TD62064,074APG/AFG
2006-06-13
1
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62064APG,TD62064AFG,TD62074APG,TD62074AFG
4ch High-Current Darlington Sink Driver
The TD62064APG/AFG and TD62074APG/AFG are
high-voltage, high-current darlington drivers comprised of four
NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads and all units of TD62074APG/AFG feature uncommitted
collectors and emitters for isolated darlington applications.
For proper operation, the substrate (SUB) must be connected to
the most negative voltage.
Applications include relay, hammer, lamp and stepping motor
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
• Output current (single output) 1.5 A (max)
• High sustaining voltage output
50 V (min) (TD62064APG/AFG, 074APG/AFG)
• Output clamp diodes: TD62064APG/AFG
• Isolated darlington array: TD62074APG/AFG
• Input compatible with TTL and 5 V CMOS
• GND and SUB terminal = Heat sink
• Package type-APG: DIP-16 pin
• Package type-AFG: HSOP-16 pin
TD62064APG
TD62074APG
TD62064AFG
TD62074AFG
Weight
DI P 16 - P -30 0-2.5 4A : 1.11 g (ty p .)
HSOP16-P-300-1.00: 0.50 g (typ.)
TD62064,074APG/AFG
2006-06-13
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Pin Assignm en t (top view)
TD62064APG
TD62074APG
TD62064AFG
TD62074AFG
O4
16 15 14 13 12 11 10 9
1 2 3 4 5 67 8
NC I4 I3 NC O3
COM O1 I1 I2 O2 COM
Heat sink
& GND
Heat sink
& GND
NC NC
NCNC
O4
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
NC I4
Heat sink
& GND I3 NC O3
COM O1 I1 Heat sink
& GND
I2 O2 COM
O4
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
GND I4
Heat sink
& SUB I3 GND O3
O1 GND I1 Heat sink
& SUB
I2 GND O2
O4
16 15 14 13 12 11 10 9
1 2 3 4 5 67 8
GND GND O3
O1 GND GND O2
Heat sink
& GND
Heat sink
& GND
I4 I3
I2I1
TD62064,074APG/AFG
2006-06-13
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Schematics (each driver)
TD62064APG/AFG TD62074APG/AFG
Note: The input and output parasi t ic diodes cannot be used as cl amp diodes.
Precauti ons fo r Using
(1) This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
(2) If a TD62064APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the
counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s absolute maximum ratings.
If a TD62074APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that a diode be connected between the output pin (as the anode) and the secondary power supply
pin. Please adhere to the device’s absolute maximum ratings.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Output sustaining voltage VCE (SUS) −0.5 to 50 V
Output current IOUT 1.5 A/ch
Input current IIN 50 mA
Input voltage VIN −0.5 to 17 V
Clamp diode reverse voltage VR (Note 1) 50 V
Clamp diode forward current IF (N ote 1) 1.5 A
Isolated voltage VSUB
(Note 2) 50 V
APG 1.47/2.7
(Note 3)
Power dissipat ion AFG PD 0.9/1.4
(Note 4)
W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C
Note 1: TD62064APG/AFG
Note 2: TD62074APG/AFG
Note 3: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 4: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Input Output
GND
1.1 kΩ
COMMON
230 Ω
8.2 kΩ
Input Output
GND
1.1 kΩ
230 Ω
8.2 kΩ
SUB
TD62064,074APG/AFG
2006-06-13
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Recomm end ed Operating Co nditions (Ta = −40 to 85°C)
Characteristics Symbol Test Condition
Min Typ. Max Unit
Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V
DC 1 circ uit, Ta = 25° C 0 ⎯ 1250
Duty = 10% 0 ⎯ 1250
APG (Note 1) Duty = 50% 0 ⎯ 390
Duty = 10% 0 ⎯ 907
Output current
AFG (Note 2)
IOUT
Tpw = 25 ms
4 circuits
Tj = 120°C
Ta = 85°C Duty = 50% 0 ⎯ 172
mA/ch
V
IN ⎯ 0 ⎯ 8
Output ON VIN (ON) IOUT = 1.25 A 2.5 ⎯ 8
Input voltage
Output OFF VIN (OFF) ⎯ 0 ⎯ 0.4
V
Input current IIN ⎯ 0 ⎯ 20 mA
Clamp diode reverse voltage VR TD62064APG/AFG 0 ⎯ 50 V
Clamp diode forward current IF ⎯ ⎯ ⎯ 1.25 A
Isolation voltage VSUB TD62074APG/AFG ⎯ ⎯ 50 V
APG Ta
= 85°C (Note 1) ⎯ ⎯ 1.4
Power dissipation AFG PD Ta = 85°C (Note 2) ⎯ ⎯ 0.7 W
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
VCE = 50 V, Ta = 25°C ⎯ ⎯ 50
Output leakage current ICEX 1 VCE = 50 V, Ta = 85°C ⎯ ⎯ 500 µA
IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 1.6
Output saturation voltage VCE (sat) 2 IOUT = 0.75 A, IIN = 935 µA ⎯ ⎯ 1.25 V
IOUT = 1.0 A ⎯ 800 ⎯
DC current transfer ratio hFE 2 VCE = 2 V IOUT = 0.25 A ⎯ 1500 ⎯ ⎯
Input voltage (output on) VIN (ON) 3 IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 2.4 V
VR = 50 V, Ta = 25°C ⎯ ⎯ 50
Clamp diode leakage current IR 4 VR = 50 V, Ta = 85°C ⎯ ⎯ 100 µA
Clamp diode forward voltage VF 5 IF = 1.25 A ⎯ ⎯ 2.0 V
Input capacitance CIN 6 VIN = 0 V, f = 1 MHz ⎯ 15 ⎯ pF
Turn-ON dela y tON 7 CL = 15 pF, VOUT = 50 V,
RL = 42 Ω ⎯ 0.1 ⎯ µs
Turn-OFF delay tOFF 7 CL = 15 pF, VOUT = 50 V,
RL = 42 Ω ⎯ 1.0 ⎯ µs
TD62064,074APG/AFG
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Test Circuit
1. ICEX
2. VCE (sat), hFE
3. VIN (ON)
4. IR
5. VF
6. CIN
7. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and ji g capaci t ance
VCE, VCE (sat)
Open
IIN I
OU
T
ICE
X
Open
Open
VCE
Open
VIN (ON) VCE
IOUT
Open
Open
IF
VFCapacitance
bridge
fi
Open
Open
VIN
LO
Open
Open
IRVR
Input
CL = 15 pF
(Note 2)
(Note 1)
Open VOUT
Output
VIN
Pulse
generator
RL
10% 10%
50%
t
O
Nt
O
FF
t
f
trVIH =2.4 V
0
VOH
VOL
Input 50%
90% 90%
50
µ
s
Output 50% 50%
(Note 1)
TD62064,074APG/AFG
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Collector-emitter saturation voltage
VCE (sat) (V)
IOUT – VCE (sat)
Output curre nt IOUT (A)
Input voltage VIN (V)
IIN – VIN
Input current IIN (mA)
Input cur r ent IIN (
µA)
IOUT – IIN
Output current IOUT (mA)
Ambient temperature Ta (°C)
PD – Ta
Power dissipation PD (W)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
0
50
VCE = 2 V
400
300
100
150 200
200
100
Ta = 75 °C 25 −30
0
1.0
max
TD62064APG
TD62074APG
12
8
4
2.0 3.0 4.0 5.0
typ. min
1.5
00
TD62064APG
TD62074APG
1.0
0.5
0.5 1.0 1.5 2.0
25°C max
typ.
00
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2 n = 3n = 4
TD62064APG
Ta = 85°C
n-ch ON
00
TD62064APG
Ta = 25°C
n-ch ON
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2
n = 3
n = 4
(1)
(2)
(3)
(4)
00
(1) DIP-16 pin
on glass epoxy PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) PFP-16 pin
on glass epoxy PCB
(60 × 30 × 1.6 mm Cu 30%)
(4) PFP-16 pin free air
3.0
1.8
0.6
120 200
1.2
80
2.4
40 160
TD62064,074APG/AFG
2006-06-13
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Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
00
1500
900
300
60 100
600
40
1200
20 80
n = 1
n = 2
n = 3
TD62064AFG
Ta = 85°C
n-ch ON
n = 4
00
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2 n = 3 n = 4
TD62064AFG
Ta = 25°C
n-ch ON
TD62064,074APG/AFG
2006-06-13
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Package Dimensions
Weight : 1.11 g (t yp. )
TD62064,074APG/AFG
2006-06-13
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Package Dimensions
Weight : 0.50 g (t yp. )
TD62064,074APG/AFG
2006-06-13
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerati on s
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
TD62064,074APG/AFG
2006-06-13
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
TD62064,074APG/AFG
2006-06-13
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature
= 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
= 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE 060116EBA
• The inf or m ati on contained her ein is subject to change with out notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human lif e, b odi ly injury or damage to proper t y.
In developing yo ur designs , pleas e ensure that TOSHIBA products are used within specif ied operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipmen t, office equipment, me asuring equi pment, industr ial robotic s, domesti c appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall b e made at the customer’s own ri sk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibi t ed under any applicable laws and regul ations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOS HIBA or others. 021023_C
• The products described in this document are sub ject to the foreign exchange and foreign trade laws. 021023_E
