122
Revised: June 24, 2011 04:57 PM
©2011 Littelfuse, Inc
Teccor® brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
25 Amp Standard & Alternistor (High Commutation) Triacs
Qxx25xx & Qxx25xHx Series
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp)
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition A
Rated VRRM, 125°C, 1008 hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
Biased Temp &
Humidity
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
High Temp. Storage MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Autoclave
(Pressure Cooker Test)
EIA/JEDEC: JESD22-A102
121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability ANSI/J-STD-002, Category 3, Test A
Lead Bend MIL-STD-750: Method 2036, Condition E
Terminal Finish 100% Matte Tin-plated
Body Material UL recognized epoxy meeting ammability
classication 94V-0
Lead Material Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
r
h
Ramp-upRamp-up
Ramp-down
am
-