DFO05S Thru DF10S 1 AMP SURFACE MOUNT GLASS PASSIVATED SILICON BRIDGE Mi FEATURES Rating to 1000V PRV Ideal for printed circuit board e UL recognized: File #E106441 e UL recognized 94V-O plastic material Mechanical Data e Case: Molded plastic e Leads: Tin plated copper e Leads solderable per MIL-STD-202, Method 208 e Polarity: Symbols molded on body Weight: 0.02 ounce, 0.38 grams Surge overload rating to 45 Amperes peak Reliable low cost construction utilizing molded plastic technique results in inexpensive product i Outline Drawing DF Ss .310 (7.9) = 295 (7.4 A A ee 045 (1.14) +333 (8.5) t 323 (8.2) 102 (2.6) O95 (2,4) | [205 5.2 -195 (5.0) Dimensions in inches and (millimeters) -010 (254) i .013 (.330) L* (076) 440 .060 (1,53) (11.18) MAX. "1 o4g (1.02) Mi Maximum Ratings & Characteristics Ratings at 25 C ambient temperature unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load For capacitive load, derate current by 20% DFO05S | DF01S | DF02S | DF04S | DFO6S | DFO8S | DF10S | Units Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 Vv Maximum RMS Voltage Vrs 35 70 140 280 420 560 700 Vv Maximum DC Blocking Voltage Voc 50 100 200 400 600 800 1000 Vv Maximum Average Forward @ Ta = 40C lav) 1.0 A Output Current Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave lFsm 50 A Superimposed On Rated Load Maximum DC Forward Voltage AT 1.0A DC VE 1.1 Vv Maximum DC Reverse Current @ Ta = 25C Ir 10 yA At Rated DC Blocking Voltage @ Ta = 125C 500 I? t Rating for Fusing (t < 8.3ms) 7 t 10.4 AS Typical Thermal Resistance per Element Cy 25 pF Typical Thermal Resistance RTHJC 40 C/W Operating Temperature Range Ty -55 to +125 C Storage Temperature Range Tstc -55 to +150 C Collmer Semiconductor, Inc.