2SC6145A
Description
Sanken LAPT transistors have an innovative design, produced
by adapting advancements in the unique Sanken thin-wafer
production technology. These NPN power transistors achieve
faster power-up by decreasing thermal resistance, and provide
a higher avalanche breakdown voltage rating. The high power-
handling capacity of the TO-3P package allows a smaller
footprint on the circuit board layout. This series of transistors
is very well suited not only for multichannel applications
for AV (audio-visual) amplifiers and receivers, but also for
parallel connection applications for PA (professional audio
system) amplifiers.
Applications include the following:
▪ Single transistors for audio amplifiers
▪ Home audio amplifiers
▪ Professional audio amplifiers
▪ Automobile audio amplifiers
▪ Audio market
▪ Single transistors for general purpose
Features and Benefits
▪ LAPT (High frequency multi emitter transistor)
▪ Small package (TO-3P)
▪ High power handling capacity, 160 W
▪ Improved sound output by reduced on-chip impedance
▪ Complementary to 2SA2223A
Audio Amplification T ransistor
Package: 3-Lead TO-3P
E
B
C
3
2
1
Equivalent Circuit
Not to scale
38107
Audio Amplification T ransistor
2SC6145A
2
Absolute Maximum Ratings at TA = 25°C
Characteristic Symbol Remarks Rating Unit
Collector-Base Voltage VCBO 260 V
Collector-Emitter Voltage VCEO 260 V
Emitter-Base Voltage VEBO 5V
Collector Current IC15 A
Base Current IB4A
Collector Power Dissipation PCTCASE = 25°C 160 W
Junction Temperature TJ150 °C
Storage Temperature Tstg –55 to150 °C
Selection Guide
Part Number Type hFE Rating Packing
2SC6145A* NPN
Range R: 40 to 80
30 pieces per tubeRange O: 50 to 100
Range Y: 70 to 140
*Specify hFE range when ordering.
ELECTRICAL CHARACTERISTICS at TA = 25°C
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Collector-Cutoff Current ICBO VCB = 260 V – – 10 μA
Emitter Cutoff Current IEBO VEB = 5 V – – 10 μA
Collector-Emitter Voltage V(BR)CEO IC = 25 mA 260 – – V
DC Current Transfer Ratio* hFE VCE = 4 V, IC = 5 A 40 – 140 –
Collector-Emitter Saturation Voltage VCE(sat) IC = 5 A, IB = 0.5 A – – 0.5 V
Cutoff Frequency fTVCE = 12 V, IE = –2 A – 60 – MHz
Output Capacitance COB VCB = 10 V, IE = 0 A, f = 1 MHz – 250 – pF
*hFE rating: 40 to 80 (R brand on package), 50 to 100 (O), 70 to 140 (Y).
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
3
Performance Characteristics
V
CE
(V)
I
C
(A)
I
C
vs. V
CE
V
CE(sat)
vs. I
B
I
C
vs. V
BE
V
CE
= 4 V Continuous
V
BE
(V)
I
C
= 5 A
I
C
= 10 A
I
C
(A)
V
CE(sat)
(V)
0
5
10
15
0
5
10
15
3
2
1
0
0 0.5 1.0 1.5 2.0
02134
IB= 20 mA
50 mA
100 mA
200 mA
500 mA
300 mA
1 A
3 A
I
B
(A)
0 0.5 1.0 1.5 2.0
125°C
25°C
–30°C
0.01 0.1 1 10 100
10
0
20
50
60
70
80
30
40
0.01
0.10
1.00
10.00
110100
1000
R
θJA
vs. t
R
θJA
(°C/W)
t (ms)
f
T
vs. I
E
VCE = 12 V Continuous
f
T
(MHz)
–I
E
(A)
Typ.
P
C
vs. T
A
0
50
100
150
200
0 25 50 75 100 125 150
T
A
(°C)
PC (W)
Without Heatsink
With Infinite Heatsink
3.5
hFE vs. IC
VCE = 4 V Continuous
IC (A)
h
FE
0.01 0.1 1 10
DC
10 ms
100 ms
100
10
1
100
1000
125°C
25°C
–30°C
1 10 100 1000
IC (A)
0.1
0.01
1.0
10.0
100.0
VCE (V)
Safe Operating
Area
T
A
= 25°C, single pulse,
no heatsink,
natural cooling
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
4
Package Outline Drawing, TO-3P
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
15.6 ±0.3
Ø3.2 ±0.1
5.0 MAX
2.1 MAX
Terminal dimension at lead tip
1.0 +0.2
–0.1
2+0.2
–0.1
2+0.2
–0.1
1.7+0.2
–0.1
3+0.2
–0.1
0.6 +0.2
–0.1
19.9 ±0.320.0 MIN
1.8 ±0.3
3.5
Branding
Area
XXXXXXXX
XXXXX XXXXX
Branding codes (exact appearance at manufacturer discretion):
1st line, type: C6145A
2nd line left, lot: YM
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
2nd line right, subtype: H
Where: H is the hFE rating (O, R, or Y; for values see
footnote, Electrical Characteristics table)
12 3
5.45 ±0.1
14.0 ±0.3
13.6 ±0.2
9.6 ±0.2
15.8 ±0.2
2.0 ±0.2
5.0 ±0.2
6.0 ±0.2
Gate burr: 0.3 mm (max.), mold flash may appear at opposite side
Terminal core material: Cu
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 100
Package: TO-3P (M100)
Approximate weight: 6 g
Dimensions in millimeters
View A
0.7 MAX
View B
0.7 MAX
View A View B
Exposed
heatsink pad
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
5
505 10
45
30 pieces per tube
17 tubes per layer
2 layers per carton
1020 pieces per outer carton
Dimensions in millimeters
525
118
185
Packing Specification
Tube Packing
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
6
100 pieces per tray
5 trays per inner carton
4 inner cartons per outer carton
500 pieces maximum per inner carton
2000 pieces maximum per outer carton
Dimensions in millimeters
365
120
340
160
50
330
Bulk Packing
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
7
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials
SC102 Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7
to 9 kgf•cm).
• Diameter of Heatsink Hole: < 4 mm. The defl ection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Soldering
• When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
• When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the
equipment should be grounded.
• When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
• The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Pre cau tions must be
taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
8
The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im-
prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this
publication is current before placing any order.
When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products
at a certain rate is in ev i ta ble.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus
(home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aero space equipment) is not supported.
When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems
or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your spec i fi ca tions.
The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip-
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are
given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
Copyright © 2008 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet T01-006JA-081027
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Audio Amplification T ransistor
2SC6145A
9
Asia-Pacific
China
Sanken Electric Hong Kong Co., Ltd.
Suite 1026, Ocean Centre
Canton Road, Tsimshatsui
Kowloon, Hong Kong
Tel: 852-2735-5262, Fax: 852-2735-5494
Sanken Electric (Shanghai) Co., Ltd.
Room 3202, Maxdo Centre
Xingyi Road 8, Changning District
Shanghai, China
Tel: 86-21-5208-1177, Fax: 86-21-5208-1757
Taiwan Sanken Electric Co., Ltd.
Room 1801, 18th Floor
88 Jung Shiau East Road, Sec. 2
Taipei 100, Taiwan R.O.C.
Tel: 886-2-2356-8161, Fax: 886-2-2356-8261
Japan
Sanken Electric Co., Ltd.
Overseas Sales Headquarters
Metropolitan Plaza Building
1-11-1 Nishi-Ikebukuro, Toshima-ku
Tokyo 171-0021, Japan
Tel: 81-3-3986-6164, Fax: 81-3-3986-8637
Korea
Sanken Electric Korea Co., Ltd.
Samsung Life Yeouido Building 16F
23-10, Yeouido-Dong, Yeongdeungpo-gu
Seoul 150-734, Korea
Tel: 82-2-714-3700, Fax: 82-2-3272-2145
Singapore
Sanken Electric Singapore Pte. Ltd.
150 Beach Road, #14-03 The Gateway West
Singapore 189720
Tel: 65-6291-4755, Fax: 65-6297-1744
Europe
Sanken Power Systems (UK) Limited
Pencoed Technology Park
Pencoed, Bridgend CF35 5HY, United Kingdom
Tel: 44-1656-869-100, Fax: 44-1656-869-162
North America
United States
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01606, U.S.A.
Tel: 1-508-853-5000, Fax: 1-508-853-7895
Allegro MicroSystems, Inc.
14 Hughes Street, Suite B105
Irvine, California 92618, U.S.A.
Tel: 1-949-460-2003, Fax: 1-949-460-7837
Worldwide Contacts
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
