SPEC NO: DSAB3097 REV NO: V.3 DATE:APR/03/2003 PAGE: 1 OF 5
APPROVED : J. Lu CHECKED: Joe Lee DRAWN:Y.H.LI
APPSA04-41MBWA BLUE
Package Dimensions & Internal Circuit Diagram
SURFACE MOUNT DISPLAY
Features
!0.4 INCH CHARACTER HEIGHT.
!LOW CURRENT OPERATION.
!HIGH CONTRAST AND LIGHT OUTPUT.
!EASY MOUNTING ON P.C. BOARDS OR SOCKETS.
!CATEGORIZED FOR LUMINOUS INTENSITY.
!MECHANICALLY RUGGED.
!GRAY FACE, WHITE SEGMENT.
!PACKAGE :800PCS / REEL.
Description
The Blue source color devices are made with GaN on
SiC Light Emitting Diode.
Static electricity and surge damage the LEDS. It is
recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. Specifications are subject to change without notice.
SPEC NO: DSAB3097 REV NO: V.3 DATE:APR/03/2003 PAGE: 2 OF 5
APPROVED : J. Lu CHECKED: Joe Lee DRAWN:Y.H.LI
Electrical / Optical Characteristics at TA=25°°
°°
°C
Absolute Maximum Ratings at TA=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
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SPEC NO: DSAB3097 REV NO: V.3 DATE:APR/03/2003 PAGE: 3 OF 5
APPROVED : J. Lu CHECKED: Joe Lee DRAWN:Y.H.LI
Blue APPSA04-41MBWA
SPEC NO: DSAB3097 REV NO: V.3 DATE:APR/03/2003 PAGE: 4 OF 5
APPROVED : J. Lu CHECKED: Joe Lee DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
APPSA04-41MBWA
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAB3097 REV NO: V.3 DATE:APR/03/2003 PAGE: 5 OF 5
APPROVED : J. Lu CHECKED: Joe Lee DRAWN:Y.H.LI
Tape Specifications
(Units : mm)
