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DS-RS1117-04 Dec, 2007 www.Orister.com
RS1117 Series
1.0A Low Dropout Positive Voltage Regulator
Features
• Low Dropout Voltage 1.4V (Max.) at 1.0A
• Adjustable or Fixed Voltage (1.8V, 2.5V, 3.3V, 5V)
• Over Current Protection
• Thermal Overload Protection
• Maximum Line Regulation 0.2%
• Maximum Load Regulation 1.0%
• Adjust Pin Current Less Than 120 uA
Applications
• SCSI-2 Active Termination
• High Efficiency Linear Regulators
• 5V to 3.3V Voltage Converter
• Battery Charger
• Battery Management Circuits For Notebook And Palmtop PCs
• Core Voltage Supply: FPGA, PLD, DSP, CPU
General Description
The RS1117 is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage
versions. Over current and thermal protection are integrated onto the chip. Output current will limit as while it
reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.4V Maximum at full rated
output current. The RS1117 series provides excellent regulation over line, load and temperature variations.
Absolute Maximum Ratings
Parameter Symbol Maximum Units
Input Voltage VIN 13 V
Power Dissipation PD Internally Limited * W
Operating Junction Temperature Range TOPR 0 To +125
°C
Storage Temperature Range TSTG -65 To +150
°C
Lead Temperature (Soldering) 5 Sec TLEAD 260
°C
HBM (Human Body Mode) 2 KV/Min
*: SOT-223: 0.9W(Max.), SOT-89: 0.6W(Max.), TO-252: 0.9W(Max.), TO-220: 2.1W(Max.)
RS1117 Series Pin Assignment
3-Lead Plastic SOT-223
Package Code: SJ
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
12 3
Tab
3-Lead Plastic SOT-89
Package Code: M
Pin 1: ADJ/GND
Pin 2: VOUT
Pin 3: VIN
123
3-Lead Plastic TO-252
Package Code: J
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
1 2 3
Tab
3-Lead Plastic TO-220AB
Package Code: E
Pin 1: ADJ/GND
Pin 2 & Tab: VOUT
Pin 3: VIN
1 2 3
Tab
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DS-RS1117-04 Dec, 2007 www.Orister.com
Electrical Characteristics
RS1117-1.8
Parameter Symbol Test Conditions Min. Typ. Max. Units
TJ=25 oC 1.782 1.800 1.818
Output Voltage VOUT V
IN=5V, IO=0A TJ=0 oC to 70 oC 1.764 1.800 1.836 V
Line Regulation REGLINE V
IN=4.75V to 7V, IO=0A TJ=0 oC to 70 oC - - 0.2
Load Regulation REGLOAD V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 0.1 1.0
%
Dropout Voltage VDROPOUT △VO=±3%, IO=1A TJ=0 oC to 70 oC - 1.2 1.4 V
Current Limit IS V
IN=4.75V to 7V TJ=0 oC to 70 oC 1.0 1.5 - A
Quiescent Current IQ V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 6.0 13 mA
Temp. Coefficient TC V
IN=4.75V to 7V, IO=0A to 1A - 0.005 - %/ oC
Temp. Stability TS V
IN=5V, IO=100mA TJ=0 oC to 70 oC - 0.5 - %
RMS Output Noise VN 10Hz ≦ f ≦ 10KHz TJ=25 oC - 0.003 -
%△VO
Ripple Rejection Ratio RA V
IN=5V, IO=1A TJ=0 oC to 70 oC 60 72 - dB
RS1117-5.0
Parameter Symbol Test Conditions Min. Typ. Max. Units
TJ=25 oC 4.950 5.000 5.050
Output Voltage VOUT V
IN=7V, IO=0A TJ=0 oC to 70 oC 4.900 5.000 5.100 V
Line Regulation REGLINE V
IN=7V to 9V, IO=0A TJ=0 oC to 70 oC - - 0.2
Load Regulation REGLOAD V
IN=7V, IO=0A to 1A TJ=0 oC to 70 oC - 0.1 1.0
%
Dropout Voltage VDROPOUT △VO=±1%, IO=0A to 1A TJ=0 oC to 70 oC - 1.2 1.4 V
Current Limit IS V
IN=7V to 10V TJ=0 oC to 70 oC 1.0 1.5 - A
Quiescent Current IQ V
IN=7V, IO=0A to 1A TJ=0 oC to 70 oC - 6.0 13 mA
Temp. Coefficient TC V
IN=7V to 10V, IO=0A to 1A - 0.005 - %/ oC
Temp. Stability TS V
IN=5V, IO=100mA TJ=0 oC to 70 oC - 0.5 - %
RMS Output Noise VN 10Hz ≦ f ≦ 10KHz TJ=25 oC - 0.003 -
%△VO
Ripple Rejection Ratio RA V
IN=5V, IO=1A TJ=0 oC to 70 oC 60 72 - dB
RS1117-3.3
Parameter Symbol Test Conditions Min. Typ. Max. Units
TJ=25 oC 3.270 3.300 3.330
Output Voltage VOUT V
IN=5V, IO=0A TJ=0 oC to 70 oC 3.234 3.300 3.330 V
Line Regulation REGLINE V
IN=4.75V to 7V, IO=0A TJ=0 oC to 70 oC - - 0.2
Load Regulation REGLOAD V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 0.1 1.0
%
Dropout Voltage VDROPOUT △VO=±1%, IO=0A to 1A TJ=0 oC to 70 oC - 1.2 1.4 V
Current Limit IS V
IN=4.75V to 7V TJ=0 oC to 70 oC 1.0 1.5 - A
Quiescent Current IQ V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 6.0 13 mA
Temp. Coefficient TC V
IN=4.75V to 7V, IO=0A to 1A - 0.005 - %/ oC
Temp. Stability TS V
IN=5V, IO=100mA TJ=0 oC to 70 oC - 0.5 - %
RMS Output Noise VN 10Hz ≦ f ≦ 10KHz TJ=25 oC - 0.003 -
%△VO
Ripple Rejection Ratio RA V
IN=5V, IO=1A TJ=0 oC to 70 oC 60 72 - dB
RS1117-2.5
Parameter Symbol Test Conditions Min. Typ. Max. Units
TJ=25 oC 2.475 2.500 2.525
Output Voltage VOUT V
IN=5V, IO=0A TJ=0 oC to 70 oC 2.450 2.500 2.550 V
Line Regulation REGLINE V
IN=4.75V to 7V, IO=0A TJ=0 oC to 70 oC - - 0.2
Load Regulation REGLOAD V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 0.1 1.0
%
Dropout Voltage VDROPOUT △VO=±1%, IO=0A to 1A TJ=0 oC to 70 oC - 1.2 1.4 V
Current Limit IS V
IN=4.75V to 7V TJ=0 oC to 70 oC 1.0 1.5 - A
Quiescent Current IQ V
IN=5V, IO=0A to 1A TJ=0 oC to 70 oC - 6.0 13 mA
Temp. Coefficient TC V
IN=4.75V to 7V, IO=0A to 1A - 0.005 - %/ oC
Temp. Stability TS V
IN=5V, IO=100mA TJ=0 oC to 70 oC - 0.5 - %
RMS Output Noise VN 10Hz ≦ f ≦ 10KHz TJ=25 oC - 0.003 -
%△VO
Ripple Rejection Ratio RA V
IN=5V, IO=1A TJ=0 oC to 70 oC 60 72 - dB
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DS-RS1117-04 Dec, 2007 www.Orister.com
RS1117-ADJ
Parameter Symbol Test Conditions Min. Typ. Max. Units
TJ=25 oC 1.238 1.250 1.262
Reference Voltage VREF V
IN=5V, IO=10mA TJ=0 oC to 70 oC 1.225 1.250 1.275 V
Line Regulation REGLINE V
IN=4.75V to 7V, IO=10mA TJ=0 oC to 70 oC - - 0.2
Load Regulation REGLOAD V
IN=5V, IO=10mA to 1A TJ=0 oC to 70 oC - 0.1 1.0
%
Dropout Voltage VDROPOUT △VO=±1%, IO=10mA to 1A TJ=0 oC to 70 oC - 1.2 1.4 V
Current Limit IS V
IN=2.7V to 7V TJ=0 oC to 70 oC 1.0 1.5 - A
Temp. Coefficient TC V
IN=2.75V to 7V, IO=10mA to 1A - 0.005 - %/ oC
Adjust Pin Current IADJ V
IN=2.75V to 7V, IO=10mA to 1A TJ=0 oC to 70 oC - 55 120
Adjust Pin Current Change △IADJ VIN=2.75V to 7V, IO=10mA to 1A TJ=0 oC to 70 oC - 0.2 5.0
uA
Temp. Stability TS V
IN=5V, IO=100mA TJ=0 oC to 70 oC - 0.5 - %
Minimum Load Current IO V
IN=5V - 5.0 10 mA
RMS Output Noise VN 10Hz ≦ f ≦ 10KHz TJ=25 oC - 0.003 -
%△VO
Ripple Rejection Ratio RA V
IN=5V, IO=1A TJ=0 oC to 70 oC 60 72 - dB
Line Regulation test circuit
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Characteristics Curve
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Applications Description
• Output Voltage Adjustment
Like most regulators, RS1117 series regulate the output by
comparing the output voltage to an internally generated reference
voltage. On the adjustable version, the VREF is available externally as
1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2
should be set to conduct 10mA (minimum output load). The output
voltage is given by the following equation: VOUT =VREF (1+R2/R1) +
IADJ R2
On fixed versions of RS1117 series, the voltage divider is provided
internally.
• Thermal Protection
RS1117 series have thermal protection which limits junction
temperature to 150°C. However, device functionality is only
guaranteed to a maximum junction temperature of +125°C.
The power dissipation and junction temperature for RS1117 in all
packages given by
PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note: TJUNCTION must
not exceed 125°C
• Current Limit Protection
RS1117 series are protected against overload conditions. Current protection is triggered at typically 1.5A.
• Stability And Load Regulation
RS1117 series require a capacitor from VOUT to GND to provide
compensation feedback to the internal gain stage. This is to ensure
stability at the output terminal. Typically, a 47uF tantalum or 100uF
aluminum electrolytic is sufficient.
Note : It is important that the ESR for this capacitor does not exceed
0.5Ω.
The output capacitor does not have a theoretical upper limit and
increasing its value will increase stability. COUT = 100 uF or more is
typical for high current regulator design.
RS1117 series load regulation are limited by the resistance of the
wire connecting it to the load(RP). For the adjustable version, the best
load regulation is accomplished when the top of the resistor
divider(R1) is connected directly to the output pin of the RS1117
series. When so connected, RP is not multiplied by the divider ratio.
For fixed output versions, the top of R1 is internally connected to the
output and ground pin can be connected to low side of the load as a
negative side sense if, so desired.
• Thermal Consideration
The RS1117 series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal
load conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to
consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to-heat-sink interface and
heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation.
For example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same
junction temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding
wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal
flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The
case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically
isolated, a thermally conductive spacer can be used, as long its thermal resistance is considered.
• Protection Diode
(The figure is shown as Regulator with Reverse Diode Protection in advanced applications)
In general operation, RS1117 series don’t need any protection diodes. From the cross-section structure of RS1117 series, the
output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It
can handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of
surge currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously
shorted to ground, can damage occur. A crowbar circuit at the input of the RS1117 series can generate those kinds of currents, and a
diode from output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not
generate currents large enough to do any damage.
RL
R1
R2
Connect
R1 to Case
Connect
R2 to Load
OutIn
Adj
RP
Parasitic
Line Resistance
VIN
VOUT =VREF (1+R2/R1) + IADJ R2
VIN
R1
R2
VREF
In Out
ADJ
IADJ
10uA
VOUT
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DS-RS1117-04 Dec, 2007 www.Orister.com
SOT-223 Dimension
SOT-89 Dimension
321
A
B
C
D
E
F
G
H
I
321
F
B
A
C
D
E
G
Ha1
a2
I
Marking:
Date Code Control Code
RSJ
1117- Product Series
(ADJ,1.8,2.5,3.3,5)
Pb Free Mark
Pb-Free: " ."(Note)
Normal: None S
Date Code Control Code
RSJ
1117- Product Series
(ADJ,1.8,2.5,3.3,5)
Pb Free Mark
Pb-Free: " ."(Note)
Normal: None S
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A 2.90 3.10
B 6.70 7.30
C 3.30 3.70
D 0.60 0.80
E *2.30 -
F 6.30 6.70
G 1.40 1.80
H 0.25 0.35
I 0.02 0.10
a1 *13o-
a2 0 o 10 o
*: Typical, Unit: mm
DIM Min. Max.
A 4.40 4.60
B 4.05 4.25
C 1.50 1.70
D 2.40 2.60
E 0.36 0.51
F *1.50 -
G *3.00 -
H 1.40 1.60
I 0.35 0.41
*: Typical, Unit: mm
Marking:
Date Code Control Code
S111
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None
R7
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Date Code Control Code
S111
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None
R7
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead SOT-89 Plastic
Surface Mounted Package
Package Code: M
3-Lead SOT-223 Plastic
Surface Mounted Package
Package Code: SJ
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TO-252 Dimension
TO-220AB Dimension
AB
E
G
IK
M
O
P
3
2
1
C
N
H
D
Tab
F
J
L
B
AC
E
H
I
J
K
3
2
1
D
FG
L
Marking:
Control Code
Date Code
RJ
1117 Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None S
Control Code
Date Code
RJ
1117 Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None S
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A 0.45 0.55
B 1.70 1.90
C 0.90 1.50
D 0.45 0.60
E 6.40 6.80
F 5.40 5.80
G 2.20 2.80
H - *2.30
I 0.70 0.90
J - 0.90
K 5.20 5.50
L 1.40 1.60
*: Typical, Unit: mm
DIM Min. Max.
A 5.58 7.49
B 8.38 8.90
C 4.40 4.70
D 1.15 1.39
E 0.35 0.60
F 2.03 2.92
G 9.66 10.28
H - *16.25
I - *3.83
J 3.00 4.00
K 0.75 0.95
L 2.54 3.42
M 1.14 1.40
N - *2.54
O 12.70 14.27
P 14.48 15.87
*: Typical, Unit: mm
Marking:
Control Code
Date Code
RE
1117
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
S
Control Code
Date Code
RE
1117
Pb Free Mark
Pb-Free: "
."(Note)
Normal: None
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
S
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220AB
Plastic Package
Package Code: E
3-Lead TO-252 Plastic
Surface Mount Package
Package Code: J
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Ordering Information
Part Number Output Voltage Package Part Number Output Voltage Package
RS1117M-A ADJ RS1117J-A ADJ
RS1117M-B 1.8V RS1117J-B 1.8V
RS1117M-C 2.5V RS1117J-C 2.5V
RS1117M-D 3.3V RS1117J-D 3.3V
RS1117M-E 5.0V
SOT-89
RS1117J-E 5.0V
TO-252
RS1117SJ-A ADJ RS1117E-A ADJ
RS1117SJ-B 1.8V RS1117E-B 1.8V
RS1117SJ-C 2.5V RS1117E-C 2.5V
RS1117SJ-D 3.3V RS1117E-D 3.3V
RS1117SJ-E 5.0V
SOT-223
RS1117E-E 5.0V
TO-220AB
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Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (TL to TP) <3oC/sec <3oC/sec
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100oC
150oC
60~120 sec
150oC
200oC
60~180 sec
Tsmax to TL
- Ramp-up Rate
<3oC/sec
<3oC/sec
Time maintained above:
- Temperature (TL)
- Time (tL)
183oC
60~150 sec
217oC
60~150 sec
Peak Temperature (TP) 240oC +0/-5oC 260oC +0/-5oC
Time within 5oC of actual Peak
Temperature (tP) 10~30 sec 20~40 sec
Ramp-down Rate <6oC/sec <6oC/sec
Time 25oC to Peak Temperature <6 minutes <8 minutes
3. Flow (wave) soldering (solder dipping)
Products Peak temperature Dipping time
Pb devices. 245oC ±5oC 5sec ±1sec
Pb-Free devices. 260oC +0/-5oC 5sec ±1sec
Figure 1: Temperature profile
t
P
t
L
Ramp-down
Ramp-up
Ts
max
Ts
min
Critical Zone
T
L
to T
P
t
S
Preheat
T
L
T
P
25
t 25
o
C to Peak
Time
Temperature
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DS-RS1117-04 Dec, 2007 www.Orister.com
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of Orister Corporation.
• Orister Corporation reserves the right to make changes to its products without notice.
• Orister Corporation products are not warranted to be suitable for use in Life-Support Applications, or systems.
• Orister Corporation assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
