E Global Investor Relations Products C Micron Blogs Solutions C Jobs Contact Support C Sales Network About C Sign Up G Login Search Home D Memory and Storage Products D Multichip Packages D NAND-Based MCP D MT29UZ4B8DZZHGPB 107 W ADD EMAIL MT29UZ4B8DZZHGPB-107 W DATA SHEETS (1) SPECS ROHS CERTIFICATES WHERE TO BUY DOCUMENTATION & SUPPORT DATA SHEETS (1) I J K ROHS CERTIFICATES SPECS L DOCUMENTATIO & SUPPORT Data Sheets (1) Data Sheet R Embedded Memory Solutions Multichip Packages NAND LPDDR3 NAND-Based MCP 221-Ball MCP: 4Gb NAND Flash and 8Gb Mobile LPDDR3 (J84Z) Data Sheet 4Gb x8 NAND (M60A) and 8Gb Single-Channel LPDDR3 (V01M) MCP; MT29UZ4B8DZZHGPB-107 W.84Z File Type: PDF DOWNLOAD Updated: 12/2016 Specs Orderable Parts for: MT29UZ4B8DZZHGPB-107 W MT29UZ4B8DZZHGPB-107 W.84Z SEE ALL NAND-BASED MCP PARTS Status Media FBGA Code SPD Data Chipset Validation PLP Production N/A JYA15 N/A N/A No Start Date Alternative Part N/A Detailed Specifications Part Status Code Production NAND Density 4Gb DRAM Type LPDDR3 DRAM Density 8Gb Bus Width x16 Secondary Bus Width x16 RoHS Yes Voltage 1.8V Package WFBGA Pin Count 221-ball Clock Rate 933 MHz Operating Temp -30C to +85C RoHS Certificates RoHS Certificates MT29UZ4B8DZZHGPB 107 W RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. File Type: (PDF) DOWNLOAD Updated: 04/2017 RoHS Certificates MT29UZ4B8DZZHGPB 107 W China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. File Type: (PDF) DOWNLOAD Updated: 04/2017 Documentation & Support See All NAND-Based MCP Documentation Technical Notes SEARCH (2) NAND-BASED MCP TECHNICAL NOTES Technical Notes TN-00-01: Moisture Sensitivity of Plastic Packages (PDF) DDR SDRAM DDR2 SDRAM DDR3 SDRAM DDR3L-RS (TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture. See More Tags File Type: PDF DOWNLOAD Updated: 02/14/2013 Technical Notes TN-10-08: Thermal Implications for LPDDR Die Stacks (PDF) Mobile Memory Solutions Multichip Packages NAND-Based MCP (TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to... File Type: PDF Updated: 07/26/2010 DOWNLOAD SEARCH (2) NAND-BASED MCP TECHNICAL NOTES Customer Service Note Customer Service Note Customer Service Note Big Data Big Data Client SSD Storage Cloud Micron Component and Module Packaging (PDF) (CSN-16) Explanation of Micron packaging labels and procedures. File Type: PDF See More Tags DOWNLOAD Updated: 03/22/2017 Customer Service Note Multichip Packages NAND-Based MCP PoP User Guide (PDF) (CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process. File Type: PDF DOWNLOAD Updated: 05/16/2016 SEARCH (2) NAND-BASED MCP CUSTOMER SERVICE NOTE Where to Buy Orderable Parts MT29UZ4B8DZZHGPB-107 W.84Z Contact Your Sales Rep CONTACT A REP Status Media FBGA Code SPD Data Chipset Validation PLP Production N/A JYA15 N/A N/A No - OR - Check with Distributors Your Region: Americas Start Date Alternative Part N/A VIEW VIEW See All Distributors Solutions Memory and Storage Products About Support Contact Us Our Company Sales Network Sales Network Client SSD Storage DRAM News and Events Authorized Distributors Authorized Sales Data Center DRAM Modules Micron Blogs Contact Us Embedded Memory Solutions NAND Flash Micron Foundation Jobs Enterprise SSD Storage Managed NAND History of Innovation Mobile Memory Solutions NOR Flash Locations Networking Innovations Hybrid Memory Cube Our Commitment Supercomputing Memory Multichip Packages Investor Relations Terms and Conditions of Sale Ultrathin Solutions Solid State Drives Suppliers Privacy Automotive Memory Solutions Site Map Surplus Equipment Terms of Use (c)2017 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. All information is provided on an "AS IS" basis without warranties of any kind. Drawings may not be to scale. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.