules.
Figure 24. Surface Mount Packaging Tray
GE Data Sheet
ESTW004A2C Stingray Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice,
and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any
such product(s) or information.
March 8, 2016 ©2016 General Electric Company. All International rights reserved. Version 1.12
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage Output
Voltage
Output
Current
On/Off
Logic
Connector
Type
MSL
Rating Comcodes
ESTW004A2C41Z 48V (36-75Vdc) 15.0V 4.2A Negative Through hole n/a CC109170461
ESTW004A2C841Z 48V (36-75Vdc) 15.0V 4.2A Negative Through hole n/a CC109170494
ESTW004A2C41-HZ 48V (36-75Vdc) 15.0V 4.2A Negative Through hole n/a CC109170486
ESTW004A2C41-SZ 48V (36-75Vdc) 15.0V 4.2A Negative Surface mount 2a CC109170478
Table 2. Device Coding Scheme and Options
