NICHIA STS-DA1-3484B <Cat.No.160129> NICHIA CORPORATION SPECIFICATIONS FOR WARM WHITE LED NVSL219CT Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant NICHIA STS-DA1-3484B <Cat.No.160129> SPECIFICATIONS (1) Absolute Maximum Ratings Symbol Absolute Maximum Rating Unit Forward Current Item IF 1800 mA Pulse Forward Current IFP 2400 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 5.94 W Operating Temperature Topr -40~100 C Storage Temperature Tstg -40~100 C Junction Temperature TJ 150 C * Absolute Maximum Ratings at TS=25C. * IFP conditions with pulse width 10ms and duty cycle 10%. (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage R70 Typ Max 2.98 - IF=350mA 2.83 - IF=700mA 320 - IF=350mA 172 - IF=700mA 91 - IF=350mA 60 - Unit V Luminous Flux v Luminous Intensity Iv Color Rendering Index Ra IF=700mA 73 - - x - IF=700mA 0.3818 - - y - IF=700mA 0.3797 - - IF=700mA 280 - IF=350mA 150 - IF=700mA 83 - IF=350mA 55 - Chromaticity Coordinate R8000 VF Condition IF=700mA lm cd Luminous Flux v Luminous Intensity Iv Color Rendering Index Ra IF=700mA 83 - - - IF=700mA 0.4073 - - - IF=700mA 0.3917 - - RJS - 4.2 6.4 C/W Chromaticity Coordinate Thermal Resistance x y lm cd * Characteristics at TS=25C. * Luminous Flux value as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RJS is Thermal Resistance from junction to TS measuring point. 1 NICHIA STS-DA1-3484B <Cat.No.160129> RANKS Item Rank Condition Min Max 3.1 3.3 2.9 3.1 L1 2.7 2.9 D320 320 340 D300 300 320 280 300 260 280 240 260 220 240 70 - - 80 - - 0 - - M1 Forward Voltage Luminous Flux L2 IF=700mA D280 IF=700mA D260 D240 D220 R70 Color Rendering Index Ra Ra R8000 IF=700mA R9 Unit V lm Color Ranks The color rank has a chromaticity range within a 3-step MacAdam ellipse. Center Point x Rank Rank Rank Rank Rank sm273 sm303 sm353 sm403 sm453 0.4578 0.4338 0.4073 0.3818 0.3611 y 0.4101 0.4030 0.3917 0.3797 0.3658 a 0.004056 0.004107 0.004098 0.004071 0.003852 Major Axis b 0.007872 0.008391 0.008796 0.009282 0.009009 Ellipse Rotation Angle -36.05 -36.00 -35.47 -35.95 -34.33 Rank Rank Minor Axis The color rank has a chromaticity range within a 5-step MacAdam ellipse. Rank Rank Rank sm275 sm305 sm355 sm405 sm455 x 0.4578 0.4338 0.4073 0.3818 0.3611 y 0.4101 0.4030 0.3917 0.3797 0.3658 Minor Axis a 0.006760 0.006845 0.006830 0.006785 0.006420 Major Axis b 0.013120 0.013985 0.014660 0.015470 0.015015 Ellipse Rotation Angle -36.05 -36.00 -35.47 -35.95 -34.33 Center Point The color rank has a chromaticity range within a 7-step MacAdam ellipse. Rank Rank Rank Rank Rank sm277 sm307 sm357 sm407 sm457 x 0.4578 0.4338 0.4073 0.3818 0.3611 y 0.4101 0.4030 0.3917 0.3797 0.3658 a 0.009464 0.009583 0.009562 0.009499 0.008988 Major Axis b 0.018368 0.019579 0.020524 0.021658 0.021021 Ellipse Rotation Angle -36.05 -36.00 -35.47 -35.95 -34.33 Center Point Minor Axis * Ranking at TS=25C. * Forward Voltage Tolerance: 0.05V * Luminous Flux Tolerance: 7% * Color Rendering Index Ra Tolerance: 2 * Color Rendering Index R9 Tolerance: 6.5 * The R9 value for the above rank shall be greater than 0. * Chromaticity Coordinate Tolerance: 0.005 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. 2 NICHIA STS-DA1-3484B <Cat.No.160129> Luminous Flux Ranks by Color Rank, Color Rendering Index Rank Ranking by Luminous Flux Ranking by D220 D240 D260 D280 D300 D320 Color Coordinates, Color Rendering Index sm273,sm275,sm277 sm303,sm305,sm307 sm353,sm355,sm357 R70 R8000 R70 R8000 R70 R8000 sm403,sm405,sm407, R70 sm453,sm455,sm457 R8000 3 NICHIA STS-DA1-3484B <Cat.No.160129> CHROMATICITY DIAGRAM 0.46 sm307 sm357 0.42 sm305 sm303 sm355 sm353 sm407 sm405 sm273 sm275 sm403 y sm277 0.38 sm457 sm455 sm453 2700K 3000K 0.34 3500K Blackbody Locus 4000K 4500K 0.30 0.32 0.36 0.40 0.44 0.48 x 4 NICHIA STS-DA1-3484B <Cat.No.160129> OUTLINE DIMENSIONS * RoHS This product complies with RoHS Directive. No. NVSL219C STS-DA7-6488A ( Unit:0.2) mm) ( Unit: mm, Tolerance: 3.5 2.9 3.5 0.4 2 Cathode Mark 3.2 0.5 3.2 2.4 0.45 1.3 Cathode Item Description Package Materials Ceramics Encapsulating Resin Materials Silicone Resin(with phosphor) Electrodes Materials Au-plated Lens Materials Silicone Resin Die Heat Sink Materials Au-plated Weight 0.031g(TYP) Anode Die Heat Sink K A Protection Device Die Heat Sink 5 NICHIA STS-DA1-3484B <Cat.No.160129> SOLDERING * Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5C per sec 260CMax 10sec Max Pre-heat 180 to 200C 60sec Max Above 220C 120sec Max Recommended Soldering Pad Pattern 0.5 3.3 1.3 1.2 0.4 0.5 ( Unit: mm) 4.1 * This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability. When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress to the encapsulation of the LEDs. Recommended conditions: Using a nozzle designed for the LEDs is recommended. (See Figure below) * The nozzle must not have any direct contact with the encapsulating resin. 0.4 1.9 0.5 Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate. 3.5 4.5 A 0.15 A Expansion of A ( Unit: mm) 6 NICHIA STS-DA1-3484B <Cat.No.160129> * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * The Die Heat Sink should be soldered to customer PCB. If it is difficult or impossible, use high heat-dissipating adhesive. * When soldering, do not apply stress to the LED while the LED is hot. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Make sure that there are no issues with the type and amount of solder that is being used. * All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions. 7 NICHIA STS-DA1-3484B <Cat.No.160129> TAPE AND REEL DIMENSIONS Tape 1.750.1 20.05 40.1 5.50.05 Cathode Mark Nxxx219x STS-DA7-6927 ( Unit: mm) 0.350.05 3.70.1 80.1 12+0.3 -0.1 1.5+0.1 -0 No. 2.250.1 -0 1.5+0.2 3.70.1 Embossed Carrier Tape / Trailer and Leader Top Cover Tape Feed Direction 160mm Trailer 160mm MIN(Empty Pockets) LED Loaded Pockets 400mm Leader without Top Cover Tape 400mm MIN Reel 17.51 13.51 2 * 1 3500 Reel Size: 3500pcs 21 0. * JIS C 0806 1001 8 13 0 .2 330 Label 100mm Leader with Top Cover Tape 100mm MIN(Empty Pocket) The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes). * (10N) LED When the tape is rewound due to work interruptions, no more than 10N should be applied to the embossed carrier tape. The LEDs may stick to the top cover tape. 8 NICHIA STS-DA1-3484B <Cat.No.160129> PACKAGING - TAPE & REEL Reels are shipped with desiccants in heat-sealed moisture-proof bags. No. Nxxxxxxx STS-DA7-4989 Label Reel Desiccants XXXX LED TYPE Nxxxxxxx ******* LOT YMxxxx-RRR QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Seal Moisture-proof Bag Moisture-proof bags are packed in cardboard boxes with corrugated partitions. Label XXXX LED TYPE Nxxxxxxx ******* RANK RRR QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Nichia LED * ******* ******* is the customer part number. If not provided, it will not be indicated on the label. * For details, see "LOT NUMBERING CODE" in this document. * The label does not have the RANK field for un-ranked products. * Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation. * Do not drop or expose the box to external forces as it may damage the products. * Do not expose to water. The box is not water-resistant. * Using the original package material or equivalent in transit is recommended. 9 NICHIA STS-DA1-3484B <Cat.No.160129> LOT NUMBERING CODE Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR Y - Year Year Y 2015 F 2016 G 2017 H 2018 I 2019 J 2020 K M - Month Month M Month M 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 A 5 5 11 B 6 6 12 C xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage, Ranking by Color Rendering Index 10 NICHIA STS-DA1-3484B <Cat.No.160129> DERATING CHARACTERISTICS NVSx219C No. STS-DA7-6918 - Ambient Temperature vs Allowable Forward Current Derating1 2000 (93, 1800) (100, 1590) 1500 RJA =30C/W (37, 1800) (0, 1590) Allowable Forward Current(mA) RJA =20C/W 1000 (100, 795) 500 (100, 530) 0 20 40 60 1500 1000 500 80 100 120 0 20 40 60 80 100 () Ambient Temperature(C) Solder Temperature(Cathode Side)(C) - Duty Ratio vs Allowable Forward Current Duty 10000 Allowable Forward Current(mA) (100, 1800) 0 0 Allowable Forward Current(mA) 2000 ()- Solder Temperature(Cathode Side) vs Allowable Forward Current Derating2 RJA =10C/W 120 T A =25C 2400 1800 1000 100 1 10 100 Duty Ratio(%) 11 NICHIA STS-DA1-3484B <Cat.No.160129> OPTICAL CHARACTERISTICS NVSL219C No. STS-DA7-7205 * All characteristics shown are for reference only and are not guaranteed. Spectrum TA =25C IFP=700mA Spectrum 1.0 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 800 Wavelength(nm) Directivity1 Directivity -10 0 TA =25C IFP=700mA 10 -20 20 30 -30 40 Radiation Angle -40 50 -50 -60 60 -70 70 80 -80 -90 90 1 0.5 0 0.5 1 Relative Illuminance(a.u.) * R70 The graphs above show the characteristics for R70 LEDs of this product. 12 NICHIA STS-DA1-3484B <Cat.No.160129> OPTICAL CHARACTERISTICS NVSL219C No. STS-DA7-6955A * All characteristics shown are for reference only and are not guaranteed. Spectrum TA =25C IFP=700mA Spectrum 1.0 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 800 Wavelength(nm) Directivity1 Directivity -10 0 TA =25C IFP=700mA 10 20 -20 30 -30 40 Radiation Angle -40 50 -50 -60 60 70 -70 80 -80 -90 90 1 0.5 0 0.5 1 Relative Illuminance(a.u.) * R8000 The graphs above show the characteristics for R8000 LEDs of this product. 13 NICHIA STS-DA1-3484B <Cat.No.160129> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NVSL219C No. STS-DA7-6486B * All characteristics shown are for reference only and are not guaranteed. - Forward Voltage vs Forward Current - Ambient Temperature vs Forward Voltage VfIf TA =25C 10000 TaVf IFP=700mA 4.0 Forward Voltage(V) Forward Current(mA) 3.5 2400 1000 700 3.0 2.5 100 2.0 2.0 2.5 3.0 3.5 4.0 -60 -40 Forward Voltage(V) - Forward Current vs Relative Luminous Flux -20 0 20 40 60 80 100 120 Ambient Temperature(C) - Ambient Temperature vs Relative Luminous Flux IfIv TA =25C 3.5 TaIv IFP=700mA 1.4 Relative Luminous Flux(a.u.) Relative Luminous Flux(a.u.) 3.0 2.5 2.0 1.5 1.0 1.2 1.0 0.8 0.5 0.0 0.6 0 500 1000 1500 2000 Forward Current(mA) 2500 3000 -60 -40 -20 0 20 40 60 80 100 120 Ambient Temperature(C) 14 NICHIA STS-DA1-3484B <Cat.No.160129> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NVSL219C No. STS-DA7-7206 * All characteristics shown are for reference only and are not guaranteed. - Forward Current vs Chromaticity Coordinate Ifxy TA =25C 0.40 0.39 100mA y 350mA 0.38 700mA 1800mA 0.37 0.36 0.36 2400mA 0.37 0.38 0.39 0.40 x - Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 700mA 0.40 0.39 y 100C 0.38 25C 0C 0.37 -40C 0.36 0.36 0.37 0.38 0.39 0.40 x * R70 The graphs above show the characteristics for R70 LEDs of this product. 15 NICHIA STS-DA1-3484B <Cat.No.160129> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NVSL219C No. STS-DA7-6959A * All characteristics shown are for reference only and are not guaranteed. - Forward Current vs Chromaticity Coordinate Ifxy TA =25C 0.41 y 0.40 0.39 100mA 350mA 700mA 1800mA 2400mA 0.38 0.37 0.39 0.40 0.41 0.42 0.43 x - Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 700mA 0.41 0.40 -40C y 0C 25C 0.39 100C 0.38 0.37 0.39 0.40 0.41 0.42 0.43 x * R8000 The graphs above show the characteristics for R8000 LEDs of this product. 16 NICHIA STS-DA1-3484B <Cat.No.160129> RELIABILITY (1) Tests and Results Reference Test Standard Resistance to Test Test Conditions Duration JEITA ED-4701 Tsld=260C, 10sec, 2reflows, 300 301 Precondition: 30C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=2455C, 5sec, (Reflow Soldering) 303 303A Lead-free Solder(Sn-3.0Ag-0.5Cu) JEITA ED-4701 -40C(30min)~25C(5min)~ 100 105 100C(30min)~25C(5min) Moisture Resistance JEITA ED-4701 25C~65C~-10C, 90%RH, (Cyclic) 200 203 24hr per cycle High Temperature JEITA ED-4701 Storage 200 201 Temperature Humidity JEITA ED-4701 Storage 100 103 Low Temperature JEITA ED-4701 Storage 200 202 Soldering Heat (Reflow Soldering) Temperature Cycle Failed/Tested 0/22 #2 0/22 100cycles #1 0/22 10cycles #1 0/22 TA=100C 1000hours #1 0/22 TA=60C, RH=90% 1000hours #1 0/22 TA=-40C 1000hours #1 0/22 1000hours #1 0/22 1000hours #1 0/22 500hours #1 0/22 1000hours #1 0/22 48minutes #1 0/10 #1 0/22 TA=25C, IF=1000mA Operating Life Test board: See NOTES below High Temperature TA=100C, IF=400mA Operating Life Test board: See NOTES below Temperature Humidity 60C, RH=90%, IF=700mA Operating Life Test board: See NOTES below Low Temperature TA=-40C, IF=700mA Operating Life Test board: See NOTES below Electrostatic Discharges # Units #1 Room Temperature Vibration Failure Criteria JEITA ED-4701 200m/s2, 100~2000~100Hz, 400 403 4cycles, 4min, each X, Y, Z JEITA ED-4701 HBM, 2kV, 1.5k, 100pF, 3pulses, 300 304 alternately positive or negative NOTES: 1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RJA30C/W 2) Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # #1 #2 Items Conditions Failure Criteria Forward Voltage(VF) IF=700mA >Initial valuex1.1 Luminous Flux(V) IF=700mA <Initial valuex0.7 Solderability - Less than 95% solder coverage 17 NICHIA STS-DA1-3484B <Cat.No.160129> CAUTIONS (1) Storage Conditions Storage Temperature Humidity Time Before Opening Aluminum Bag 30C 90%RH Within 1 Year from Delivery Date After Opening Aluminum Bag 30C 70%RH 168hours 655C - 24hours Baking Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details. Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. Products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. Included silica gel desiccants change from blue to red if moisture had penetrated bags. After opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture-proof bags for storage. After the "Period After Opening" storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. Baking should only be done once. Although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage. Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur. The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. Do not store the LEDs in a dusty environment. Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) Directions for Use When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating. Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended. If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of the LEDs. (A) (B) ... ... This product should be operated using forward current. Ensure that the product is not subjected to either forward or reverse voltage while it is not in use. In particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the LED die. When used in displays that are not used for a long time, the main power supply should be switched off for safety. It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics. Ensure that excessive voltages such as lightning surges are not applied to the LEDs. For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. 18 NICHIA STS-DA1-3484B <Cat.No.160129> (3) Handling Precautions Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might cause the LED to be deformed and/or the bump to break, which will cause the LED not to illuminate. When handling the product with tweezers, be careful not to apply excessive force to the resin. Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures. Dropping the product may cause damage. Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures. (4) Design Consideration PCB warpage after mounting the products onto a PCB can cause the package to break. The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist. The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines. The LED should be placed in a way to minimize the stress on the LEDs due to board flexing. Board separation must be performed using special jigs, not using hands. If an aluminum PCB is used, customer is advised to verify the PCB with the products before use. Thermal stress during use can cause the solder joints to crack. Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the LED light output and/or cause a color shift. In this case, ventilating the environment may improve the reduction in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the LEDs are planned to be used in a hermetically sealed environment. (5) Electrostatic Discharge (ESD) The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials Ensure that tools, jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs, protection against surge voltages should also be used. If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage can be detected with a forward voltage measurement or a light-up test at low current (1mA). ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current. Failure Criteria: VF<2.0V at IF=0.5mA 19 NICHIA STS-DA1-3484B <Cat.No.160129> (6) Thermal Management Proper thermal management is an important when designing products with LEDs. LED die temperature is affected by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature does not exceed the maximum Junction Temperature (TJ). Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product. The following equations can be used to calculate the junction temperature of the products. 1) TJ=TA+RJAW 2) TJ=TS+RJSW *TJ=LED junction temperature: C TA=Ambient temperature: C TS=Soldering temperature (cathode side): C RJA=Thermal resistance from junction to ambient: C/W RJS=Thermal resistance from junction to TS measuring point: C/W W=Input power(IFxVF): W Ts Point (7) Cleaning The LEDs should not be cleaned with water, benzine, and/or thinner. If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs due to the damage to the resin portion. The effects of such solvents should be verified prior to use. In addition, the use of CFCs such as Freon is heavily regulated. When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs. Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs depending on the ultrasonic power and how LED is assembled. If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning. (8) Eye Safety In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps and lamp systems, which added LEDs in its scope. On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope. However, please be advised that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1. High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2. Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs with optical instruments which may greatly increase the damages to your eyes. Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) Others This product is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication devices); it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, automobiles, combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters, traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications, unless otherwise detailed in the specification, Nichia will neither guarantee that the product is fit for that purpose nor be responsible for any resulting property damage, injuries and/or loss of life/health. This product does not comply with ISO/TS 16949 and is not intended for automotive applications. The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. The specifications and appearance of this product may change without notice; Nichia does not guarantee the contents of this specification. Both the customer and Nichia will agree on the official specifications of supplied products before the volume production of a program begins. 20