CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 D D D D D D D CD54ACT161 . . . F PACKAGE CD74ACT161 . . . E OR M PACKAGE (TOP VIEW) Inputs Are TTL-Voltage Compatible Internal Look-Ahead for Fast Counting Carry Output for n-Bit Cascading Synchronous Counting Synchronously Programmable SCR-Latchup-Resistant CMOS Process and Circuit Design Exceeds 2-kV ESD Protection per MIL-STD-883, Method 3015 CLR CLK A B C D ENP GND description/ordering information 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC RCO QA QB QC QD ENT LOAD The 'ACT161 devices are 4-bit binary counters. These synchronous, presettable counters feature an internal carry look-ahead for application in high-speed counting designs. Synchronous operation is provided by having all flip-flops clocked simultaneously so that the outputs change coincident with each other when so instructed by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting spikes that normally are associated with synchronous (ripple-clock) counters. A buffered clock (CLK) input triggers the four flip-flops on the rising (positive-going) edge of the clock waveform. These devices are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. Presetting is synchronous; therefore, setting up a low level at the load input disables the counter and causes the outputs to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs. The clear function is asynchronous. A low level at the clear (CLR) input sets all four of the flip-flop outputs low, regardless of the levels of the CLK, load (LOAD), or enable inputs. The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without additional gating. Instrumental in accomplishing this function are ENP, ENT, and a ripple-carry output (RCO). Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a high-level pulse while the count is maximum (9 or 15, with QA high). This high-level overflow ripple-carry pulse can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the level of CLK. The counters feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the stable setup and hold times. ORDERING INFORMATION PDIP - E -55C 55C to 125C ORDERABLE PART NUMBER PACKAGE TA SOIC - M CDIP - F Tube CD74ACT161E Tube CD74ACT161M Tape and reel CD74ACT161M96 Tube CD54ACT161F3A TOP-SIDE MARKING CD74ACT161E ACT161M CD54ACT161F3A Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 FUNCTION TABLE INPUTS OUTPUTS CLR CLK ENP ENT LOAD A,B,C,D Qn RCO L X X X X X L L H X X l l L L H X X l h H Note 1 H h h h X Count Note 1 H X l X h X Note 1 H X X l h X qn qn L FUNCTION Reset (clear) Parallel load Count Inhibit H = high level, L = low level, X = don't care, h = high level one setup time prior to the CLK low-to-high transition, l = low level one setup time prior to the CLK low-to-high transition, q = the state of the referenced output prior to the CLK low-to-high transition, and = CLK low-to-high transition. NOTE 1: The RCO output is high when ENT is high and the counter is at terminal count (HHHH). 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 logic diagram (positive logic) LOAD ENT ENP 9 10 15 LD 7 RCO CK CLK CLR A B C D 2 1 CK LD R M1 G2 1, 2T/1C3 G4 3D 4R 3 M1 G2 1, 2T/1C3 G4 3D 4R 4 M1 G2 1, 2T/1C3 G4 3D 4R 5 M1 G2 1, 2T/1C3 G4 3D 4R 6 14 13 12 11 QA QB QC QD For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown on the logic diagram of the D/T flip-flops. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 logic symbol, each D/T flip-flop LD (Load) M1 TE (Toggle Enable) G2 1, 2T/1C3 G4 CK (Clock) D (Inverted Data) 3D R (Inverted Reset) 4R Q (Output) logic diagram, each D/T flip-flop (positive logic) CK LD TE LD TG TG LD Q TG TG CK D TG CK R The origins of LD and CK are shown in the logic diagram of the overall device. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CK TG CK CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 typical clear, preset, count, and inhibit sequence The following sequence is illustrated below: 1. Clear outputs to zero (asynchronous) 2. Preset to binary 12 3. Count to 13, 14, 15, 0, 1, and 2 4. Inhibit CLR LOAD A Data Inputs B C D CLK ENP ENT QA Data Outputs QB QC QD RCO 12 13 14 15 0 1 Count 2 Inhibit Preset Async Clear POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6 V Input clamp current, IIK (VI < 0 V or VI > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 V or VO > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous output current, IO (VO > 0 V or VO < VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Package thermal impedance, JA (see Note 3): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) TA = 25C -40C to 85C UNIT MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current -24 IOL t/v Low-level output current Input transition rise or fall rate High-level input voltage -55C to 125C 2 2 0.8 2 V 0.8 V VCC VCC V -24 -24 mA 24 24 24 mA 10 10 10 ns VCC VCC 0.8 V 0 0 VCC VCC 0 0 V NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN VOH VOL II ICC DICC VI = VIH or VIL VI = VIH or VIL VI = VCC or GND VI = VCC or GND, -55C to 125C TA = 25C MAX MIN -40C to 85C MAX MIN UNIT MAX IOH = -50 A IOH = -24 mA 4.5 V 4.4 4.5 V IOH = -50 mA IOH = -75 mA 5.5 V IOL = 50 A IOL = 24 mA IOL = 50 mA 4.5 V 0.1 0.1 0.1 4.5 V 0.36 0.5 0.44 5.5 V - 1.65 - IOL = 75 mA 5.5 V - - 1.65 5.5 V 0.1 1 1 A 5.5 V 8 160 80 A 2.4 3 2.8 mA 4.4 4.4 3.94 3.7 3.8 - 3.85 - 5.5 V IO = 0 3.85 4.5 V to 5.5 V VI = VCC - 2.1 V V V Ci 10 10 10 pF Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50- transmission-line drive capability at 85C and 75- transmission-line drive capability at 125C. Additional quiescent supply current per input pin, TTL inputs high, 1 unit load ACT INPUT LOAD TABLE INPUT A, B, C, or D UNIT LOAD 0.13 CLK 1 CLR, ENT 0.83 LOAD 0.67 ENP 0.5 Unit Load is ICC limit specified in electrical characteristics table (e.g., 2.4 mA at 25C). timing requirements over recommended operating conditions (unless otherwise noted) -55C to 125C MIN fclock Clock frequency tw Pulse duration tsu Setup time, time before CLK th Hold time, time after CLK trec Recovery time, CLR before CLK -40C to 85C MAX MIN 80 CLK high or low POST OFFICE BOX 655303 91 6.2 5.4 CLR low 6 5.3 A, B, C, or D 5 4.4 LOAD 6 5.3 A, B, C, or D 0 0 ENP or ENT 0 0 6 5.3 * DALLAS, TEXAS 75265 UNIT MAX MHz ns ns ns ns 7 CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 switching characteristics over recommended operating conditions, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax MIN MAX 80 CLK tpd -55C to 125C ENT CLR -40C to 85C MIN UNIT MAX 91 MHz RCO 4.2 16.7 4.3 Any Q 4.1 16.5 4.2 15.2 15 RCO 2.7 10.8 2.8 9.8 Any Q 4.1 16.5 4.2 15 RCO 4.1 16.5 4.2 15 TEST CONDITIONS TYP ns operating characteristics, TA = 25C PARAMETER Cpd 8 Power dissipation capacitance No load POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 66 UNIT pF CD54ACT161, CD74ACT161 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS298B - APRIL 2000 - REVISED MARCH 2003 PARAMETER MEASUREMENT INFORMATION 2 x VCC S1 R1 = 500 From Output Under Test Open GND R2 = 500 CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 x VCC GND tw 3V NOTE: When VCC = 1.5 V, R1 and R2 = 1 k. Input 1.5 V 1.5 V LOAD CIRCUIT 0V VOLTAGE WAVEFORMS PULSE DURATION 3V CLR Input 3V Reference Input 1.5 V 0V 1.5 V 0V trec 3V Data Input 1.5 V 10% 1.5 V CLK th tsu 0V 90% 90% 3V 1.5 V 10% 0 V tr VOLTAGE WAVEFORMS RECOVERY TIME tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 3V Input 1.5 V 1.5 V 0V tPLH In-Phase Output 50% 10% tPHL 90% 90% tr tPHL Out-of-Phase Output 90% 3V Output Control tPLH 50% VCC 10% tf 50% 10% VOH Output 50% VCC Waveform 1 10% VOL S1 at 2 x V CC tf (see Note B) 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 1.5 V 1.5 V 0V tPLZ tPZL 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) 50% VCC VCC VOL + 0.3 V VOL tPHZ VOH VOH - 0.3 V 0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. I. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type CD54ACT161F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74ACT161E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT161EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT161M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT161M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT161M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT161M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT161ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT161MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74ACT161M96 Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74ACT161M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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