3M™ Through-Board Socket
2.54 mm x 2.54 mm, Dual Entry, Low Prole, Surface Mount 966 Series
• High temperature dielectric
• “No lead” reow solder compatible
• Dual row design, 4–60 pins
• Mates with pin headers for board stacking
applications
• Dual entry design allows mating from top side or
bottom side through the printed circuit board
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the RoHS compliance section of
www.3Mconnectors.com for compliance information
(RIA E1 & C1 apply)
TS-2192-D
Sheet 1 of 2
Physical
Insulation
Material: High Temperature Thermo plastic
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 1.25–2.5 µm [50–100 µ"] Nickel
Wiping Area: Flash Gold
Solder Tail Area: 1–3 µm [40–118 µ"] Matte Tin
Electrical
Current Rating: 2 A
Insulation Resistance: > 5 x 108 Ohm at 100 VDC
Withstanding Voltage: 1000 VDC
Environmental
Temperature Range: -25 °C to +105 °C
Processing Temperature: max. 260 °C (Prole per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
Interconnect Solutions
www.3Mconnectors.com
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For technical, sales or ordering information
call your Local 3M Service Center
Date Modied: November 26, 2012
UL File No.: E68080