2SC6145A Audio Amplification Transistor Features and Benefits Description Sanken LAPT transistors have an innovative design, produced by adapting advancements in the unique Sanken thin-wafer production technology. These NPN power transistors achieve faster power-up by decreasing thermal resistance, and provide a higher avalanche breakdown voltage rating. The high powerhandling capacity of the TO-3P package allows a smaller footprint on the circuit board layout. This series of transistors is very well suited not only for multichannel applications for AV (audio-visual) amplifiers and receivers, but also for parallel connection applications for PA (professional audio system) amplifiers. LAPT (High frequency multi emitter transistor) Small package (TO-3P) High power handling capacity, 160 W Improved sound output by reduced on-chip impedance Complementary to 2SA2223A Package: 3-Lead TO-3P Applications include the following: Single transistors for audio amplifiers Home audio amplifiers Professional audio amplifiers Automobile audio amplifiers Audio market Single transistors for general purpose Not to scale Equivalent Circuit E B 1 C 38107 3 2 2SC6145A Audio Amplification Transistor Selection Guide Part Number Type hFE Rating Packing Range R: 40 to 80 2SC6145A* NPN Range O: 50 to 100 30 pieces per tube Range Y: 70 to 140 *Specify hFE range when ordering. Absolute Maximum Ratings at TA = 25C Characteristic Symbol Remarks Rating Unit Collector-Base Voltage VCBO 260 V Collector-Emitter Voltage VCEO 260 V Emitter-Base Voltage VEBO 5 V Collector Current IC 15 A Base Current IB 4 A Collector Power Dissipation PC 160 W Junction Temperature TJ 150 C Storage Temperature Tstg -55 to150 C TCASE = 25C ELECTRICAL CHARACTERISTICS at TA = 25C Characteristic Symbol Test Conditions Min. Typ. Max. Unit Collector-Cutoff Current ICBO VCB = 260 V - - 10 A Emitter Cutoff Current IEBO VEB = 5 V - - 10 A V(BR)CEO IC = 25 mA 260 - - V hFE VCE = 4 V, IC = 5 A 40 - 140 - VCE(sat) IC = 5 A, IB = 0.5 A - - 0.5 V VCE = 12 V, IE = -2 A - 60 - MHz VCB = 10 V, IE = 0 A, f = 1 MHz - 250 - pF Collector-Emitter Voltage DC Current Transfer Ratio* Collector-Emitter Saturation Voltage Cutoff Frequency Output Capacitance fT COB *hFE rating: 40 to 80 (R brand on package), 50 to 100 (O), 70 to 140 (Y). Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 2SC6145A Audio Amplification Transistor Performance Characteristics 15 3 A 3A 1A 500 m A 300 m 200 mA IC (A) IC vs. VCE VCE(sat) vs. IB 100 mA 5 2 VCE(sat) (V) 10 1 50 mA IB= 20 mA I C= 5 A 0 0 1 2 3 0 4 0 IC= 10 A 0.5 1.0 15 1000 10 100 hFE vs. IC IC (A) IC vs. VBE VCE = 4 V Continuous hFE 125C 0 0.5 -30C C -30 1.0 1.5 VBE (V) 1 0.01 2.0 0.1 1 10 100 IC (A) 100.0 80 70 Typ. s m s 10 0 m 10 60 10.0 DC 50 Safe Operating Area 40 IC (A) fT (MHz) 25C 10 12 5C 25C 0 VCE = 12 V Continuous 2.0 VCE = 4 V Continuous 5 fT vs. IE 1.5 IB (A) VCE (V) 1.0 TA= 25C, single pulse, no heatsink, natural cooling 0.1 30 20 10 0 0.01 0.1 1 10 0.01 100 1 10 VCE (V) -IE (A) 10.00 PC vs. TA In 100 0.10 fin ite PC (W) RJA (C/W) W ith 1.00 He at si nk 50 3.5 0.01 1000 200 150 RJA vs. t 100 1 10 t (ms) 100 1000 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 0 Without Heatsink 0 25 50 75 100 TA (C) 125 150 3 2SC6145A Audio Amplification Transistor Package Outline Drawing, TO-3P 15.8 0.2 XXXXXXXX XXXXX XXXXX Exposed heatsink pad 2.1 MAX 19.9 0.3 Branding Area 5.0 MAX O3.2 0.1 9.6 0.2 6.0 0.2 13.6 0.2 5.0 0.2 1.8 0.3 14.0 0.3 2.0 0.2 15.6 0.3 +0.2 3.5 1.7 -0.1 +0.2 0.6 -0.1 2 -0.1 +0.2 -0.1 1.0 +0.2 -0.1 20.0 MIN 3 +0.2 +0.2 2 -0.1 View A View B 5.45 0.1 Terminal dimension at lead tip 1 2 3 0.7 MAX View A Gate burr: 0.3 mm (max.), mold flash may appear at opposite side Terminal core material: Cu Terminal treatment: Ni plating and Pb-free solder dip Leadform: 100 Package: TO-3P (M100) Approximate weight: 6 g Dimensions in millimeters 0.7 MAX View B Branding codes (exact appearance at manufacturer discretion): 1st line, type: C6145A 2nd line left, lot: YM Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) 2nd line right, subtype: H Where: H is the hFE rating (O, R, or Y; for values see footnote, Electrical Characteristics table) Leadframe plating Pb-free. Device composition includes high-temperature solder (Pb >85%), which is exempted from the RoHS directive. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 2SC6145A Audio Amplification Transistor Packing Specification Tube Packing 505 10 45 525 118 185 30 pieces per tube 17 tubes per layer 2 layers per carton 1020 pieces per outer carton Dimensions in millimeters Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 2SC6145A Audio Amplification Transistor Bulk Packing 365 120 50 340 330 160 100 pieces per tray 5 trays per inner carton 4 inner cartons per outer carton 500 pieces maximum per inner carton 2000 pieces maximum per outer carton Dimensions in millimeters Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 2SC6145A Audio Amplification Transistor WARNING -- These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage * Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. * Avoid locations where dust or harmful gases are present and avoid direct sunlight. * Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink * When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. * Coat the back surface of the product and both surfaces of the insulating plate to improve heat transfer between the product and the heatsink. * Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. * Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials SC102 Dow Corning Toray Silicone Co., Ltd. Heatsink Mounting Method * Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product package type, TO-3P (MT-100): 0.686 to 0.882 N*m (7 to 9 kgf*cm). * Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold when making the hole may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. Soldering * When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C * 3s Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge * When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M of resistance to ground to prevent shock hazard. * Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. * When using measuring equipment such as a curve tracer, the equipment should be grounded. * When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. * The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 2SC6145A Audio Amplification Transistor The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Anti radioactive ray design is not considered for the products listed herein. Copyright (c) 2008 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet T01-006JA-081027 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 2SC6145A Audio Amplification Transistor Worldwide Contacts Asia-Pacific China Sanken Electric Hong Kong Co., Ltd. Suite 1026, Ocean Centre Canton Road, Tsimshatsui Kowloon, Hong Kong Tel: 852-2735-5262, Fax: 852-2735-5494 Sanken Electric (Shanghai) Co., Ltd. Room 3202, Maxdo Centre Xingyi Road 8, Changning District Shanghai, China Tel: 86-21-5208-1177, Fax: 86-21-5208-1757 Taiwan Sanken Electric Co., Ltd. Room 1801, 18th Floor 88 Jung Shiau East Road, Sec. 2 Taipei 100, Taiwan R.O.C. Tel: 886-2-2356-8161, Fax: 886-2-2356-8261 Japan Sanken Electric Co., Ltd. Overseas Sales Headquarters Metropolitan Plaza Building 1-11-1 Nishi-Ikebukuro, Toshima-ku Tokyo 171-0021, Japan Tel: 81-3-3986-6164, Fax: 81-3-3986-8637 Singapore Sanken Electric Singapore Pte. Ltd. 150 Beach Road, #14-03 The Gateway West Singapore 189720 Tel: 65-6291-4755, Fax: 65-6297-1744 Europe Sanken Power Systems (UK) Limited Pencoed Technology Park Pencoed, Bridgend CF35 5HY, United Kingdom Tel: 44-1656-869-100, Fax: 44-1656-869-162 North America United States Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01606, U.S.A. Tel: 1-508-853-5000, Fax: 1-508-853-7895 Allegro MicroSystems, Inc. 14 Hughes Street, Suite B105 Irvine, California 92618, U.S.A. Tel: 1-949-460-2003, Fax: 1-949-460-7837 Korea Sanken Electric Korea Co., Ltd. Samsung Life Yeouido Building 16F 23-10, Yeouido-Dong, Yeongdeungpo-gu Seoul 150-734, Korea Tel: 82-2-714-3700, Fax: 82-2-3272-2145 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9