MT29UZ4B8DZZHGPB-107 W
Data Sheets (1)
4Gb x8 NAND (M60A) and 8Gb Single-Channel LPDDR3 (V01M) MCP; MT29UZ4B8DZZHGPB-107
W.84Z
File Type: PDF Updated: 12/2016
Data Sheet
R
221-Ball MCP: 4Gb NAND Flash and 8Gb Mobile LPDDR3 (J84Z) Data Sheet Embedded Memory Solutions
Multichip Packages
NAND LPDDR3
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Specs
Orderable Parts for: MT29UZ4B8DZZHGPB-107 W
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MT29UZ4B8DZZHGPB-107
W.84Z Production N/A JYA15 N/A N/A No N/A
Detailed Specifications
Part
Status
Code
Production NAND
Density 4Gb DRAM
Type LPDDR3 DRAM
Density 8Gb
Bus Width x16 Secondary
Bus Width x16 RoHS Yes Voltage 1.8V
Package WFBGA Pin Count 221-ball Clock Rate 933 MHz Operating
Temp -30C to +85C
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MT29UZ4B8DZZHGPB 107 W
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RoHS Certificates
RoHS Certificate of Compliance (PDF)
Part-specific certification of how this product meets the requirements of the current DIRECTIVE
2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.
File Type: (PDF) Updated: 04/2017
RoHS Certificates
MT29UZ4B8DZZHGPB 107 W
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China RoHS Certificate (PDF)
Part-specific certification as required by China's Management Methods for Controlling Pollution by
Electronic Information Products.
File Type: (PDF) Updated: 04/2017
RoHS Certificates
MT29UZ4B8DZZHGPB 107 W
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Documentation & Support
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Technical Notes
SEARCH (2) NAND-BASED MCP TECHNICAL NOTES
(PDF)
(TN-00-01) This technical note describes shipping procedures for preventing memory devices from
absorbing moisture and recommendations for baking devices exposed to excessive moisture.
File Type: PDF Updated: 02/14/2013
Technical Notes
TN-00-01: Moisture Sensitivity of Plastic Packages DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
DDR3L-RS
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(PDF)
(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is
stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note
also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...
File Type: PDF Updated: 07/26/2010
Technical Notes
TN-10-08: Thermal Implications for LPDDR Die Stacks Mobile Memory Solutions
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Customer Service Note
Customer Service Note
(PDF)
(CSN-16) Explanation of Micron packaging labels and procedures.
File Type: PDF Updated: 03/22/2017
Customer Service Note
Micron Component and Module Packaging Big Data
Big Data
Client SSD Storage
Cloud
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(PDF)
(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor
package design and assembly, which requires unique considerations in both the up-front design
and the manufacturing process.
File Type: PDF Updated: 05/16/2016
Customer Service Note
PoP User Guide Multichip Packages
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Where to Buy
Orderable Parts
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MT29UZ4B8DZZHGPB-107
W.84Z Production N/A JYA15 N/A N/A No N/A
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