H1-O03EE0-1004015ND
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1. Resell or retransfer these products/technology to any party intending to disturb international peace and security.
2. Use these products/technology yourself for activities disturbing international peace and security.
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under the Foreign Exchange and Foreign Trade Law, when you export or transfer the products/technology abroad.
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Overseas Sales Headquarters
Metropolitan Plaza Building, 1-11-1 Nishi-Ikebukuro
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Te l : 81-3-3986-6164
Fax: 81-3-3986-8637
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Asia-Pacific
China
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Room 3202, Maxdo Centre, Xingyi Road 8
Changning District, Shanghai, China
Te l : 86-21-5208-1177
Fax: 86-21-5208-1757
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Room 1013, Xinhua Insurance Building, Mintian Road, Futian District,
Shenzhen City, Guangdong, China
Tel : 86-755-3391-9356
Fax: 86-755-3391-9368
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Room 1801, 18th Floor, 88 Jung Shiau East Road
Sec. 2, Taipei 100, Taiwan R.O.C.
Te l : 886-2-2356-8161
Fax: 886-2-2356-8261
Korea
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23-10, Yeouido-Dong, Yeongdeungpo-gu,
Seoul 150-734, Korea
Te l : 82-2-714-3700
Fax: 82-2-3272-2145
Singapore
Sanken Electric Singapore Pte. Ltd.
150 Beach Road, #14-03 The Gateway West
Singapore 189720
Te l : 65-6291-4755
Fax: 65-6297-1744
Malaysia
Sanken Electric (Malaysia) Sdn. Bhd.
Block B-20-5, Level 20, Northpoint Midvalley City,
No.1, Medan Syed Putra Utara, 59200 Kuala Lumpur, Malaysia
Te l : 60-3-2282-2345
Fax: 60-3-2282-6345
Europe
United Kingdom
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Pencoed Technology Park
Pencoed, Bridgend CF35 5HY, United Kingdom
Te l : 44-1656-869-100
Fax: 44-1656-869-162
North America
United States
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01606, U.S.A.
Te l : 1-508-853-5000
Fax: 1-508-853-7895
Allegro MicroSystems, Inc.
14 Hughes Street, Suite B105
Irvine, California 92618, U.S.A.
Te l : 1-949-460-2003
Fax: 1-949-460-7837
SEMICONDUCTORS GENERAL CATALOG 2010 SANKEN ELECTRIC CO., LTD.
Bulletin No
O03EE0
（Apr, 2010）
http://www.sanken-ele.co.jp/en/
SANKEN ELECTRIC CO., LTD.
ICS TRANSISTORS THYRISTORS DIODES
SEMICONDUCTORS GENERAL CATALOG
The contents in this document are subject to changes, for improvement and other purposes,
without notice.
Be sure to check the delivery specifications before using these products.
The operation and circuit examples in this document are provided for reference purposes
only. Sanken assumes no liability for violation of industrial property, intellectual property, or
other rights of Sanken or third parties, that stem from these examples.
The user must take responsibility for considering and determining which objects the
products in this document are used with.
Although we will continue to improve the quality and reliability of our products,
semiconductor products, by their nature, have certain fault and failure rates. The user must
take responsibility for designing and checking to secure the device and system so that a part
failure may not lead to human injury, fire, damages, or other losses.
The products in this document are intended for normal electronic devices (such as home
appliances, office equipment, communication terminals, or measurement devices).
If you are considering using our products for a device that requires high reliability (such as
transport machines and their control units, traffic light control systems, disaster prevention,
and security equipment or any kind of safety equipment), make sure that you consult our
sales representative.
Do not use these products for devices that require extremely high reliability (such as
aerospace instruments, nuclear power control units, or life support systems).
The products in this document are not designed to be radiation-proof.
The contents in this document must not be transcribed or copied without our written consent.
●
●
●
●
●
●
●
●
Warning
C O N T E N T S
SANKEN
SEMICONDUCTORS
1ICs
1-1 Regulator ICs ....................................................................................................................... 6
1-1-1 Linear Regulator ICs............................................................................................9
1-1-2 Switching Mode Regulator ICs .........................................................................33
1-1-3 Multi-Output Type Regulator ICs......................................................................89
1-2 Motor Driver ICs ................................................................................................................98
1-2-1 2-Phase Stepper Motor Unipolar Driver ICs................................................. 100
1-2-2 3-Phase Stepper Motor Driver ICs ................................................................ 126
1-2-3 5-Phase Stepper Motor Driver ICs.....................................................................128
1-2-4 Brush DC Motor Driver ICs ................................................................................130
1-2-5 Brushless DC Motor Driver ICs..........................................................................132
1-2-6 High Voltage 3-Phase Motor Driver IPMs ..........................................................134
2Transistors
2-1 Transistors ...................................................................................................................... 153
2-2 MOS FETs ....................................................................................................................... 162
2-3 IGBT ................................................................................................................................. 166
2-4 Transistors and MOS FET Arrays ................................................................................ 170
3Thyristors
3-1 Thyristors ........................................................................................................................ 188
3-2 Triacs ............................................................................................................................... 190
4Diodes
4-1 Rectifier Diodes .............................................................................................................. 201
4-2 Fast Recovery Diodes ................................................................................................... 203
4-3 Ultrafast Recovery Diodes............................................................................................ 205
4-4 Schottky Barrier Diodes ................................................................................................ 208
4-5 High Voltage Rectifier Diodes ...................................................................................... 211
4-6 Power Zener Diodes ...................................................................................................... 212
4-7 Silicon Varistors ............................................................................................................. 213
Part Number Index........................................................................ 216
Ordering Information & Standard Packing Quantities ................ 4
1-1 Regulator ICs ............................................................................ 6
Selection Guide ........................................................................ 6
1-1-1 Linear Regulator ICs ................................................... 9
Application Note........................................................... 9
1-1-2 Switching Mode Regulator ICs.................................33
Application Note.........................................................33
1-1-3 Multi-Output Type Regulator ICs .............................89
Application Note.........................................................89
1-2 Motor Driver ICs .....................................................................98
Selection Guide ......................................................................98
Application Note .....................................................................99
1-2-1 2-Phase Stepper Motor Unipolar Driver ICs........100
1-2-2 3-Phase Stepper Motor Driver ICs.........................126
1-2-3 5-Phase Stepper Motor Driver ICs.........................128
1-2-4 Brush DC Motor Driver ICs.....................................130
1-2-5 Brushless DC Motor Driver ICs..............................132
1-2-6 High-voltage 3-phase Motor Driver IPMs..............134
1
1
○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○
○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○○
ICs
4ICs
1ICs
All products listed must be ordered in standard packing increments.
PG001M DIP16 1000 –
SAI
PS4(Surface-mount)
–2000
SCM1100M SCM 250 –
SI-3000KD
TO263-5(Surface-mount)
–800
SI-3000KF TO220F-5 2000 –
SI-3000KM
TO252-5(Surface-mount)
–3000
SI-3000KS
SOP8(Surface-mount)
–1000
SI-3000KWM
TO252-5(Surface-mount)
–3000
SI-3000LLSL
SOP8(Surface-mount)
–1000
SI-3000LSA
SOP8(Surface-mount)
–1000
SI-3000LU
SOT89-5(Surface-mount)
–1000
SI-3000ZD
TO263-5(Surface-mount)
–800
SI-3000ZF TO220F-5 2000 –
SI-7321M
HSOP44(Surface-mount)
–2000
SI-7510 DIP30 680 –
SI-8000E TO220F-5 2000 –
SI-8000FD
TO263-5(Surface-mount)
–800
SI-8000FFE TO220F-5 2000 –
SI-8000GL DIP8 2500 –
SI-8000HD
TO263-5(Surface-mount)
–800
SI-8000HFE TO220F-5 2000 –
SI-8000JD
TO263-5(Surface-mount)
–800
SI-8000JF TO220F-5 2000 –
SI-8000Q
HSOP8(Surface-mount)
–1000
SI-8000S TO220F-5 2000 –
SI-8000SD
TO263-5(Surface-mount)
–800
SI-8000TFE TO220F-5 2000 –
SI-8000TM
TO252-5(Surface-mount)
–3000
SI-8000W
SOP8(Surface-mount)
–1000
SI-8000Y TO220F-7 2000 –
SI-8011NVS TSSOP24 – 2800
SI-8100QL DIP8 2500 –
SI-8205NHD HSOP8 – 1000
SI-8400L Non–package type 864 –
(EI-12.5 core)
SI-8405NH
SOP8(Surface-mount)
–1000
SI-8405NL
SOP8(Surface-mount)
–1000
SI-8500L Non–package type 320 –
(EI-19 core)
SI-8511NVS TSSOP24 – 2800
SLA6805MP SLA23Pin
LF.No.2151/2152:648
–
SLA6845M SLA24Pin LF.No.2171:648 –
SLA6868M/ SLA24Pin LF.No.2171:648 –
SLA682xM LF.No.2175:540
SLA7022MU/ ZIP15 with Fin 1080 –
7029M (SLA15Pin)
SLA7024M/ ZIP18 with Fin 1080 –
7026M/7027MU
(SLA18Pin)
SLA703xM ZIP18 with Fin 1080 –
(SLA18Pin)
SLA7042M/7044M
ZIP18 with Fin 1080 –
(SLA18Pin)
SLA705xM ZIP18 with Fin 1080 –
(SLA18Pin)
SLA706xM ZIP21 with Fin 1080 –
(SLA21Pin)
SLA707xMR/MPR
ZIP23 with Fin 1080 –
(SLA23Pin)
SLA708xMR/MPR
ZIP23 with Fin 1080 –
(SLA23Pin)
SLA7611M ZIP18 with Fin 1080 –
(SLA18Pin)
SMA682xMP SMA24Pin
LF.No.2451:1080
–
LF.No.2452:1008
SMA686xM SMA24Pin
LF.No.2451:1080
–
LF.No.2452:1008
SMA7022MU/ ZIP15 1440 –
7029M (SMA15Pin)
SMA7036M ZIP15(SMA15Pin) 1440 –
SPI-6631M HSOP16
SPI-721xM HSOP16 – 1400
SPI-8000A HSOP16 – 1400
SPI-8000TW HSOP16 – 1400
STA6940M ZIP18(STA18Pin) LF.No434:1785 –
STA801M SIP10(STA10Pin) 100 –
STA810M SIP8(STA8Pin) 100 –
STA820M SIP8(STA8Pin) 100 –
SX68000M SOP27 – 1000
Ordering Information
Ordering Information
Bulk Taping
Series Name/
Product Name Package Series Name/
Product Name Package
Standard Packing Quantities
Bulk Taping
Standard Packing Quantities
5
ICs
1ICs
6ICs
Selection Guide
Linear Regulator ICs (low dropout voltage, built-in overcurrent, thermal protection circuits)
1-1 Regulator ICs
Selection Guide
Series Name
SI-3000LU
SI-3000LSA
SI-3000KS
SI-3000KM
SI-3000KD
SI-3000LLSL
SI-3000ZD
Output Current
(A)
0.25
1.0
1.0
1.0
1.0
1.5
3.0
Package
SOT89-5
SOP8
SOP8
TO252-5
TO263-5
SOP8
TO263-5
Low Current
Consumption
During OFF
Output
ON/OFF
Overcurrent
Protection
Characteristic
Drooping
Foldback
Drooping
Foldback*
1
Foldback*
2
Foldback
Foldback
Page
10
12
14
16
20
24
26
Output V oltage
(V)
1.8 2.5 3.3 5 9 12
Variable (Reference Voltage)
(V)
1.0 1.1 1.25 1.28
Surf ace-Mount Type
*1: Drooping for SI-3012KM/3025KM/3033KM
*2: Drooping for SI-3012KD/3033KD
Series Name
SI-3000KF
SI-3000ZF
Output Current
(A)
1.0
3.0
Package
TO220F-5
TO220F-5
Low Current
Consumption
During OFF
Output
ON/OFF
Overcurrent
Protection
Characteristic
Foldback
Foldback
Page
28
30
Variable (Reference Voltage)
(V)
1.0 1.1
Thru-Hole Type
7
ICs
1-1 Regulator ICs
Switching Mode Regulator ICs (built-in overcurrent, thermal protection circuits)
Drooping
Drooping
68
70
*1: 35V for SI-8033S
SI-8000E
SI-8000JF
SI-8000TFE
SI-8000GL
SI-8000S
SI-8100QL
*2
SI-8000FFE
SI-8000HFE
SI-8100Y
*2
0.6
1.5
1.5
1.5
3.0
3.5
3.5
5.5
8.0
(V)
43
43
43
53
43
*1
30
43
43
45
TO220F-5
TO220F-5
TO220F-5
DIP8
TO220F-5
DIP8
TO220F-5
TO220F-5
TO220F-7
*2:Current Mode Control
SI-8011NVS
SI-8405NL
SI-8511NVS
SI-8405NH
SI-8205NHD
–
–
–
–
3.0
25
6
25
6
46
TSSOP24
SOP8
TSSOP24
SOP8
HSOP8
–
–
–
–
Drooping
Drooping
78
80
Series Name
SAI
Output Current
(A)
Package
P
S4
Low Current
Consumption
During OFF
–
–
–
–
Output
ON/OFF
–
–
Overcurrent
Protection
Characteristic
Drooping
Drooping
Foldback
Drooping
Drooping
Drooping
Drooping
Drooping
Drooping
Foldback
Page
34
36
38
40
42
44
48
50
50
52
Variable
(Reference Voltage)
(V)
0.5 0.8 1.0
(V)
35
Maximum
Input
Voltage
Surface-Mount Type
Output Voltage
(V)
3.3 5 9 12
SI-8000W
SI-8000JD
SI-8000TM
SI-8000SD
SPI-8000A
SI-8000Q*
SI-8000FDE
SI-8000FDL
SI-8000HD
0.4
0.5
0.6
1.5
1.5
3.0
3.0
3.5
3.5
3.5
5.5
35
43
43
43
53
30
43
43
43
SOP8
TO263-5
TO252-5
TO263-5
HSOP16
HSOP8
TO263-5
TO263-5
TO263-5
*:Current Mode Control
Package Low Current
Consumption
During OFF
–
–
–
Output
ON/OFF
–
Overcurrent
Protection
Characteristic
Drooping
Foldback
Drooping
Foldback
Drooping
Drooping
Drooping
Page
54
56
58
60
62
64
66
Output V oltage
(V)
3.3 5 9 12 15
Variable
(Reference Voltage)
(V)
0.8 1.0 1.5
0.5
Maximum
Input
Voltage
Thru-Hole Type
Series Name
Output Current
(A)
Series Name
(A)
Package Low Current
Consumption
During OFF
Output
ON/OFF
Overcurrent
Protection
Characteristic
Foldback
Drooping
Drooping
Page
72
74
76
Variable
(Reference Voltage)
(V)
0.5 1.1 (V)
Surface-Mount, Synchronous Rectifier Type
Maximum
Input
Voltage
Oscillation Frequency
Flywheel Diode (Schottky-Barrier Diode) Built-in Type
Series Name
STA810M
STA820M
Output Current
(A)
1.5
3.0
Package
SIP8 (STA8Pin)
SIP8 (STA8Pin)
Low Current
Consumption
During OFF
–
Output
ON/OFF
Overcurrent
Protection
Characteristic
Foldback
Drooping
Page
82
84
Output Voltage
(V)
56.5
Maximum
Input
Voltage
(V)
43
31
Series Name
SI-8400L
SI-8500L
(A)
0.5
1.0
Package
Non-package
type (EI-12.5 core)
Non-package
type (EI-19 core)
–
–
Output
ON/OFF
–Drooping
Drooping
Page
86
86
Output Voltage
(V)
5 (V)
35
35
L-Combined Type
Low Current
Consumption
During OFF
Overcurrent
Protection
Characteristic
Maximum
Input
Voltage
Output Current
8ICs
Series Name
STA801M
SPI-8001TW
SPI-8002TW
SPI-8003TW
SI-3002KWM
ch1
ch2
ch1
ch2
ch1
ch2
ch1
ch2
ch1
ch2
Package
SIP10
(STA10Pin)
HSOP16
HSOP16
HSOP16
TO252-5
Low Current
Consumption
During OFF
–
–
™
™
™
–
Remarks
Built i-in flywheel diode
(Schottky-barrier diode)
Built i-in flywheel diode
(Schottky-barrier diode)
Frequency V ariable
Multi Output Type Regulator ICs
Output Voltage
(V)
5.0
Select from 9,11.5,
12.1 and 15.5
Variable(1.0-16V)
Variable(1.0-16V)
Variable(1.0-24V)
Variable(1.0-24V)
Variable(1.0-24V)
Variable(1.0-24V)
3.3
2.5
Output Current
(A)
0.5
0.5
1.5
1.5
1.5
1.5
1.5
1.5
1.0
1.0
Regulator Type
Step-down switching type
Step-down switching type
Step-down switching type
Step-down switching type
Step-down switching type
Linear type
Functions
Overcurrent Protection Thermal ON/OFF
Protection Control
Drooping ™™
Drooping ™™
Foldback ™™
Foldback ™™
Foldback ™™
Foldback ™™
Foldback ™™
Foldback ™™
Foldback ™™
Foldback ™™
Page
90
92
92
92
96
1-1 Regulator ICs
2-Output Type
9
ICs
■ Heat dissipation and Reliability
The reliability of an IC is highly dependent on its operating temperature.
Please be sure to apply silicone grease to the IC and to mount it to the
heatsink with a proper mounting torque.
Heatsink design should pay particular attention to ensuring sufficient heat
dissipation capacity.
In addition, please take into account the air convection in operation.
■ Calculating Internal Power Dissipation(PD)
PD is given by the following formula:
PD=IO • [VIN(mean)–VO]
Determine the size of the heatsink according to the relationship between
allowable power dissipation and ambient temperature.
■ Setting DC Input Voltage
The following is the waveform of a DC input voltage.
When setting the DC input voltage, please follow the instructions below:
●Make VIN(min) ≥ [ (Output voltage) + (Minimum dropout voltage) ]
●Make VIN(max) ≤ DC input voltage shown in the "Absolute Maximum Ratings"
■ Thermal Design
The maximum junction temper ature Tj(max) given in the absolute maximum r at-
ings is specific to each product type and must be strictly observed. Thus, ther-
mal design must consider the maximum power dissipation PD(max), which var-
ies by the conditions of use, and the maximum ambient temperature Ta(max).
To simplify thermal design, Ta-PD characteristic graphs are provided herein.
Please observe the following steps for heatsink design:
1. Obtain the maximum ambient temperature Ta(max).
2. Obtain the maximum power dissipation PD(max).
3. Look for the intersection point on the Ta-PD characteristic graph and deter-
mine the size of the heatsink.
Although the heatsink size is now obtained, in actual applications, 10-to-20%
derating f actor is gener ally introduced. Moreov er, the heat dissipation capacity
of a heatsink highly depends on how it is mounted. Thus, it is recommended to
measure the heatsink and case temperature in the actual operating environ-
ment.
Please refer to the Ta-PD characteristic graphs for respective product types.
1-1-1 Linear Regulator ICs
Application Note
Application Note
V
IN (
min.
)
V
IN
(
mean
)
V
IN
(
max.
)
Input Ripple
Series Name
SI-3000LU Series
SI-3000LSA Series
SI-3000KS Series
SI-3000KM Series
SI-3000KD Series
SI-3000LLSL Series
SI-3000ZD Series
SI-3000KF Series
SI-3000ZF Series
Diodes
AM01Z(Axial Type, VRM:200V, IO:1.0A)
RM10Z (Axial Type, VRM:200V, IO:1.5A)
SJPM-H4(Surface-Mount Stand-Alone Type, VRM:400V,IO:2.0A)
■ Mounting Torque
SI-3000KF 0.588 to 0.686 [N•m] ( 6.0 to 7.0 [kgf•cm] )
SI-3000ZF
■ Recommended Silicone Grease
•Shin-Etsu Chemical Co., Ltd.: G746
•Momentive Performance Materials Inc.: YG-6260
•Dow Corning Toray Silicones Co., Ltd.: SC102
Please select proper silicone grease carefully since the oil in some grease
products may penetrate the device and result in an extremely shor t device
life.
■ Others
• Devices can not be operated in parallel connection aiming for a larger cur-
rent.
• Diodes for isolation purpose are provided in between input and ground, and
also in between output and ground. The y may be broken down if the device is
reverse biased. In this case, please clamp the device with low VF diodes to
protect them.
■ Rectifier Diodes for Power Supplies
To rectify the AC input voltage using rectifier diodes for power supplies,
please use SANKEN rectifier diodes shown in the following list. (Please
use a center-tap or bridge configuration in using stand-alone type diodes.)
10 ICs
1-1-1 Linear Regulator ICs
■Absolute Maximum Ratings■Features
•Compact surface-mount package (SOT89-5)
•Output current: 250 mA
•Low current consumption lq (OFF) ≤ 1
µ
A (VC =
0 V)
•Low dropout voltage: VDIF ≤ 0.5 V (at IO = 250
mA)
•Output voltage range (1.5V to 15V)
•Built-in drooping-type-overcurrent and ther mal
protection circuits
■Applications
•Auxiliary power supplies for PC
•Battery-dr iven electronic equipment
■Recommended Operating Conditions
Unit
V
V
mA
W
°C
°C
°C/W
Ratings
18
VIN
250
0.75
–40 to +135
–40 to +125
146
Symbol
VIN
VC
IO
PD*1
Tj*2
Tstg*2
θ
j-a*1
Parameter
DC Input Voltage
Output control terminal voltage
DC Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
*1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%).
*2: Thermal protection circuits may operate if the junction temperature exceeds 135°C.
Parameter
Input V oltage
DC Output Current
Operating Ambient Temperature
Symbol
VIN
IO
Top
Ratings
min. max.
*2, *3 VO+2*1
0250
–20 85
Unit
V
mA
°C
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
Calculate these values referring to the reference data on page 11.
*2: Refer to the Dropout Voltage parameter.
*3: For the SI-3012LU, set the input voltage to Vin ≥ 2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note.
(Ta=25°C)
Surface-Mount, Low Current Consumption, Low Dropout Voltage Linear Regulator ICs
SI-3000LU Series
■Electrical Characteristics (Ta=25°C, VC=2V unless otherwise specified)
*1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V, and IO = 10 mA.
*2: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
Unit
V
V
mV
mV
mV/°C
dB
µ
A
µ
A
mA
V
µ
A
µ
A
Parameter
Reference V oltage
Dropout V oltage
Line Regulation
Load Regulation
Temperature Coefficient of
Reference Voltage
Ripple Rejection
Quiescent Circuit
Current
Circuit Current at Output OFF
Overcurrent Protection
Starting Current
*1
Control Voltage (Output ON)
*2
Control V oltage (Output OFF)
*2
V
C
Control Current (Output ON)
Terminal
Control Current (Output OFF)
Symbol
V
ADJ
Conditions
V
DIF
Conditions
Conditions
∆V
LINE
Conditions
∆V
LOAD
Conditions
∆V
O
/∆T
a
Conditions
R
REJ
Conditions
I
q
Conditions
I
q
(OFF)
Conditions
I
S1
Conditions
V
C
, IH
V
C
, IL
I
C
, IH
Conditions
I
C
, IL
Conditions
Ratings
SI-3012LU(Variable)
min. typ. max.
1.210 1.250 1.290
V
IN
=V
O
+1V, I
O
=10mA
T
j
=0 to 100°C
0.3
I
O
=100mA(V
O
=3.3V) 0.5
I
O
=250mA(V
O
=3.3V) 10
V
IN
=V
O
+1 to V
O
+5V,
I
O
=10mA( V
O
=3.3V)
20
V
IN
=V
O
+1V,
I
O
=1 to 250mA( V
O
=3.3V)
±0.3
55
V
IN
=V
O
+1V,
f=100 to 120H
Z
( V
O
=3.3V)
150
V
IN
=V
O
+1V, I
O
=0mA
V
C
=2V, R2=100kΩ1
V
IN
=V
O
+1V, V
C
=0V
260 V
V
C
=2V
V
C
=0V
IN
=V
O
+1V
2.0 0.8
40
0–5
11
ICs
SI-3000LU Series
■External Dimensions (SOT89-5)
Pin Assignment
qADJ
wGND
eVC
rVIN
tVO
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.05g
(Unit : mm)
4.5
±0.05
0.1
±0.05
0.4
±0.03
1.6
±0.05
4.2
±0.05
4.2
±0.05
4.2
±0.05
4.2
±0.05
4.2
±0.05
4.7
±0.05
4.3
±0.05
2.5
±0.05
0.90
±0.1
0.90
±0.1
0.40
1.5
±0.05
1.5
±0.05
1.5
±0.05
0.4
±0.05
( 1.0
±0.05
)
φ
tr
qwe
■Block Diagram
■Standard External Circuit
■Reference Data
CO:Output capacitor (10
µ
F or larger)
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
CIN:Input capacitor (10
µ
F approx.)
•Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
R1 and R2: Resistors for output setting
The output voltage can be set b y connecting R1 and R2 as sho wn in the
diagram on the left.
R2: 100 kΩ is recommended
R1=(V
O
–V
ADJ
)/(V
ADJ
/R2)
SI-3012LU
REF
TSD
+
–
V
IN
V
C
V
O
GND
4
3
5
2
ADJ
1
Copper Laminate Area vs Power Dissipation
Tj=100°C PCB size 40×40
SI-3012LU
4
3
2
5
1
+
V
IN
V
IN
V
C
V
O
A
DJ
C
IN
R
1
R
2
GND
Load
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 100 1000
Copper Laminate Area (mm
2
)
Power Dissipation P
D
(W)
Ta=25°C
Ta=40°C
Ta=60°C
Ta=85°C
Case temperature Tc
measurement point
•A monolithic ICs mounts an inner frame stage that is connected to the
GND pin (pin 2). Therefore, enlarging the copper laminate area connected
to the GND pin improves heat radiation effect.
•Obtaining the junction temperature
Measure the temperature TC at the lead part of the GND pin (pin 2) with a
thermocouple, etc. Then, substitute this value in the following formula to
obtain the junction temperature.
T
j
=P
D
×θ
j–c+Tc (
θ
j–c=5
°
C/W)
12 ICs
1-1-1 Linear Regulator ICs
■Absolute Maximum Ratings
■Recommended Operating Conditions
Unit
V
V
A
W
W
°C
°C
°C
°C/W
°C/W
Ratings
16
VIN
1
1.16
1.1
–30 to +150
–30 to +150
–30 to +150
36
100
Symbol
VIN
VC
IO
PD1*1
PD2*2
Tj*3
Top
Tstg
θ
j-L
θ
j-a*2
Parameter
DC Input Voltage
Output control terminal voltage
DC Output Current
Power Dissipation
Junction Temperature
Operating Ambient Temperature
Storage Temperature
Thermal Resistance (Junction to Lead (pin 8))
Thermal Resistance (Junction to Ambient Air)
Parameter
DC Input Voltage Range
DC Output Current Range
Operating Junction Temperature
Operating Ambient Temperature
Symbol
VIN
IO
Tjop
Taop
Unit
V
A
°C
°C
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN – VO) × IO.
Please calculate these values referring to the reference data on page 13.
*2: Refer to the Dropout Voltage parameter.
(Ta=25°C)
■Features
•Compact surface-mount package (SOP8)
•Output current: 1 A
•Low circuit current at output OFF: Iq(OFF) ≤ 1
µ
A (VC = 0 V)
•Low dropout voltage: VDIF≤0.8 V (at IO = 1 A)
VDIF ≤1.2 V (IO = 1 A) for SI-3018LSA
•4 types of output voltages (1.8 V, 2.5 V, 3.3 V,
5.0 V) a vailable
•Output ON/OFF control terminal voltage
compatible with LS-TTL
•Built-in foldback-type-overcurrent and thermal
protection circuits
■Applications
•Auxiliar y power supplies for PC
•Battery-dr iven electronic equipment
Ratings
SI-3018LSA SI-3025LSA SI-3033LSA SI-3050LSA
3.1 to 3.5*1 *2 to 3.5*1 *2 to 5.2*1 *2 to 8.0
0 to 1
–20 to +125
–30 to +85
■Electrical Characteristics (Ta=25°C, VC=2V unless otherwise specified)
Unit
V
V
mV
mV
mV/°C
dB
mA
µ
A
A
V
µ
A
µ
A
Parameter
Output Voltage
Dropout V oltage
Line Regulation
Load Regulation
Temperature Coefficient of
Output Voltage
Ripple Rejection
Quiescent Circuit Current
Circuit Current at Output OFF
Overcurrent Protection
Starting Current*1,3
Control Voltage (Output ON)
*2
Control Voltage (Output OFF)
*2
V
C
Control Current (Output ON)
Terminal
Control Current (Output OFF)
Symbol
VO
Conditions
VDIF
Conditions
Conditions
∆VLINE
Conditions
∆VOLOAD
Conditions
∆VO/∆Ta
Conditions
RREJ
Conditions
Iq
Conditions
Iq(OFF)
Conditions
IS1
Conditions
VC, IH
VC, IL
IC, IH
Conditions
IC, IL
Conditions
*1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V (5 V for SI-3033LSA), and IO = 0.5 A.
*2: Output is OFF when the output control terminal VC is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
*3: These products cannot be used in the following applications. Because these applications require a certain current at start-up and so the built-in foldback-type overcurrent
protection may cause errors during start-up stage.
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage
Ratings
SI-3018LSA SI-3025LSA SI-3033LSA SI-3050LSA
min. typ. max. min. typ. max. min. typ. max. min. typ. max.
1.764 1.800 1.836 2.450 2.500 2.550 3.234 3.300 3.366 4.90 5.00 5.10
VIN=3.3V, IO=0.5A VIN=3.3V, IO=0.5A VIN=5V, IO=0.5A VIN=6V, IO=0.5A
–0.4 0.4 0.4
–IO≤0.5A IO≤0.5A IO
≤
0.5A
0.6 1.2 0.8 0.8 0.8
IO≤1A
210 210 310 315
VIN=3.1 to 3.5V, IO=0.3A VIN=3.1 to 3.5V, IO=0.3A VIN=4.5 to 5.5V, IO=0.3A VIN=6 to 7V, IO=0.3A
10 20 10 20 10 20 10 30
VIN=3.3V, IO=0 to 1A VIN=3.3V, IO=0 to 1A VIN=5V, IO=0 to 1A VIN=6V, IO=0 to 1A
±0.3 ±0.3 ±0.3 ±0.5
V
IN
=3.3V, I
O
=5mA, T
j
=0 to 100°CV
IN
=3.3V, I
O
=5mA, T
j
=0 to 100°CV
IN
=5V, I
O
=5mA, T
j
=0 to 100°CV
IN
=6V, I
O
=5mA, T
j
=0 to 100°C
60 57 55 55
VIN=3.3V, f=100 to 120HZVIN=3.3V, f=100 to 120HZVIN=5V, f=100 to 120HZVIN=6V, f=100 to 120HZ
1.7 2.5 1.7 2.5 1.7 2.5 1.7 2.5
VIN=3.3V, IO=0A VIN=3.3V, IO=0A VIN=5V, IO=0A VIN=6V, IO=0A
1111
VIN=3.3V, IO=0A, VC=0V VIN=3.3V, IO=0A, VC=0V VIN=5V, IO=0A, VC=0V VIN=6V, IO=0A, VC=0V
1.2 1.2 1.2 1.2
VIN=3.3V VIN=3.3V VIN=5V VIN=6V
2.0 2.0 2.0 2.0
0.8 0.8 0.8 0.8
40 80 40 80 40 80 40 80
VC=2V
0–5 0–5 0–5 0–5
VC=0V
*1: When mounted on glass-epoxy board 56.5 × 56.5 mm (copper laminate area 100%).
*2: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 100%).
*3: Thermal protection circuits may be activated if the junction temperature exceeds 135°C.
Surface-Mount, Low Current Consumption, Low Dropout Voltage Linear Regulator ICs
SI-3000LSA Series
13
ICs
SI-3000LSA Series
■External Dimensions (SOP8) (Unit : mm)
0.995max.
0.10
1.27
0.4
±0.1
0.4
±0.1
0.15
+0.1
5.1
±0.4
1.27
8765
1234
4.4
±0.2
1.5
±0.1
1.55
±0.15
0.05
±0.05
0 to 10°
0.5
±0.1
6.2
±0.3
–0.05
0.12 M
Pin Assignment
qVIN
wNC (Leave open)
eVIN
rVC
tGND
yGND
uVO
iVO
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
■Block Diagram
■Typical Connection Diagram
■Reference Data
CO:Output capacitor (22
µ
F or larger)
CIN:Input capacitor (10
µ
F)
This capacitor is required in the case of an inductive input line or long
wiring.
Tantalum capacitors are recommended for CIN and CO, particularly at
low temperatures .
* Leave pin 2 open.
TSD
+
–
VIN
NC
VIN
VC
VO
VO
GND
GND
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
+
V
IN
V
IN
V
C
V
O
C
IN
C
O
GND
+
Load
PCB Copper Laminate Area vs. Junction to
Ambient Air Thermal Resistance Allowable Output Current
(vs. VIN-VOUT Voltage Difference)
VIN-IO max
The inner frame stage, on which the PTr is mounted,
is directly connected to the VOUT pin.
Therefore, enlarging the copper laminate area
around the VOUT pin is really effective for a heat ra-
diation.
150
140
130
120
110
100
90
80
70
100 1000 5000
Copper Laminate Area (mm2)
PCB (glass-epoxy, 40×40mm)
160mm (40×40) mm
j-a (°C/W)
1.2
1.0
0.8
0.6
0.4
0.2
01234
VIN-VOUT Voltage Difference (V)
Tj = 120°C (20% derating of 150°C)
Iout (max) (A)
Ta=25°C
Ta=85°C
j-a=100°C/W
θ
θ
14 ICs
1-1-1 Linear Regulator ICs
■Absolute Maximum Ratings
Unit
V
V
A
W
°C
°C
°C/W
°C/W
Ratings
17
VIN
1.0
0.76
–40 to +125
–40 to +125
130
22
Symbol
VIN*1
VC
IO*1
PD*1, *2
Tj
Tstg
θ
j-a
θ
j-L
Parameter
DC Input Voltage
Output Control Terminal Voltage
DC Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
Thermal resistance (Junction to Lead (pin 7))
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. Please calculate these values referring to the
Copper laminate area vs. Power dissipation data as shown hereinafter.
*2: When mounted on a glass epoxy board of 1600 mm2 (copper laminate area 2%).
(Ta=25°C)
■Features
•Compact surface-mount package (SOP8)
•Output current: 1.0 A
•Compatible with low ESR capacitor
•Low circuit current at output OFF Iq ≤ 350
µ
A
(IO = 0 A, VC = 2 V)
•Low current consumption Iq (OFF) ≤ 1
µ
A (VC
= 0 V)
•Low dropout voltage VDIF ≤ 0.6 V (IO = 1 A)
•3 types of output voltages (2.5 V, 3.3 V, and
variable type) available
•Output ON/OFF control terminal voltage
compatible with LS-TTL
•Built-in drooping-type-overcurrent and thermal
protection circuits
■Applications
•Local power supplies
•Battery-driven electronic equipment
■Electrical Characteristics (Ta=25°C, Vc=2 V unless otherwise specified)
*1: Refer to the Dropout Voltage parameter.
*2: The Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = VO + 1 V, and IO = 10 mA.
*3: Output is OFF when the output control terminal VC is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
Surface-Mount, Low Current Consumption, Low Dropout Voltage Linear Regulator ICs
SI-3000KS Series
Unit
V
V
V
mV
mV
µ
A
µ
A
mV/°C
dB
A
V
µ
A
µ
A
Parameter
Input V oltage
Output Voltage
(Reference voltage V
ADJ
for SI-3012KS)
Dropout V oltage
Line Regulation
Load Regulation
Quiescent Circuit Current
Circuit Current at Output OFF
Temperature Coefficient of
Output V oltage
Ripple Rejection
Overcurrent Protection
Starting Current*2
Control Voltage (Output ON)
*3
Control Voltage (Output OFF)
VC
Control Current (Output ON)
Terminal
Control Current (Output OFF)
Symbol
VIN
VO (VADJ)
Conditions
VDIF
Conditions
Conditions
∆VOLINE
Conditions
∆VOLOAD
Conditions
Iq
Conditions
Iq (OFF)
Conditions
∆VO/∆Ta
Conditions
RREJ
Conditions
IS1
Conditions
VC, IH
VC, IL
IC, IH
Conditions
IC, IL
Conditions
Ratings
SI-3012KS (variable type) SI-3025KS SI-3033KS
min. typ. max. min. typ. max. min. typ. max.
2.4 *1 *1
1.24 1.28 1.32 2.45 2.50 2.55 3.234 3.300 3.366
0.3 0.4 0.4
0.6 0.6 0.6
10 10 15
40 40 50
350 350 350
111
±0.3 ±0.3 ±0.3
55 55 55
1.2 1.2 1.2
2.0 2.0 2.0
0.8 0.8 0.8
40 40 40
–5 0 –5 0 –5 0
VIN=3.3V, IO=10mA
IO=0.5A
IO=1A
VIN=3.3 to 8V, IO=10mA
VIN=3.3V, IO=0 to 1A
VIN=3.3V, IO=0A, VC=2V
VIN=3.3V, VC=0V
Tj=0 to 100°C
VIN=3.3V, f=100 to 120HZ
VIN=3.3V, IO=10mA
IO=1A (VO=2.5V)
V
IN
=3.3 to 8V, I
O
=10mA (V
O
=2.5V)
V
IN
=3.3V, I
O
=0A, V
C
=2V, R2=24kΩ
V
IN
=3.3V, I
O
=0 to 1A (V
O
=2.5V)
V
IN
=3.3V, f=100 to 120H
Z
(V
O
=2.5V)
Tj=0 to 100°C (VO=2.5V)
VIN=3.3V, VC=0V
VIN=3.3V (VO=2.5V)
IO=0.5A (VO=2.5V)
VC=0V
VC=2V
VIN=3.3V
VIN=5V, IO=10mA
IO=0.5A
IO=1A
VIN=5 to 10V, IO=10mA
VIN=5V, IO=0 to 1A
VIN=5V, IO=0A, VC=2V
VIN=5V, VC=0V
Tj=0 to 100°C
VIN=5V, f=100 to 120HZ
VIN=5V
15
ICs
SI-3000KS Series
■External Dimensions (SOP8) (Unit : mm)
0.995max.
0.10
1.27
0.4
±0.1
0.4
±0.1
0.15
+0.1
5.1
±0.4
1.27
8765
1234
4.4
±0.2
1.5
±0.1
1.55
±0.15
0.05
±0.05
6.2
±0.3
0 to 10°
0.5
±0.1
–0.05
0.12 M
Pin Assignment
qVC
wVIN
eVO
rSence (ADJ for SI-3012KS)
tGND
yGND
uGND
iGND
Plastic Mold Package Type
Flammability: UL 94V-0
Product Mass: Approx. 0.1 g
■Block Diagram
■Typical Connection Diagram
●SI-3012KS ●SI-3025KS, SI-3033KS
●SI-3012KS ●SI-3025KS, SI-3033KS
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2
as shown abov e.
The recommended value of R2 is 24 kΩ .
R1=(V
O
–V
ADJ
)
÷
(V
ADJ
/R2)
2VIN
1
REF
VC
VO
ADJ
GND
4
8
7
6
5
3
TSD
-
+
2V
IN
1
REF
V
C
V
O
Sense
GND
4
8
7
6
5
3
TSD
-
+
GND
5 to 8
VIN
CIN
R1
R2
2VO
CO
3
VC
1ADJ
4
Load
GND
5 to 8
V
IN
C
IN
R2
2V
O
C
O
3
V
C
1
sense
4
Load
CIN:Input capacitor (22
µ
F or larger)
CO:Output capacitor (22
µ
F or larger)
For SI-3000KS series, Co has to be a low ESR capacitor.
When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature.
■Reference Data
Copper Laminate Area vs.
Thermal Resistance Copper Laminate Area vs.
Power Dissipation
•Obtaining the junction temperature
Measure the temperature TL at the lead part of the GND
pin (pin 7) with a thermocouple, etc. Then, substitute
this value in the following formula to obtain the junction
temperature.
T
j
=P
D
× θ
j–L
+ T
L
(
θ
j–L
= 22
°
C/W)
Thermal resistance j-a (°C/W)
Copper laminate area (mm
2
)
(GND terminal)
10 100
140
120
100
80
60
40 1000
Area of PC board : 40×40mm
θ
Power dissipation P
D
(W)
10 100
1.2
1
0.8
0.6
0.4
0.2
01000
Tj=100°C Area of PC board : 40×40mm
Ta=25°C
Ta=50°C
Ta=80°C
Copper laminate area (mm
2
)
(GND terminal)
