893D
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Revision: 27-Jun-13 1Document Number: 40008
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT®, Molded Case, Built-In-Fuse Miniature
PERFORMANCE CHARACTERISTICS
www.vishay.com/doc?40088
Operating Temperature: - 55 °C to + 125 °C
(Above 85 °C voltage derating is required)
Capacitance Range: 0.47 μF to 470 μF
Capacitance Tolerance: ± 10 %, ± 20 %
100 % Surge Current Tested (D and E case codes)
Voltage Rating: 4 VDC to 50 VDC
FEATURES
• Electrically activated internal fuse
• Fuse activation at 25 °C: 0.1 s max. with 5 A
min. applied current
• 100 % surge current tested (D and E case
codes)
• Terminations: 100 % matte tin standard,
tin/lead available
• Molded package available in three case codes
• Compatible with “High Volume” automatic pick and place
• Compliant terminations
• Meets IEC specification QC300801/US0001 and EIA
535BAAC mechanical and performance requirements
• Moisture sensitivity level 1
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and/or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information/tables in this datasheet for details.
APPLICATIONS
• Industrial
• Telecom infrastructure
• Medical
•Computer
• General Purpose
Note
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating.
Effective July 15, 2008, part numbers with solderable termination codes “2T” and “2W” may have either matte tin or tin/lead terminations.
Codes 2TE3 and 2WE3 specify only matte tin terminations. Codes 8T and 8W specify only tin/lead terminations.
Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option).
Available
Available
ORDERING INFORMATION
893D 106 X0 010 B 2WE3
TYPE CAPACITANCE CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
AT + 85 °C
CASE CODE TERMINATION AND PACKAGING
This is expressed in
picofarads. The first
two digits are the
significant figures. The
third is the number of
zeros to follow
X9 = ± 10 %
X0 = ± 20 %
This is expressed in V. To
complete the three-digit
block, zeros precede the
voltage rating. A decimal
point is indicated by an “R”
(6R3 = 6.3 V)
See Ratings and
Case Codes table
2TE3: Matte tin, 7" (178 mm) reel
2WE3: Matte tin, 13" (330 mm) reel
8T: Tin/lead, 7" (178 mm) reel
8W: Tin/lead, 13" (330 mm) reel
DIMENSIONS in inches [millimeters]
CASE CODE EIA SIZE L W H P TWTH (MIN.)
C 6032-28 0.236 ± 0.012
[6.0 ± 0.30]
0.126 ± 0.012
[3.2 ± 0.30]
0.098 ± 0.012
[2.5 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.087 ± 0.004
[2.2 ± 0.10]
0.039
[1.0]
D 7343-31 0.287 ± 0.012
[7.3 ± 0.30]
0.169 ± 0.012
[4.3 ± 0.30]
0.110 ± 0.012
[2.8 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.094 ± 0.004
[2.4 ± 0.10]
0.039
[1.0]
E 7343-43 0.287 ± 0.012
[7.3 ± 0.30]
0.169 ± 0.012
[4.3 ± 0.30]
0.157 ± 0.012
[4.0 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.094 ± 0.004
[2.4 ± 0.10]
0.039
[1.0]
L
TH (MIN.)
H
WTW
P
Glue Pad
Glue Pad
893D
www.vishay.com Vishay Sprague
Revision: 27-Jun-13 2Document Number: 40008
For technical questions, contact: tantalum@vishay.com
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RATINGS AND CASE CODES
μF 4 V 6.3 V 10 V 16 V 20 V 25 V 35 V 50 V
0.47 C
0.68 C
1.0 C
1.5 C C
2.2 C/D CC/D
3.3 C C C/D
4.7 C C C/D D/E
6.8 C C C D D/E
10 C C C C/D D/E
15 C C C C/D DD/E
22 C C C/D DD/E E
33 CC/D C/D D/E E
47 C/D C/D D/E E
68 C C/D D/E D E
100 C D/E D E
150 D DD/E E
220 D D/E E
330 D/E E
470 E
CONSTRUCTION AND MARKING
Marking:
Capacitors shall be marked with an anode polarity band,
capacitance (in microfarads) and the rated DC working voltage
85 °C. The capacitance voltage will be separated by the letter
“F” indicating a fused capacitor. Units rated at 6.3 V shall be
marked as 6 V.
FUSE ACTIVATION
Lead Frame
Epoxy Encapsulation
Anode Polarity Bar
Solderable
Cathode
Termination
Silver Adhesive
MnO2/Carbon/Silver
Coating
Solderable Anode
Termination
Sintered Tantalum
Pellet
Fusible
Wire
Capacitance
Polarity
Band
Date Code
Vishay
Sprague Logo
22 10
XX 2
F
Voltage
+
+
+
++
+
+
+
++++++
++
TYPICAL CURVE
CURRENT (A)
TIME (s)
10
1
0.1
0.01
0.001
2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10
893D
www.vishay.com Vishay Sprague
Revision: 27-Jun-13 3Document Number: 40008
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
STANDARD RATINGS
CAPACITANCE
(μF) CASE CODE PART NUMBER
MAX. DC
LEAKAGE
AT + 25 °C
(μA)
MAX. DF
AT + 25 °C
120 Hz
(%)
MAX. ESR
AT + 25 °C
100 kHz
()
MAX. RIPPLE
100 kHz
IRMS
(A)
4 VDC AT + 85 °C; 2.7 VDC AT + 125 °C
68 C 893D686(1)004C(2) 2.7 6 1.4 0.28
100 C 893D107(1)004C(2) 4.0 8 0.8 0.37
150 D 893D157(1)004D(2) 6.0 8 0.6 0.50
220 D 893D227(1)004D(2) 8.8 8 0.6 0.50
330 D 893D337(1)004D(2) 13.2 15 0.6 0.50
330 E 893D337(1)004E(2) 13.2 8 0.5 0.57
470 E 893D477(1)004E(2) 18.8 16 0.5 0.57
6.3 VDC AT + 85 °C; 4 VDC AT + 125 °C
15 C 893D156(1)6R3C(2) 0.9 6 1.8 0.25
22 C 893D226(1)6R3C(2) 1.1 6 1.8 0.25
33 C 893D336(1)6R3C(2) 1.6 6 1.4 0.28
47 C 893D476(1)6R3C(2) 2.3 6 1.3 0.29
47 D 893D476(1)6R3D(2) 2.3 6 0.9 0.41
68 C 893D686(1)6R3C(2) 3.3 6 0.8 0.37
68 D 893D686(1)6R3D(2) 3.3 6 0.7 0.46
100 D 893D107(1)6R3D(2) 6.0 8 0.7 0.46
100 E 893D107(1)6R3E(2) 6.0 8 0.7 0.49
150 D 893D157(1)6R3D(2) 9.0 8 0.6 0.50
220 D 893D227(1)6R3D(2) 13.2 8 0.6 0.50
220 E 893D227(1)6R3E(2) 13.2 8 0.5 0.57
330 E 893D337(1)6R3E(2) 19.8 8 0.5 0.57
10 VDC AT + 85 °C; 7 VDC AT + 125 °C
10 C 893D106(1)010C(2) 1.0 6 1.8 0.25
15 C 893D156(1)010C(2) 1.5 6 1.8 0.25
22 C 893D226(1)010C(2) 2.2 6 1.4 0.28
33 C 893D336(1)010C(2) 3.3 6 1.3 0.29
33 D 893D336(1)010D(2) 3.3 6 0.9 0.41
47 C 893D476(1)010C(2) 4.7 6 1.0 0.33
47 D 893D476(1)010D(2) 4.7 6 0.7 0.46
68 D 893D686(1)010D(2) 6.8 6 0.7 0.46
68 E 893D686(1)010E(2) 6.8 6 0.7 0.49
100 D 893D107(1)010D(2) 10.0 8 0.6 0.50
150 D 893D157(1)010D(2) 15.0 8 0.6 0.50
150 E 893D157(1)010D(2) 15.0 8 0.5 0.57
220 E 893D227(1)010E(2) 22.0 8 0.5 0.57
16 VDC AT + 85 °C; 10 VDC AT + 125 °C
6.8 C 893D685(1)016C(2) 1.1 6 2.0 0.23
10 C 893D106(1)016C(2) 1.6 6 1.8 0.25
15 C 893D156(1)016C(2) 2.4 6 1.4 0.28
22 C 893D226(1)016C(2) 3.5 6 1.3 0.29
22 D 893D226(1)016D(2) 3.5 6 0.9 0.41
33 C 893D336(1)016C(2) 5.3 6 1.0 0.33
33 D 893D336(1)016D(2) 5.3 6 0.7 0.46
47 D 893D476(1)016D(2) 7.5 6 0.7 0.46
47 E 893D476(1)016E(2) 7.5 6 0.7 0.49
68 D 893D686(1)016D(2) 10.9 6 0.6 0.50
100 E 893D107(1)016E(2) 16.0 8 0.6 0.52
150 E 893D157(1)016E(2) 24.0 10 0.4 0.64
Note
• Part number definitions:
(1) Tolerance: X0, X9
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W
893D
www.vishay.com Vishay Sprague
Revision: 27-Jun-13 4Document Number: 40008
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
20 VDC AT + 85 °C; 13 VDC AT + 125 °C
4.7 C 893D475(1)020C(2) 0.9 6 2.0 0.22
6.8 C 893D685(1)020C(2) 1.4 6 1.9 0.24
10 C 893D106(1)020C(2) 2.0 6 1.6 0.26
15 C 893D156(1)020C(2) 3.0 6 1.4 0.28
15 D 893D156(1)020D(2) 3.0 6 0.9 0.41
22 D 893D226(1)020D(2) 4.4 6 0.7 0.46
33 D 893D336(1)020D(2) 6.6 6 0.7 0.46
33 E 893D336(1)020E(2) 6.6 6 0.7 0.49
47 E 893D476(1)020E(2) 9.4 6 0.6 0.52
68 E 893D686(1)020E(2) 13.6 6 0.6 0.52
25 VDC AT + 85 °C; 17 VDC AT + 125 °C
2.2 C 893D225(1)025C(2) 0.6 6 2.8 0.21
2.2 D 893D225(1)025D(2) 0.6 6 2.0 0.21
3.3 C 893D335(1)025C(2) 0.8 6 2.3 0.22
4.7 C 893D475(1)025C(2) 1.2 6 1.9 0.24
6.8 C 893D685(1)025C(2) 1.7 6 1.6 0.26
10 C 893D106(1)025C(2) 2.5 6 1.4 0.28
10 D 893D106(1)025D(2) 2.5 6 1.0 0.39
15 D 893D156(1)025D(2) 3.8 6 0.8 0.43
22 D 893D226(1)025D(2) 5.5 6 0.7 0.46
22 E 893D226(1)025E(2) 5.5 6 0.7 0.49
33 E 893D336(1)025E(2) 8.3 6 0.6 0.52
35 VDC AT + 85 °C; 23 VDC AT + 125 °C
1.5 C 893D155(1)035C(2) 0.5 6 3.8 0.17
2.2 C 893D225(1)035C(2) 0.8 6 2.9 0.20
3.3 C 893D335(1)035C(2) 1.2 6 2.0 0.23
4.7 C 893D475(1)035C(2) 1.6 6 1.8 0.25
4.7 D 893D475(1)035D(2) 1.6 6 1.2 0.35
6.8 D 893D685(1)035D(2) 2.4 6 1.0 0.39
10 D 893D106(1)035D(2) 3.5 6 0.8 0.43
10 E 893D106(1)035E(2) 3.5 6 0.8 0.43
15 D 893D156(1)035D(2) 5.3 6 0.7 0.46
15 E 893D156(1)035E(2) 5.3 6 0.7 0.49
22 E 893D226(1)035E(2) 7.7 6 0.6 0.52
50 VDC AT + 85 °C; 33 VDC AT + 125 °C
0.47 C 893D474(1)050C(2) 0.5 4 6.7 0.13
0.68 C 893D684(1)050C(2) 0.5 4 5.9 0.14
1.0 C 893D105(1)050C(2) 0.5 4 4.4 0.16
1.5 C 893D155(1)050C(2) 0.8 6 3.2 0.19
2.2 C 893D225(1)050C(2) 1.1 6 2.8 0.20
2.2 D 893D225(1)050D(2) 1.1 6 2.1 0.27
3.3 C 893D335(1)050C(2) 1.7 6 2.4 0.21
3.3 D 893D335(1)050D(2) 1.7 6 1.6 0.31
4.7 D 893D475(1)050D(2) 2.4 6 1.1 0.37
4.7 E 893D475(1)050E(2) 2.4 6 1.4 0.34
6.8 D 893D685(1)050D(2) 3.4 6 0.9 0.41
6.8 E 893D685(1)050E(2) 3.4 6 0.9 0.43
STANDARD RATINGS
CAPACITANCE
(μF) CASE CODE PART NUMBER
MAX. DC
LEAKAGE
AT + 25 °C
(μA)
MAX. DF
AT + 25 °C
120 Hz
(%)
MAX. ESR
AT + 25 °C
100 kHz
()
MAX. RIPPLE
100 kHz
IRMS
(A)
Note
• Part number definitions:
(1) Tolerance: X0, X9
(2) Terminations and packaging: 2TE3, 2WE3, 8T, 8W
893D
www.vishay.com Vishay Sprague
Revision: 27-Jun-13 5Document Number: 40008
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperatures below + 85 °C)
STANDARD CONDITIONS. FOR EXAMPLE: OUTPUT FILTERS
Capacitor Voltage Rating Operating Voltage
4.0 2.5
6.3 3.6
10 6.0
16 10
20 12
25 15
35 24
50 28
SEVERE CONDITIONS. FOR EXAMPLE: INPUT FILTERS
Capacitor Voltage Rating Operating Voltage
4.0 2.5
6.3 3.3
10 5.0
16 8.0
20 10
25 12
35 15
50 24
POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT + 25 °C (W) IN FREE AIR
C 0.110
D 0.150
E 0.165
STANDARD PACKAGING QUANTITY
CASE CODE UNITS PER REEL
7" REEL 13" REEL
C 500 3000
D 500 2500
E 400 1500
PRODUCT INFORMATION
Guide for Molded Tantalum Capacitors
www.vishay.com/doc?40074
Pad Dimensions
Packaging Dimensions
Moisture Sensitivity www.vishay.com/doc?40135
SELECTOR GUIDES
Solid Tantalum Selector Guide www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors www.vishay.com/doc?40091
FAQ
Frequently Asked Questions www.vishay.com/doc?40110
Molded Guide
www.vishay.com Vishay Sprague
Revision: 27-Jun-12 29 Document Number: 40074
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Guide for Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum/tantalum oxide/manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve“metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance/volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance/volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
C = Capacitance
e = Dielectric constant
A = Surface area of the dielectric
t = Thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC e
DIELECTRIC CONSTANT
Air or Vacuum 1.0
Paper 2.0 to 6.0
Plastic 2.1 to 6.0
Mineral Oil 2.2 to 2.3
Silicone Oil 2.7 to 2.8
Quartz 3.8 to 4.4
Glass 4.8 to 8.0
Porcelain 5.1 to 5.9
Mica 5.4 to 8.7
Aluminum Oxide 8.4
Tantalum Pentoxide 26
Ceramic 12 to 400K
CeA
t
-------
=
Molded Guide
www.vishay.com Vishay Sprague
Revision: 27-Jun-12 30 Document Number: 40074
For technical questions, contact: tantalum@vishay.com
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SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the Leadframe.
Molded Chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT 893D/TF3/T86
MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPES 893D/TF3/T86
Leadframe
Epoxy
Encapsulation
Anode
Polarity Bar
Solderable
Cathode
Termination
Silver
Adhesive
MnO2/Carbon/
Silver Coating
Solderable Anode
Termination
Sintered
Tantalum
Silver Adhesive
Solderable Cathode
Termination
Sintered Tantalum
Pellet
Lead Frame
Fusible
Wire Solderable
Anode Termination
Anode Polarity Bar
Epoxy Encapsulation
MnO2/Carbon/Silver
Coating
Molded Guide
www.vishay.com Vishay Sprague
Revision: 27-Jun-12 31 Document Number: 40074
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
COMMERCIAL PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES 293D 793DE-793DX-
CTC3-CTC4 593D TR3 TP3 TL3
PRODUCT IMAGE
TYPE Surface mount TANTAMOUNT®, molded case
FEATURES Standard
industrial grade CECC approved Low ESR Low ESR High performance,
automotive grade Very low DCL
TEMPERATURE
RANGE - 55 °C to + 125 °C
CAPACITANCE
RANGE 0.1 µF to 1000 µF 0.1 µF to 100 µF 1 µF to 470 µF 0.47 µF to 1000 µF 0.1 µF to 470 µF 0.1 µF to 470 µF
VOLTAGE RANGE 4 V to 63 V 4 V to 50 V 4 V to 50 V 4 V to 63 V 4 V to 50 V 4 V to 50 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 %
LEAKAGE
CURRENT 0.01 CV or 0.5 A, whichever is greater
0.005 CV or
0.25 A,
whichever is
greater
DISSIPATION
FACTOR 4 % to 30 % 4 % to 6 % 4 % to 15 % 4 % to 30 % 4 % to 15 % 4 % to 15 %
CASE CODES A, B, C, D, E, V A, B, C, D A, B, C, D, E A, B, C, D, E, V, W A, B, C, D, E A, B, C, D, E
TERMINATION 100 % matte tin standard, tin/lead available
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES TH3 TH4 TH5 893D TF3
PRODUCT IMAGE
TYPE Surface mount TANTAMOUNT®, molded case
FEATURES
High temperature
+ 150 °C,
automotive grade
High temperature
+ 175 °C,
automotive grade
Very high temperature
+ 200 °C Built-in fuse Built-in fuse,
low ESR
TEMPERATURE
RANGE - 55 °C to + 150 °C - 55 °C to + 175 °C - 55 °C to + 200 °C - 55 °C to + 125 °C
CAPACITANCE
RANGE 0.33 µF to 220 µF 10 µF to 47 µF 10 µF 0.47 µF to 680 µF 0.47 µF to 470 µF
VOLTAGE RANGE 6.3 V to 50 V 6.3 V to 16 V 21 V 4 V to 50 V 4 V to 50 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 %
LEAKAGE
CURRENT 0.01 CV or 0.5 A, whichever is greater
DISSIPATION
FACTOR 4 % to 8 % 4.5 % to 6 % 6 % 6 % to 15 % 6 % to 15 %
CASE CODES A, B, C, D, E B, C E C, D, E C, D, E
TERMINATION
100 % matte tin
standard, tin/lead and
gold plated available
100 % matte tin Gold plated 100 % matte tin standard, tin/lead available
Molded Guide
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HIGH RELIABILITY PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES T83 T86 CWR11 04053 95158
PRODUCT IMAGE
TYPE TANTAMOUNT®, molded case,
Hi-Rel. COTS
TANTAMOUNT®, molded case,
DLA approved
FEATURES
High reliability,
standard and
low ESR
High reliability,
built-in fuse,
standard and
low ESR
MIL-PRF-55365/8
qualified Built-in fuse Low ESR
TEMPERATURE
RANGE - 55 °C to + 125 °C
CAPACITANCE
RANGE 0.1 µF to 470 µF 0.47 µF to 330 µF 0.1 µF to 100 µF 0.47 µF to 470 µF 4.7 µF to 220 µF
VOLTAGE RANGE 4 V to 63 V 4 V to 50 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 % ± 5 %, ± 10 %,
± 20 % ± 20 % ± 10 %, ± 20 %
LEAKAGE CURRENT 0.01 CV or 0.5 A, whichever is greater
DISSIPATION FACTOR 4 % to 15 % 6 % to 16 % 4 % to 6 % 4 % to 8 % 4 % to 12 %
CASE CODES A, B, C, D, E C, D, E A, B, C, D C, D, E C, D, E
TERMINATION 100 % matte tin; tin/lead;
tin/lead solder fused
Tin/lead;
tin/lead solder fused
Tin/lead
solder plated
Tin/lead
solder plated;
gold plated
Molded Guide
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Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and/or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
(6) B1 dimension is a reference dimension tape feeder clearance only.
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
Tape and Reel Specifications: All case sizes are available
on plastic embossed tape per EIA-481. Standard reel
diameter is 7" [178 mm], 13" [330 mm] reels are available and
recommended as the most cost effective packaging method.
The most efficient packaging quantities are full reel
increments on a given reel diameter. The quantities shown
allow for the sealed empty pockets required to be in
conformance with EIA-481. Reel size and packaging
orientation must be specified in the Vishay Sprague part
number.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.) FK0
(MAX.) P1W
293D - 593D - 893D - TR3 - TH3 - TF3 - TP3 - 793DE/793DX/CTC3/CTC4
A8 mm 0.165
[4.2]
0.039
[1.0]
0.138 ± 0.002
[3.5 ± 0.05]
0.094
[2.4]
0.157 ± 0.004
[4.0 ± 1.0]
0.315 ± 0.012
[8.0 ± 0.30]
B
C
12 mm 0.32
[8.2]
0.059
[1.5]
0.217 ± 0.00
[5.5 ± 0.05]
0.177
[4.5]
0.315 ± 0.004
[8.0 ± 1.0]
0.472 ± 0.012
[12.0 ± 0.30]
D
E
V
W
0.004 [0.1]
MAX.
K
0
Tape thickness
B
1
MAX.
(Note 6)
0.014
[0.35]
MAX.
± 0.008 [0.200]
Embossment 0.069 ± 0.004
[1.75 ± 0.10]
D
1
MIN. for components
0.079 x 0.047 [2.0 x 1.2] and larger .
(Note 5)
Maximum
cavity size
(Note 1)
USER DIRECTION OF FEED
Center lines
of cavity
A
0
P
1
FW
0.030 [0.75]
MIN. (Note 4)
0.030 [0.75]
MIN. (Note 3)
0.079 ± 0.002
[2.0 ± 0.05]
0.157 ± 0.004
[4.0 ± 0.10]
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
B
0
Maxim um
component
rotation
(Side or front sectional view)
20°
For tape feeder
reference only
including draft.
Concentric around B
0
(Note 5)
Deformation
between
embossments
Top
cover
tape
Top
cover
tape
10 pitches cumulative
tolerance on tape
Direction of Feed
Anode (+)
Cathode (-)
0.9843 [250.0]
Tape
3.937 [100.0]
0.039 [1.0]
MAX.
0.039 [1.0]
MAX.
Camber
(top view)
Allowable camber to be 0.039/3.937 [1/100]
non-cumulative over 9.843 [250.0]
Molded Guide
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand Reflow profile as per J-STD-020 standard
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
Preheat/soak
Temperature min. (Ts min.) 100 °C 150 °C
Temperature max. (Ts max.) 150 °C 200 °C
Time (ts) from (Ts min. to Ts max.) 60 s to 120 s 60 s to 120 s
Ramp-up
Ramp-up rate (TL to Tp) 3 °C/s max. 3 °C/s max.
Liquidous temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL60 s to 150 s 60 s to 150 s
Peak package body temperature (Tp) Depends on case size - see table below
Time (tp) within 5 °C of the specified
classification temperature (TC)20 s 30 s
Time 25 °C to peak temperature 6 min max. 8 min max.
Ramp-down
Ramp-down rate (Tp to TL) 6 °C/s max. 6 °C/s max.
25
TEMPERATURE (°C)
TIME (s)
ts
tL
Time 25 °C to peak
TL
TpTC = 5 °C
tp
Ts max.
Ts min.
Preheat area
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE PEAK PACKAGE BODY TEMPERATURE (Tp)
SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS
A, B, C, V 235 °C 260 °C
D, E, W 220 °C 250 °C
PAD DIMENSIONS in inches [millimeters]
CASE CODE A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
293D - 593D - 893D - TR3 - TL3 - TH3 - TH4 - TH5 - TF3 - TP3 - 793DE/793DX/CTC3/CTC4 - T83 - T86 - CWR11 - 95158 - 04053
A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75]
B 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25]
C 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80]
D 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
E 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
V 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
W 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
A
BC
D
Molded Guide
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GUIDE TO APPLICATION
1. AC Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
where,
P = Power dissipation in W at + 25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = The capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = Power dissipation in W at + 25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = The capacitor equivalent series resistance at
the specified frequency
Z = The capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+ 25 °C.
3. Reverse Voltage: Solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at + 85 °C.
4. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible RMS ripple current or voltage shall be
calculated using the derating factors as shown:
5. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power dissipation calculated using
+ 25 °C temperature rise).
6. Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack
the epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9. Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process
and/or circuit board design.
TEMPERATURE DERATING FACTOR
+ 25 °C 1.0
+ 85 °C 0.9
+ 125 °C 0.4
IRMS
P
RESR
------------=
VRMS IRMS x Z=
VRMS ZP
RESR
------------=
Typical Performance Characteristics
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Typical Performance Characteristics Tantalum Capacitors
Notes
• All information presented in this document reflects typical performance characteristics
(1) Capacitance values 15 μF and higher
CAPACITOR ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE CHARACTERISTICS
Category temperature range - 55 °C to + 85 °C (to + 125 °C with voltage derating)
Capacitance tolerance ± 20 %, ± 10 % (at 120 Hz) 2 VRMS (max.) at + 25 °C using a capacitance bridge
Dissipation factor Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz
ESR Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz
Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with
1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than 0.01 CV or
0.5 μA, whichever is greater. Note that the leakage current varies with temperature and applied voltage.
See graph below for the appropriate adjustment factor.
Capacitance change by
temperature + 12 % max. (at + 125 °C)
+ 10 % max. (at + 85 °C)
- 10 % max. (at - 55 °C)
For capacitance value > 300 μF
+ 20 % max. (at + 125 °C)
+ 15 % max. (at + 85 °C)
- 15 % max. (at - 55 °C)
Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at + 25 °C
5 % of the DC rating at + 85 °C
Vishay does not recommend intentional or repetitive application of reverse voltage
Temperature derating If capacitors are to be used at temperatures above + 25 °C, the permissible RMS ripple current or voltage
shall be calculated using the derating factors:
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
Operating temperature + 85 °C + 125 °C
RATED VOLTAGE
(V)
SURGE VOLTAGE
(V)
RATED VOLTAGE
(V)
SURGE VOLTAGE
(V)
4 5.2 2.7 3.4
6.3 8 4 5
10 13 7 8
16 20 10 12
20 26 13 16
25 32 17 20
35 46 23 28
50 65 33 40
50 (1) 60 33 40
63 76 42 50
Typical Performance Characteristics
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Notes
•At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
•At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
•At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table.
TYPICAL LEAKAGE CURRENT FACTOR RANGE
CAPACITOR PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE CHARACTERISTICS
Surge voltage Post application of surge voltage (as specified in the table above) in series with a 33 resistor at the rate of 30 s
ON, 30 s OFF, for 1000 successive test cycles at 85 °C, capacitors meet the characteristics requirements listed
below.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
Surge current After subjecting parts in series with a 1 resistor at the rate of 3 s CHARGE, 3 s DISCHARGE, and a cap bank of
100K μF for 3 successive test cycles at 25 °C, capacitors meet the characteristics requirements listed below.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
Life test at + 85 °C Capacitors meet the characteristic requirements listed below. After 2000 h application of rated voltage at 85 °C.
Capacitance change
Leakage current
Within ± 10 % of initial value
Shall not exceed 125 % of initial value
Life test at + 125 °C Capacitors meet the characteristic requirements listed below. After 1000 h application 2/3 of rated voltage at 125 °C.
Capacitance change
for parts with cap. 600 μF
for parts with cap. > 600 μF
Leakage current
Within ± 10 % of initial value
Within ± 20 % of initial value
Shall not exceed 125 % of initial value
Leakage Current Factor
Percent of Rated Voltage
100
10
1.0
0.1
0.01
0.001
0 10 20 30 40 50 60 70 80 90 100
+ 125 °C + 85 °C
+ 55 °C
+ 25 °C
- 55 °C
+ 150 °C
0 °C
Typical Performance Characteristics
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CAPACITOR ENVIRONMENTAL CHARACTERISTICS
ITEM CONDITION ENVIRONMENTAL CHARACTERISTICS
Humidity tests At 40 °C/90 % RH 1000 h, no voltage applied. Capacitance change
Cap. 600 μF
Cap. > 600 μF
Dissipation factor
Within ± 10 % of initial value
Within ± 20 % of initial value
Not to exceed 150 % of initial
+ 25 °C requirement
Temperature cycles At - 55 °C/+ 125 °C, 30 min each, for 5 cycles. Capacitance change
Cap. 600 μF
Cap. > 600 μF
Dissipation factor
Leakage current
Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
Moisture resistance MIL-STD-202, method 106 at rated voltage,
42 cycles.
Capacitance change
Cap. 600 μF
Cap. > 600 μF
Dissipation factor
Leakage current
Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
Thermal shock Capacitors are subjected to 5 cycles of the
following:
- 55 °C (+ 0 °C, - 5 °C) for 30 min, then
+ 25 °C (+ 10 °C, - 5 °C) for 5 min, then
+ 125 °C (+ 3 °C, - 0 °C) for 30 min, then
+ 25 °C (+ 10 °C, - 5 °C) for 5 min
Capacitance change
Cap. 600 μF
Cap. > 600 μF
Dissipation factor
Leakage current
Within ± 10 % of initial value
Within ± 20 % of initial value
Initial specified value or less
Initial specified value or less
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION CONDITION POST TEST PERFORMANCE
Shear test Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Substrate bend With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 3 mm, for a total of 3 bends at a rate of 1 mm/s.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
Vibration MIL-STD-202, method 204, condition D, 10 Hz to
2000 Hz, 20 g peak
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Shock MIL-STD-202, method 213B shock (specified
pulse), condition I, 100 g peak
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance to solder heat • Recommended reflow profiles temperatures
and durations are located within the Capacitor
Series Guides
• Pb-free and lead-bearing series caps are
backward and forward compatible
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Solderability MIL-STD-2002, method 208, ANSI/J-STD-002,
test B. Applies only to solder and tin plated
terminations.
Does not apply to gold terminations.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance to solvents MIL-STD-202, method 215 Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Flammability Encapsulent materials meet UL 94 V-0 with an
oxygen index of 32 %.
Legal Disclaimer Notice
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.