Low Power Bluetooth Module
APPLICATIONS:
FEATURES:
Pb
| | | | | | | | | | | | | | |
GENERAL DESCRIPTION
Moisture Sensitivity Level (MSL) – Level 3
• Sports and fitness
• Healthcare
• Home entertainment
• Office and mobile accessories
• Automotive
• Commercial
• Watches
• Human interface devices
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
PIN CONFIGURATION:
Figure 1. Pinout (Topview)
• Single mode Bluetooth v4.1 low energy
• 4 dBm TX power/ -92.5dBm RX sensitivity, RSSI monitoring for proximity applications
• Supports master and slave
• Support GATT-based Profile: Proximity, Find Me, Heart Rate, HID and etc.
• UART/I2C master/SPI master interfaces
• 9 digital PIOs/3 analog IOs
• 10bit ADC IOs
• Wakeup interrupt and watchdog timer
• SMT pads for easy and reliable PCB mounting, Internal chip antenna
• 19.50x12.50x2.4mm
• FCC ID: OC3BM1871*
• QDID: B020997*
19.5 x 12.5 x 2.4 mm SMT
ABBTM-NVC-MDCS71 is a single-mode Bluetooth 4.1 low power module, based on NovaComm’s proprietary technology. Using the CSR’s
uEnergy platform, it enables ultralow power connectivity and basic data transfer for applications previously limited by the power consump-
tion, size constraints and complexity of other wireless standards. It contains everything required to create a Bluetooth low energy product with
RF, baseband, MCU, qualified Bluetooth V4.1 stack and customized firmware on a single module.
The module can be power directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes
only 600nA and will wake up in few hundred microseconds.
*Note: ABBTM-NVC-MDCS71 crosses to NovaComm P/N: NVC-MDCS71. BQB/FCC certification documentation is under
P/N: NVC-MDCS71.
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
PIN DESCRIPTION
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
Pin Symbol I/O Type Description
1
GND
Ground
Ground
2
AIO2
Bidirectional analogue
10bit Analogue programmable I/O line
3
AIO1
Bidirectional analogue
10bit Analogue programmable I/O line
4
AIO0
Bidirectional analogue
10bit Analogue programmable I/O line
5 UART_TX
CMOS output, tri-state, with weak
internal pull-up UART data output
6 UART_RX
CMOS input with weak internal pull-
down UART data input
7 PIO3
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
8 PIO4
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
9
GND
Ground
Ground
10 PIO5/SPI_CLK Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_CLK select by SPI_PIO_SEL
11 PIO6/SPI_CSB Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug chip select, selected by SPI_PIO_SEL
12 PIO7/SPI_MOSI Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_MOSI, selected by SPI_PIO_SEL
13
VDD_PIO
Powered
PIO power supply
14 PIO8/SPI_MISO Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_MISO, selected by SPI_PIO_SEL
15 I2C_SDA
Bi-directional tri-state with weak internal
pull-up
I2C data input/output or SPI serial flash data
output(SF_OUT)
16 I2C_SCL Input with weak internal pull-up
I2C clock or SPI serial flash clock output
(SF_CLK)
17
GND
Ground
Ground
18 PIO9
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
19 PIO10
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
20 PIO11
Bi-directional with programmable
strength internal pull-up/down Programmable input/output line
21
SPI_PIO_SEL
Input with strong internal pull-down
Selects SPI debug on (8:5)
22
VDD_BAT
Power supply
Button cell battery or DC 1.8V to 3.6V
23
GND
Ground
Ground
24 WAKE
Input has no internal pull-up or pull-down
use external pull-down
Set high to wake the module from hibernate. Use
an external pull-down for this pin.
25
GND
Ground
Ground
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
| | | | | | | | | | | | | | |
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
ELECTRICAL CHARACTERISTICS
Absolute Maximum Rating
* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and
other specifications are not guaranteed in excess of 4.2V.
Recommended Operating Conditions
Operating Condition
Min
Typ
Max
Unit
Operating Temperature Range
-30
+85
°C
Battery (VDD_BAT) operation 1.8 +3.6 V
I/O Supply Voltage (VDD_PIO) 1.2 +3.6 V
Power Consumptions
The current consumption are measured at the VDD_BAT.
Mode Description
Total typical current at
3V (average)
Dormant
All functions are shutdown. To wake up toggle
the WAKE pin
<600nA
Hibernate
All functions are shutdown except for the sleep
clock. The module can wake up on a timer on the
sleep clock.
<1.5uA
Fast Advertising In 30 second after Power on VDD=3.3V 0.8mA
Slow Advertising In 3 minutes after fast advertising VDD=3.3V 6uA
Standby (no connect) VDD=3.3V ,VDD_PIO=3.3v 5uA
Standby (connect)
VDD=3.3V ,VDD_PIO=3.3v 8uA
Transmit data VDD=3.3V VDD_PIO=3.3V 1mA
RF RX /TX active (0dBm) *
VDD=3.3V VDD_PIO=3.3V ~16mA peak
* Note: The TX power of the module can be increased by firmware to a maximum of 4dBm and the peak current is around
28mA.
Rating Min Max Unit
Storage Temperature
-40
+85
°C
Battery (VDD_BAT) operation*
1.8
3.6
V
I/O supply voltage
-0.4
+3.6
V
Other Terminal Voltages except RF Vss-0.4 VDD+0.4 V
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
I/O CHARACTERISTICS
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
Digital I/O Characteristics
Supply Voltage Levels Min Typ Max Unit
Input Voltage Levels
V
IL
input logic level low
-0.4 0.4 V
V
IH
input logic level high
0.7*VDD VDD + 0.4 V
T
r
/T
f
25 ns
Output Voltage Levels
V
OL
output logic level low, I
OL
= 4.0mA
0.4 V
V
OH
output logic level high, I
OH
= -4.0mA
0.75*VDD V
T
r
/T
f
5 ns
Input and Tri-state Current
With strong pull-up
-150 -40 -10
μA
With strong pull-down
10 40 150
μA
With weak pull-up
-5.0 -1.0 -0.33
μA
With weak pull-down
0.33 +1.0 5.0
μA
C
I
Input Capacitance
1.0
5.0
pF
AIO Characteristics
Input Voltage Levels
Min
Typ
Max
Unit
AIO
0
1.3
V
ESD Protection
Condition
Class
Max Rating
Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114
2
2000V (all pins)
Machine Model Contact Discharge per JEDEC EIA/JESD22-A115
200V
200V (all pins)
Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101
III
500V (all pins)
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
Power Supply
The module integrates internal regulators. It can be easily powered up by connecting a 3V coin battery with a >100uF
capacitor at pin VDD_BAT.
Internal Antenna
The module integrates an on-board chip antenna. There’s no need to use external antenna on customer’s PCB. Please
take precaution to leave ample clearance for the antenna (See Figure 6).
PIO
9 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO.
PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down.
AIO
PWM
Figure 2. Capacitor at pin VDD_BAT
Note: At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt
request lines or as wake-up lines from sleep modes.
3 AIOs are provided. They can be connected to internal 10 bits ADC. Depending on the software, they can be used
to read or output a voltage between 0V to 1.3V. Each of them can be also used as a digital output with special firm-
ware.
PIO3, PIO4, PIO9, PIO10 can be driven by internal PWM module. The PWM module also works while the module
is sleep. Therefore it can be used as a LED flasher. These functions are controlled by special firmwares.
.
UART
This module has a standard UART interface which provides a simple mechanism for communicating with other serial
devices using the RS232 protocol.
The UART CTS and RTS signals can be assigned to any PIO pin by the on-chip firmware.
Possible UART Settings
Parameter
Possible Values
Baud Rate Minimum 1200 baud (≤2%Error)
9600 baud (≤1%Error)
Maximum
2M baud (≤1%Error)
Flow Control
RTS/CTS or None
Parity
None, Odd or Even
Number of Stop Bits 1 or 2
Bits per Byte 8
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
I2C Master
The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and
I2C_SDA.
SPI Master
The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as
SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz.
SPI Debug
The SPI Debug interface is chosen when SPI_PIO_SEL is high. The interface is used to program and debug the module.
So always place test points or header on PCB for this interface and SPI_PIO_SEL.
ABBTM-NVC-MDCS71 is a single mode Bluetooth 4.1 module. It can support all GATT-based profiles. Several profiles
have been developed such as Healthy Thermometer Profile. Please contact Abracon for the support of more profiles and
applications with iNovaLE stack.
iNovaLE Stack
Figure 3. iNovaLE Stack
SOFTWARE STACK
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
REFERENCE DESIGN
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
.
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Figure 4. Reference Design
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
LAYOUT AND SOLDERING
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
Soldering Recommendations
.
ABBTM-NVC-MDCS71 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile
used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular
type of solder paste used. Please refer to the datasheet of the particular solder paste for profile configurations.
The following are recommended for soldering the module to ensure reliable solder joint and operation of the module
after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by
case. Thus following recommendation should be taken as reference only.
• Refer to technical documentations of particular solder paste for profile configurations
• Avoid using more than one flow.
• Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of
150µm stencil thickness is recommended.
• Aperture size of the stencil should be 1:1 with the pad size.
• A low residue, “no clean” solder paste should be used due to low mounted height of the component.
Figure 5. Typical Lead-Free Reflow Solder Profile for ABBTM-NVC-MDCS71
Key features of the profile:
•
Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium
•
Equilibrium time = 60 to 180 seconds
•
Ramp to Maximum temperature (250°C) = 3°C/sec max.
•
Time above liquidus temperature (217°C): 45-90 seconds
•
Device absolute maximum reflow temperature: 255°C
REFLOW PROFILE
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
.
Layout Guideline
It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any
metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated
maximum 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an
unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around
the antenna of ABBTM-NVC-MDCS71 when the module is placed at the edge of a PCB.
Do not place copper on the top layer under the module, as shown in Figure 6. The module has vias on the area shown,
which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from
the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module.
Figure 6. Placement of the Module on a Main Board
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
Low Power Bluetooth Module
Pb
| | | | | | | | | | | | | | |
OUTLINE DIMENSIONS
ABBTM-NVC-MDCS71
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
.
Pin 1
Pin 25
Pin 1
Pin 25
Recommended Land Pattern
80pcs/tray
Dimensions: mm
TAPE & REEL:
Dimensions: mm
ATTENTION: Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applica-
tions. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where
component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and
authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
RoHS
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
ABRACON IS
CERTIFIED
ABRACON IS
ISO 9001:2008
CERTIFIED
2 Faraday, Suite# B
|
Irvine
|
CA 92618
Revised: 06.29.15
Ph. 949.546.8000
|
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
