©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
27
Revised: November 10, 2009
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Description
Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.
GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.
The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.
The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.
The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.
Features
• Rugged Ceramic-Metal
construction
• Low Capacitance
(<1.5pf)
• Meets REA PE-80
• Available in surface
mount, and a variety of
lead options options
Applications
• Communication lines
and equipment
• CATV equipment
• Test equipment
• Data lines
• Power supplies
• Instrumentation circuits
• Medical electronics
• ADSL equipment
• Telecom SLIC
protection
AGENCY AGENCY FILE NUMBER
®E128662
®E320116
Agency Approvals
®
CG/CG2 Series
2 Electrode GDT Graphical Symbol
©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
28
Revised: November 10, 2009 Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Electrical Characteristics
Part
Number
Device Specifications (at 25°C) Life Ratings
DC Breakdown
in Volts
(@100V/s)
Impulse
Break-
down
in Volts
(@100V/μs)
Impulse
Break-
down In
Volts
(@1 Kv/μsec)
Insulation
Resistance
Capaci-
tance
(@1MHz)
Arc
Voltage
(on state
Voltage)
@1Amp
Min
Surge
Life
(@500A
10/1000μs)
Nominal
Impulse
Discharge
Current
(8/20μs)
Nominal
AC
Discharge
Current
(10x1sec
@50-60Hz)
AC
Dischage
Current
(9 cycle
@50Hz)
DC
Holdover
Voltage2
Max
Impulse
Discharge
Current
(1 Application
@ 10/350μs)
MIN TYP MAX MAX MIN MAX TYP TYP
NOTES:
1. Tested to UL1449 Third Edition
2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.
3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.)
MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.)
Product Characteristics
Materials
LS, Axial:
Device: Nickel Plated 2–5 Microns
Lead Wires: Tin Plated 17.5 ± 12.5 Microns
Construction: Ceramic Insulator
Core:
Device: Tin Plated 17.5 ± 12.5 Microns.
Construction: Ceramic Insulator
MS:
Device: Dull Tin Plated 7–9 Microns
Construction: Ceramic Insulator
Product Marking LF Logo, Voltage and date code; Black in
positive print
Glow to arc
transition current < 0.5Amps
Glow Voltage
60-160 Volts
Storage and
Operational
Temperature
-40 to +90
Maximum Follow
On Current
1
230 Volts r.m.s, 200 Amps.
(800V and 1000V devices tested to UL1449 3rd edition)
©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
29
Revised: November 10, 2009
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Device Dimensions
[0.331 ± 0.012]
8.4 ± 0.3
[0.239 ± 0.012]
6.07 ± 0.3
[0.0157 ± 0.0012]
0.40 ± 0.03
0.004
2 Surfaces
[0.032]
0.80
[0.388 ± 0.012]
9.85 ± 0.30
[0.439 ± 0.012]
11.15 ± 0.30
[0.331 ± 0.012]
8.40 ± 0.3
8.10 Max.
[0.319 DIA Max.]
9.85
[0.388]
11.65
[0.459]
8.60
[0.339]
1.80
[0.071]
TOP VIEWPROFILE VIEW
SOLDER PAD LAYOUT
6.05 ± 0.2
[0.238 ± 0.0079]
5.58 [0.220]
ø8.30±0.1
R5.29 [R0.208]
4 ± 0.2
[0.157 ± 0.0079]
8.30 ± 0.1
[0.327 ± 0.0039]
8.71 [0.343]
2.29 [0.090]
5.89 [0.232]
0.47 ± 0.1
[0.019 ± 0.0039]
9.30 ± 0.2
[0.366 ± 0.0079]
TOP VIEW
PROFILE VIEW SEMI–PROFILE VIEW
SOLDER PAD LAYOUT
Leaded 'LS' Type Shaped Lead Devices
'MS' Type Devices
Leaded 'L' Type Straight Axial Devices
Core Devices
8.10 DIA. MAX
.
[0.319]
6.07 ± 0.15
0.81 DIA. TYP.
[0.032]
62 ± 2
[0.239 ± 0.006]
TOP VIEW
PROFILE VIEW
6.07 ± 0.15
[0.239 ± 0.0059]
5.89 [0.232]
8.10 Max.
[0.032 Max.]
8.10 Max.
TOP VIEW PROFILE VIEW SEMI–PROFILE VIEW
0.47 ± 0.1
[0.019 ± 0.0039]
©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
30
Revised: November 10, 2009 Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (Min to Max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100° C
Temperature Maximum: 150° C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
31
Revised: November 10, 2009
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Packaging Dimensions
24 +0.3 / -0.1
[0.945 +0.019 / -0.004]
11.5 ± 0.1
[0.453 ± 0.004]
1.75 ± 0.1
[0.069 ± 0.004] 1.5 DIA. MAX.
[0.059]
1.5 DIA. MAX.
[0.059] 16 ± 0.1
[0.630 ± 0.004]
0.5 ± 0.05
[0.020 ± 0.002]
0.5 ± 0.01
[0.020 ± 0.004]
10x4 ± 0.1 = 40 ± 0.2
[10x.157 ± 0.004 = 1.575 ± 0.008]
4 ± 0.1
[0.157 ± 0.004]
11.75 ± 0.1
[0.463 ± 0.004]
8 ± 0.1
[0.315 ± 0.004]
9 ± 0.1
[0.354 ± 0.004]
1.9
[0.075]
Direction of Feed
25.7
[1.01]
275.0
[10.82]
100.0
[3.93]
25.0
[0.98]
76.0
[2.99]
For 'LS' Type Shaped Lead Items
22.8
[0.898]
52.4
[2.063]
6.4
[0.252]
<0.8 Max
<1.2 Max. Lead Bend
5.0 Pitch
[0.197]
16 +0.3 / -0.1
[0.630 +0.012 / -0.004]
7.5 ± 0.1
[0.295 ± 0.004]
8.5 ± 0.1
[0.335 ± 0.004]
1.75 ± 0.1
[0.069 ± 0.004] 1.5 DIA. MAX.
[0.059]
1.5 DIA. MAX.
[0.059] 12 ± 0.1
[0.472 ± 0.004]
8.6 ± 0.1
[0.339 ± 0.004]
0.4 ± 0.05
[0.016 ± 0.002]
10x4 ± 0.1 = 40 ± 0.2
[10 x 0.157 ± 0.004 = 1.575 ± 0.008]
4 ± 0.1
[0.157 ± 0.004]
Direction of Feed
17.7
[0.697]
275.0
[10.83]
100.0
[3.94]
25.0
[0.98]
76.0
[2.99]
For 'L' Type Axial Lead Items
Core and 'MS' Type Items
Direction of Feed
254.0 - 356.0
[10.0 - 14.0]
0
.0
15]
©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
32
Revised: November 10, 2009 Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG/CG2 Series
CG/CG2 Series
Part Numbering System and Ordering Information
Examples:
CG75 -- A non-leaded 75V device
CG2230L -- A leaded 230V device
CG2800LTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D)
Notes:
CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.
CG2 XXX XX * XX
Breakdown Voltage
75
90
110
145
230
250
300
350
470
600
800
1000
Series
CG -- for 75, 90, or 110V
CG2 -- for 145V to 1000V
Lead Option Code
Option Code*
(Blank) = No Leads / Core
L = Straight Leads
LS = Shaped Leads
MS = Surface Mount
Packaging Option Code
(Blank) = No Leads / Core, Bulk Bag - 400 pcs
L(Blank) = Straight Lead, Tray - 50 pcs
LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel
LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel
LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel
SN = denotes different DC Breakover
Voltage Limit. Please refer to Electrical
Characteristics table for additional
information.
