Powerful Sensing Solutions for a Better Life
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 1 of 13
Ultra Low Cost ACCELEROMETER
Chip Scale Packaged Fully Integrated Thermal Accelerometer
MXC622xXC
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 2 of 13
Features
Fully Integrated Thermal Accelerometer
X/Y Axis, 8 bit, Acceleration A/D Output (± 2g)
Chip Scale Package (1.17x1.70x1.0mm)
4-position Orientation Detection
Shake Detection with Interrupt
Programmable Shake Threshold
Shake Direction Detection
I2C Interface
Power Down Mode
Shock Survival Greater than 50,000 g
Operating Supply Voltage from 2.5V to 5.5V
Produces no Mechanical Sounds ("click")
Applications
Consumer:
Cell Phones
Digital Still Cameras (DSC)
Digital Video Cameras (DVC)
LCD TV
Toys
MP3, MP4 Players
Household Safety:
Fan Heaters
Halogen Lamps
Iron
Cooling Fans
General Description
The MEMSIC Digital Thermal Orientation Sensor is the world's first
fully-integrated orientation sensor also with chip scale package, it is the
world smallest accelerometer. Its operation is based on our patented
MEMS-thermal technology and is built using a standard 0.18um CMOS process. This
sensor contains no moving parts (such as a ball) and thus eliminates
field-reliability and repeatability issues associated with competitive
products. It also eliminates the "click" sounds typically heard in ball based
orientation sensors. Shock survival is greater than 50,000g. This sensor
detects four orientation positions, shake and shake direction. In addition,
it provides X/Y axis acceleration signals with very low 0g offset. An I2C
interface is used to communicate with this device and an interrupt pin (INT)
is provided for shake and orientation. The device also has a power down enabled
through the I2C interface.
Functional Block Diagram
Figure 1
This sensor is packaged in a Chip Scale Package (1.17x1.70x1.0mm), the product
is RoHS compatible and operates over -20~70℃ temperature range.
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 3 of 13
Y-
X+
Figure 2
Top View (small circle indicate pin 1)
Figure 3
Side View
a
eto
Figure 4
Bottom View
Pin Description: CSP Package
Pin Name Description
1 I2C SCL This pin is the serial clock line for the I2C interf ace on the MXC622XXC. Since the MXC622XXC only operates
as a slave device, this pin is always an input.
2 NC During normal operation, this pin should be left floating.
3 GND This is the ground pin for the MXC622xXC.
4 INT This pin is the MXC622xXC interrupt output. The logic level on this pin reflects the state of the INT bit in the
STATUS register. INT is set when the orientation differs from the last orientation read by the processor, or a
shake event is detected. INT is cleared upon the read of the STATUS register.
5 I2C SDA This pin is the serial data line for the I2C interface on the MXC622xXC. It is an I/O pin that functions as an input
during a write to the MXC622xXC, and an output during a read from the MXC622xXC.
6 VDD This is the power supply input for the MXC622xXC. The DC voltage should be between 2.5 and 5.5 volts.
Absolute Maximum Ratings*
Supply Voltage (VDD) ………………...-0.5 V to +7.0V
Storage Temperature ………………..-40°C to +150°C
Acceleration ……………………………… ……..50, 000 g
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
rating only; the functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Specifications1
Parameter (Units) Conditions Minimum Typical Maximum
Operating Voltage Range (V) 2.5 5.5
In power-up mode 1.0
Supply Current (mA)
In power-down mode 0.0004 0.001
Turn-On Time (ms)
2
300 500
Turn-off Time (us) 1
Operating Temperature Range (℃) -20 +70
VDD Rise Time (ms)
3
10
Notes: 1 All specifications are at 3V and room temperature unless otherwise noted. 2 Time to obtain valid data after existin
g
power-down mode. 3 Maximum allowable power supply rise time from 0.25V to 2.5V (minimum). Slower VDD rise time may cause erroneou
s
data retrieval from OTP memory at power-up.
Sensor Characteristics1
Parameter (Units) Conditions Minimum Typical Maximum
Measurement Range (g) X/Y Axis ± 2.0
Alignment Error (°) X/Y Axis ± 1.0 ± 2.0
Sensitivity Error (%) X/Y Axis ± 5.0
Sensitivity (LSB/g) X/Y Axis 64
Sensitivity Drift Over Temperature (%) Delta from 25 ℃ (-20 ℃ - 7 0 ℃) ± 15
Zero g Offset Bias Level (mg) X/Y Axis (25 ℃) ± 50
Zero g Offset Temperature coefficient
(mg/℃)
X/Y Axis (-20 ℃ - 70 ℃) 0.6
3dB Signal Bandwidth (Hz) 10
Notes: 1 All specifications are at 3V and room temperature unless otherwise noted.
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 4 of 13
Figure 5
Digital Parameters
Symbol Parameter (Units) Minimum Typical Maximum
VIH High Level Input Voltage (Volts) 0.8*VDD
VIL Low Level Input Voltage (Volts) 0.2*VDD
VHYS Hysteresis of Schmitt Trigger Input
(Volts)
0.1
IIL Input Leakage, All Inputs (uA) -10 10
VOL Low Level Output Voltage (Volts) 0.4
Digital Switching Characteristics
Symbol Parameter (Units) Minimum Typical Maximum
top Operating Valid Time (us)
1
20
fSCL SCK Clock Frequency (kHz) 0 400
tr Rise Time (us) 0.3
tf Fall Time (us) 0.3
tlow SCL Low Time (us) 1.3
thigh SCL High Time (us) 0.6
tHD;D Data Hold Time (us) 0 0.9
tSU;D Data Set-Up Time (us) 0.1
tSU;S Start Set-Up Time (us) 0.6
tHD;S Start Hold Time (us) 0.6
tSU;P Stop Set-Up Time (us) 0.6
tBF Bus Free Time Between Start and Stop (us) 1.3
Notes: 1 Time to operate MXC622XXC through I
2
C interface after power being supplied to VDD.
S
VDD
SDA
SCL
top
tf
tHD;S
tlow tr
tHD;D
tSU;D
thigh tSU;S
Sr
tSU;P
tBF
P S
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 5 of 13
Circuit Schematics
GND
C1
0.1u
R1
2.7K 6
5
43
2
1R2
2.7K
SCL
SDA
SCL
NC
GND
VDD
SDA
INT INT
VDD
Figure 6
Note:
R1 and R2 are pull-up resistors, the value can be determined by customer
according to the requirement of the host device.
INT does not need any pull-up/pull-down resistor
If INT is not used, just keep it disconnected, don't pull up or pull down
Leave NC pin as no connection.
Landing Pattern
Figure 7
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 6 of 13
Reflow Profile
Figure 8
Reflow Profile
Note:
Reflow is limited by 2 times
The second reflow cycle should be applied after device has
cooled down to 25℃ (room temperature)
This is the reflow profile for Pb free process
The peak temperature on the sensor surface should be limited
under 260℃ for 10 seconds.
Solder paste’s recommendation can be followed for the best
SMT quality.
Manual Soldering
Figure 9
Chip Scale Package
Note:
When soldering manually or repairing via soldering iron for
a Chip Scale packaged device, the time should be limited
to less than 10 seconds and the temperature should not
exceed 275℃. If a heat gun is used, the time should be
limited to less than 10seconds and the temperature should
not exceed 270℃
Please avoid to bend the PCB after the sensor assembly
Low Temperature Glass
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 7 of 13
Orientation (Bottom View)
State Bits OR
[1,0]
1
2
34
5
6
o
t
e
a
01
1
2
34
5
6a
eto
00
1
2
34
5
6
o
t
e
a
11
1
2
34
5
6
o
t
e
a
10
+
Same Plane
Bottom View
θ
to
a
e
Figure 10
Orientation/Shake Characteristics
Output state response to orientation
If the sensor is rotated past the 45 degree threshold, the orientation bits will change only
if the sensor stays in the same state for a defined period of time. If the sensor crosses back
before this time period, the orientation bits remain unchanged. This is to prevent dithering
of the orientation state. Four user programmable hysteresis time periods are available : 160,
320, 640 and 1280ms.
Figure 11 Figure 12
MXC622xXC is guaranteed to detect orientation changes with up to 60 degrees of off-axis tilt
Shake Detection
Shake and shake direction are orthogonal to screen orientation. An interrupt pin (INT) is set
high and must be cleared by the MCU via the I2C interface. Four user programmable thresholds
are available: 0.5g, 1g, 1.5g and 2g.
Figure 13
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 8 of 13
I2C Interface
A slave mode I2C interface, capable of operating in standard or fast mode, is implemented on the MXC622xXC. The interface uses a serial
data line (SDA) and a serial clock line (SCL) to achieve bi-directional communication between master and slave devices. A master (typically
a microprocessor) initiates all data transfers to and from the device, and generates the SCL clock that synchronizes the data transfer.
The SDA pin on the MXC622xXC operates both as an input and an open drain output. Since the MXC622xXC only operates as a slave device,
the SCL pin is always an input. There are external pull-up resistors on the I2C bus lines. Devices that drive the I2C bus lines do so
through open-drain n-channel driver transistors, creating a wired NOR type arrangement.
Data on SDA is only allowed to change when SCL is low. A high to low transition on SDA when SCL is high is indicative of a START condition,
whereas a low to high transition on SDA when SCL is high is indicative of a STOP condition. When the interface is not busy, both SCL
and SDA are high. A data transmission is initiated by the master pulling SDA low while SCL is high, generating a START condition. The
data transmission occurs serially in 8 bit bytes, with the MSB transmitted first. During each byte of transmitted data, the master will
generate 9 clock pulses. The first 8 clock pulses are used to clock the data, the 9th clock pulse is for the acknowledge bit. After the
8 bits of data are clocked in, the transmitting device releases SDA, and the receiving device pulls it down so that it is stable low
during the entire 9th clock pulse. By doing this, the receiving device "acknowledges" that it has received the transmitted byte. If the
slave receiver does not generate an acknowledge, then the master device can generate a STOP condition and abort the transfer. If the
master is the receiver in a data transfer, then it must signal the end of data to the slave by not generating an acknowledge on the last
byte that was clocked out of the slave. The slave must release SDA to allow the master to generate a STOP or repeated START condition.
The master initiates a data transfer by generating a START condition. After a data transmission is complete, the master may terminate
the data transfer by generating a STOP condition. The bus is considered to be free again a certain time after the STOP condition.
Alternatively, the master can keep the bus busy by generating a repeated START condition instead of a STOP condition. This repeated START
condition is functionally identical to a START condition that follows a STOP. Each device that sits on the I2C bus has a unique 7 bit
address.
The first byte transmitted by the master following a START is used to address the slave device.
The first 7 bits contain the address of the slave device, and the 8th bit is the R/W* bit (read = 1, write = 0; the asterisk indicates
active low, and is used instead of a bar). If the transmitted address matches up to that of the MXC622xXC, then the MXC622xXC will acknowledge
receipt of the address, and prepare to receive or send data.
If the master is writing to the MXC622xXC, then the next byte that the MXC622xXC receives, following the address byte, is loaded into
the address counter internal to the MXC622xXC. The contents of the address counter indicate which register on the MXC622xXC is being
accessed. If the master now wants to write data to the MXC622xXC, it just continues to send 8-bit bytes. Each byte of data is latched
into the register on the MXC622xXC that the address counter points to. The address counter is incremented after the transmission of each
byte.
If the master wants to read data from the MXC622xXC, it first needs to write the address of the register it wants to begin reading data
from to the MXC622xXC address counter. It does this by generating a START, followed by the address byte containing the MXC622xXC address,
with R/W* = 0. The next transmitted byte is then loaded into the MXC622xXC address counter. Then, the master repeats the START condition
and re-transmits the MXC622xXC address, but this time with the R/W* bit set to 1. During the next transmission period, a byte of data
from the MXC622xXC register that is addressed by the contents of the address counter will be transmitted from the MXC622xXC to the master.
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 9 of 13
As in the case of the master writing to the MXC622xXC, the contents of the address counter will be incremented after the transmission
of each byte. The protocol for multiple byte reads and writes between a master and a slave device is depicted in Figure 14.
Figure 14
The I2C address for MXC622xXC is set as:
Product Address
MXC6220XC 20h
MXC6221XC 22h
MXC6222XC 24h
MXC6223XC 26h
MXC6224XC 28h
MxC6225XC 2Ah
MXC6226XC 2Ch
MXC6227XC 2Eh
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 10 of 13
User Register Summary
Address Name Definition Access Default
$00 XOUT 8-bit x-axis acceleration output read 00000000
$01 YOUT 8-bit y-axis acceleration output read 00000000
$02 STATUS orientation and shake status read 00000000
$04 DETECTION Power down, orientation and shake detection parameters write 00000000
$08 CHIP_ID Chip ID of MXC622xXC read xx000xxx
The registers available to the user on the MXC622xXC are summarized in the table above. Each register contains 8 bits.
$00: XOUT – 8-bit x-axis acceleration output (read only)
D7 D6 D5 D4 D3 D2 D1 D0
XOUT[7] XOUT[6] XOUT[5] XOUT[4] XOUT[3] XOUT[2] XOUT[1] XOUT[0]
8-bit x-axis acceleration output. Data in 2's complement format with range of -128 to +127.
$01: YOUT – 8-bit y-axis acceleration output (read only)
D7 D6 D5 D4 D3 D2 D1 D0
YOUT[7] YOUT[6] YOUT[5] YOUT[4] YOUT[3] YOUT[2] YOUT[1] YOUT[0]
8-bit y-axis acceleration output. Data in 2's complement format with range of -128 to +127.
$02: STATUS – orientation and shake status register (read only)
D7 D6 D5 D4 D3 D2 D1 D0
INT SH[1] SH[0] TILT ORI[1] ORI[0] OR[1] OR[0]
OR[1:0] is a 2-bit indication of the device orientation, according to the following scheme: OR[1:0] = 01 – device is vertical in upright
orientation; 00 – device is rotated 90 degrees clockwise; 11– device is vertical in inverted orientation; 10 – device is rotated 90
degrees counterclockwise. The bits OR[1:0] are indicative of "long-term" orientation. The orientation is determined by measuring the
signs of the quantities ax – ay, and ax + ay, as shown in Figure 12. In addition to these measurements, the orientation measurement
must be validated by requiring that the larger in magnitude of ax, ay be greater than 3/8 g. In order for a new value of OR[1:0] to be
written to the STATUS register, a valid measurement of the new orientation must be measured a consecutive number of times determined
by the setting of bits ORC[1:0] in the DETECTION register. This provides a low-pass filtering and hysteresis effect that keeps a display
from flickering near orientation boundaries
ORI[1:0] is the instantaneous device orientation. It follows the same scheme as OR[1:0], except that it is updated every time a valid
orientation measurement is made, not subject to the same low-pass filtering as OR[1:0].
TILT is an indication of whether there is enough acceleration signal strength to make a valid orientation measurement. If TILT = 0, the
orientation measurement is valid, if TILT = 1, then the orientation measurement is invalid. TILT is updated every measurement cycle.
SH[1:0] indicate whether a shake event has taken place, and if so, its direction. Shake can only be detected in a direction perpendicular
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 11 of 13
to the vertical orientation of the device. When an acceleration perpendicular to the device orientation (ax for OR[1:0] = 01 or 11; ay
for OR[1:0] = 00 or 10) is sensed that has a magnitude greater than the value set by bits SHTH[1:0] in the DETECTION register, then shake
detection begins. For a shake event to be written to SH[1:0], the perpendicular acceleration must again exceed the magnitude set by SHTH[1:0]
but with the opposite sign (if bit SHM = 0 in the DETECTION register), or just reverse its sign (if bit SHM = 1 in the DETECTION register).
The above mentioned second acceleration events must occur within a certain amount of time, set by SHC[1:0] in the DETECTION register,
of the original breaking of the threshold.
If a shake is determined to have occurred, then the direction of the shake can be determined by the signs of the accelerations. The shake
status is indicated as shown in the following table:
SH[1] SH[0] Comment
0 0 no shake event
0 1 shake left
1 0 shake right
1 1 undefined
INT is the interrupt bit. Setting this bit high will cause the INT pin to output a high level. The INT bit will be set whenever, 1. The
orientation, as indicated by bits OR[1:0] changes, or 2. A shake event occurs. The microprocessor can then service the interrupt by reading
the STATUS register. Once a shake event occurs, no new shake events will be recorded until the interrupt has been serviced, although
the orientation bits will continue to be updated. The INT bit is cleared by a microprocessor read of the STATUS register.
$04: DETECTION – orientation and shake detection parameters (write only)
D7 D6 D5 D4 D3 D2 D1 D0
PD SHM SHTH[1] SHTH[0] SHC[1] SHC[0] ORC[1] ORC[0]
PD = 1 powers down the MXC622xXC to a non-functional low power state with a maximum current drain of 1 uA.
ORC[1:0] sets the orientation hysteresis time period, which is the time period of consecutive valid new instantaneous orientation
measurements that must be made before a new orientation value is written into bits OR[1:0] in the STATUS register. The "long-term"
orientation change is set by ORC[1:0] as follows: 00 – 160ms, 01 – 320ms, 10 – 640ms, 11 – 1280ms nominally.
SHC[1:0] sets the shake events time window, which determines the time window allowed between the first shake event (perpendicular
acceleration exceeding the threshold set by SHTH[1:0]) and the second shake event (acceleration breaking the threshold with opposite
sign, SHM = 0, or just reversing sign, SHM = 1). The time window is set by SHC[1:0] as follows: 00 – 80ms, 01 – 160ms, 10 – 320ms,
11 – 640ms nominally.
SHTH[1:0] sets the shake threshold that the perpendicular acceleration must exceed to trigger the first shake event. The settings for
SHTH[1:0] are: 00 - 0.5 g, 01 – 1.0 g, 10 – 1.5 g, 11 – 2.0 g.
SHM is the shake mode bit. If SHM = 0, then for a shake to be detected, and written to SH[1:0] in the STATUS register, the second shake
event must break the threshold set by SHTH[1:0] with the opposite sign of the first shake event, within the time window set by SHC[1:0].
If SHM = 1, then the second shake event must just have the opposite sign of the first shake event within the time window set by SHC[1:0].
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 12 of 13
$08 (6LSB),: CHIP_ID – Chip ID of MXC622xXC (read only)
Product xxx
MXC6220XC 000
MXC6221XC 001
MXC6222XC 010
MXC6223XC 011
MXC6224XC 100
MxC6225XC 101
MXC6226XC 110
MXC6227XC 111
D7 D6 D5 D4 D3 D2 D1 D0
ID[7] ID[6] ID[5] ID[4] ID[3] ID[2] ID[1] ID[0]
x x 0 0 0 x x x
Powerful Sensing Solutions for a Better
Life
Ultra Low Cost ACCELEROMETER
MXC622xXC: Fully Integrated Thermal Accelerometer
MXC622xXC – Ultra Low Cost Accelerometer
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
08,08,2011
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC
for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document
is the property of MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written
permission of MEMSIC, Inc.
Rev,A 8/19/2011
Page 13 of 13
Package Drawing and Marking Illustration
Bottom View
0.025
0.025
6
5
43
2
1
Top View
Side View
O
t
e
a
6- 0.22
Figure 15
