Monolithic Hall Effect ICs AK-series AK8771 Shipped in packet-tape reel(5000pcs/Reel) AK8771 is ultra-small Hall effect IC of a single silicon chip composed of Hall element and a signal processing IC. Bipolar Hall Supply Voltage Power down Effect Latch 1.65.5 Function Ultra High Sensitivity Bop1.8mT Output SON CMOS Notice:It is requested to read and accept "IMPORTANT NOTICE" written on the back of the front cover of this catalogue. Features Precision Bipolar Hall Effect Latch Power manageability through "PDN" pin Current consumption in Power down mode is less than 1A Ultra small SON package : 1.1x1.4xt0.37mm, Halogen free Operational Characteristics VOUT H VOH S or N Package top Bh Package bottom S N or S L VOL 0 Brp Bop N Magnetic flux density Functional Block Diagram 1VDD 3PDN Item Switch Dynamic Offset Cancellation OSC OSC Hall Chopper & Element SW Timing Logic 4OUT Function Generates operating clock Timing Logic Generates timing signal requires for Chopper SW, AMP and other circuits Hall Element Hall element fabricated by CMOS process AMP Schmitt Trigger Latch Logic Output Stage 2VSS Chopper SW Performs chopping in order to cancel the offset voltage of Hall sensor AMP Reduce offset voltage and amplifies Hall output voltage Schmitt Trigger Hysteresis comparator Latch Logic CMOS output, During the power down mode, output Output Stage is latched in its previous state 13 AK8771 *Please be aware that our products are not intended for use in life support equipment, devices, or systems. Use of our products in such applications requires the advance written approval of our sales staff. Certain applications using semiconductor devices may involve potential risks of personal injury, property damage or loss of life. In order to minimize these risks, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. Inclusion of our products in such applications is understood to be fully at the risk of the customer using our devices or systems. c Absolute Maximum Ratings Item symbol Min. Max. Unit Power supply voltage VDD 0.3 6.5 V Output current IOUT 0.5 0.5 mA OUT Note Input voltage VIN 0.3 VDD0.3 V PDN Input IIN 10 10 mA PDN TSTG 55 125 current Storage temperature ) Less than +6.5V. Note) Stress beyond these listed values may cause permanent damage to the device. Recommended Operating Conditions Item symbol Min. Typ. Max. Unit Power supply voltage VDD 1.6 3.0 5.5 V Operating temperature Ta 30 85 g Electrical CharacteristicsTa=25 VDD =3.0V Item symbol Current consumption 1 IDD1 Current consumption 2 IDD2 Min. Typ. 2.5 PDN input current IIN 1 PDN input H voltage VIH 0.7VDD PDN input L voltage VIL High level output voltage VOH Note Max. Unit 1 A PDN=0V 6 mA PDN=3V 1 A V 0.3 VDD0.4 V V IOUT =0.5mA Low level output voltage VOL 0.4 V IOUT =0.5mA PDN mode transition time 1 TPD1 100 s ActivePDN PDN mode transition time 2 TPD2 100 s PDNActive k Magnetic CharacteristicsTa=25 VDD =3.0V Item symbol Operating point Bop Releasing point Brp Hysteresis Bh Min. Typ. Max. Unit 1.8 4.0 mT 4.0 1.8 mT 3.6 mT n Magnetic CharacteristicsTa=-3085 VDD =1.65.5V Item symbol Operating point Bop Releasing point Brp Hysteresis Bh Min. 4.2 Typ. Max. Unit 1.8 4.2 mT 1.8 mT 3.6 mT o p Note) The specifications in Magnetic Characteristics are design targets. 14 AK8771 PackageUnit:mm) Footprintfor reference 0.80 (0.23) (0.125) 4 CMOS Input. This pin has to be tied to H level when external power control is not used. CMOS Output Application Circuit BmT N Bop 0 Brp S VPDNV VDD =3.0V t OUT AK8771 t TPD2100s VOUTV VSS TPD2100s PDN Undefined t TPD1100s 0 TPD1100s t Functional Timing Note1) During power down mode, output is latched in its previous state. Note2) When VDD is supplied, the time from reaching VDD=1.6V to the update of the output state is equal to TPD2. 15 CMOS Output VDD 0.1F 0 IDDmA 0.50 Note Function Timing Chart 0 GND CMOS Input 1.70 0.60 0.22 1.00 0.35 0.22 Note 1) Sensitive area position referenced to the center of package within 0.3mm circle. Note 2) Tolerances of dimension otherwise noted is 0.05mm. Note 3) Hatched area is plated. Note 4) Center pad area (TAB) should be tied to the VSS or floating 0.37 Pin name Function VDD Power supply VSS Ground PDN Power down. H:Device active L:Device power down OUT Output 1.40 0.60 1.40 Sensor Center No. 1 2 3 0.80 0.50 0.20 1.10 AK8771 Typical Characteristic Datafor reference 4 4 Bop Brp 3 2 Bop, BrpmT Bop, BrpmT 2 1 0 -1 -1 -3 -3 0 10 20 30 40 50 60 4 70 80 -4 -30 -20 -10 90 20 30 40 50 60 70 80 90 Bop Brp 2 Bop, BrpmT 1 0 -1 0 -1 -2 -3 -3 0 10 20 30 40 50 60 70 80 -4 -30 -20 -10 90 Ambient Temperature Ta Bop, Brp vs. Ta(VDD=2.0V) 5 0 5 VDD =5.5V VDD =3.0V VDD =2.0V VDD =1.6V 3 2 1 10 20 30 40 50 60 70 Ambient Temperature Ta Bop, Brp vs. Ta(VDD=5.5V) 80 90 -30 k 0 4 mA IDD2 4 g 1 -2 0 -30 -20 -10 10 Ambient Temperature Ta Bop, Brp vs. Ta(VDD =3.0V) 3 2 -4 -30 -20 -10 0 4 Bop Brp 3 Bop, BrpmT 0 -2 Ambient Temperature Ta Bop, Brp vs. Ta(VDD =1.6V) IDD2 mA 1 -2 -4 -30 -20 -10 c Bop Brp 3 25 85 3 2 1 0 10 20 30 40 50 60 Ambient Temperature Ta IDD2 vs. Ta(in various VDD) 70 80 90 0 1 2 3 4 VDDV IDD2 vs.VDD (in various Ta) 5 6 n o p 16 IMPORTANT NOTICE These products and their specifications are subject to change without notice. When you consider any use or application of these products, please make inquiries the sales office of Asahi Kasei Microdevices Corporation (AKM) or authorized distributors as to current status of the products. Descriptions of external circuits, application circuits, software and other related information contained in this document are provided only to illustrate the operation and application examples of the semiconductor products. You are fully responsible for the incorporation of these external circuits, application circuits, software and other related information in the design of your equipments. AKM assumes no responsibility for any losses incurred by you or third parties arising from the use of these information herein. AKM assumes no liability for infringement of any patent, intellectual property, or other rights in the application or use of such information contained herein. Any export of these products, or devices or systems containing them, may require an export license or other official approval under the law and regulations of the country of export pertaining to customs and tariffs, currency exchange, or strategic materials. AKM products are neither intended nor authorized for use as critical componentsNote1) in any safety, life support, or other hazard related device or systemNote2), and AKM assumes no responsibility for such use, except for the use approved with the express written consent by Representative Director of AKM. As used here: Note1) A critical component is one whose failure to function or perform may reasonably be expected to result, whether directly or indirectly, in the loss of the safety or effectiveness of the device or system containing it, and which must therefore meet very high standards of performance and reliability. Note2) A hazard related device or system is one designed or intended for life support or maintenance of safety or for applications in medicine, aerospace, nuclear energy, or other fields, in which its failure to function or perform may reasonably be expected to result in loss of life or in significant injury or damage to person or property. It is the responsibility of the buyer or distributor of AKM products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the above content and conditions, and the buyer or distributor agrees to assume any and all responsibility and liability for and hold AKM harmless from any and all claims arising from the use of said product in the absence of such notification. February 21, 2013