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LM1881
SNLS384G –FEBRUARY 1995–REVISED JUNE 2015
LM1881 Video Sync Separator
1 Features 3 Description
The LM1881 Video sync separator extracts timing
1• AC Coupled Composite Input Signal information including composite and vertical sync,
• >10-kΩInput Resistance burst or back porch timing, and odd and even field
• <10-mA Power Supply Drain Current information from standard negative going sync NTSC,
PAL (1) and SECAM video signals with amplitude from
• Composite Sync and Vertical Outputs 0.5-V to 2-V p-p. The integrated circuit is also
• Odd and Even Field Output capable of providing sync separation for non-
• Burst Gate or Back Porch Output standard, faster horizontal rate video signals. The
vertical output is produced on the rising edge of the
• Horizontal Scan Rates to 150 kHz first serration in the vertical sync period. A default
• Edge Triggered Vertical Output vertical output is produced after a time delay if the
• Default Triggered Vertical Output for Non- rising edge mentioned above does not occur within
Standard Video Signal (Video Games-Home the externally set delay period, such as might be the
Computers) case for a non-standard video signal.
2 Applications Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
• Video Cameras and Recorders SOIC (8) 4.90 mm × 3.91 mm
• Broadcasting Systems LM1881 PDIP (8) 9.81 mm × 6.35 mm
• Set-Top Boxes (1) For all available packages, see the orderable addendum at
• Home Entertainment the end of the data sheet.
• Computing and Gaming Applications (1) PAL in this datasheet refers to European broadcast TV
standard “Phase Alternating Line”, and not to Programmable
Array Logic.
Typical Connection Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.2 Functional Block Diagram......................................... 6
1 Features.................................................................. 17.3 Feature Description................................................... 7
2 Applications ........................................................... 17.4 Device Functional Modes........................................ 10
3 Description............................................................. 18 Application and Implementation ........................ 11
4 Revision History..................................................... 28.1 Application Information............................................ 11
5 Pin Configuration and Functions......................... 38.2 Typical Applications ................................................ 11
6 Specifications......................................................... 39 Power Supply Recommendations...................... 13
6.1 Absolute Maximum Ratings ...................................... 310 Device and Documentation Support................. 14
6.2 ESD Ratings.............................................................. 410.1 Community Resources.......................................... 14
6.3 Recommended Operating Conditions....................... 410.2 Trademarks........................................................... 14
6.4 Electrical Characteristics LM1881............................. 410.3 Electrostatic Discharge Caution............................ 14
6.5 Dissipation Ratings ................................................... 410.4 Glossary................................................................ 14
6.6 Typical Characteristics.............................................. 511 Mechanical, Packaging, and Orderable
7 Detailed Description.............................................. 6Information ........................................................... 14
7.1 Overview................................................................... 6
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (March 2013) to Revision G Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision E (March 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 13
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5 Pin Configuration and Functions
D and P Packages
8-Pin SOIC and PDIP
Top View
Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 CSOUT Output Composite Sync Output
2 CVIN Input Composite Video Input
3 VSOUT Output Vertical Sync Output
4 GND — Ground
5 BPOUT Output Burst or Back Porch Timing Output
6 RSET Input Charge Current External Resistor
7 OEOUT Output Odd and Even Field Output
8 VCC Input Supply Voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply Voltage 13.2 V
Input Voltage 3 VP-P 6 VP-P V
(VCC = 5) (VCC ≥8)
Output Sink Currents; Pins, 1, 3, 5 5 mA
Output Sink Current; Pin 7 2 mA
PDIP Package (10 sec.) 260
Soldering Information Vapor Phase (60 sec.) 215 °C
SOIC Package Infrared (15 sec.) 220
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
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6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Machine Model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
TAOperating free-air temperature 0 70 °C
6.4 Electrical Characteristics LM1881
VCC = 5 V; RSET = 680 kΩ; TA= 0°C to +70°C by correlation with 100% electrical testing at TA=25°C
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Supply Current Outputs at VCC = 5 V 5.2 10 mA
Logic 1 VCC = 12 V 5.5 12
DC Input Voltage Pin 2 1.3 1.5 1.8 V
Input Threshold Voltage See (2) 55 70 85 mV
Input Discharge Current Pin 2; VIN = 2 V 6 11 16 µA
Input Clamp Charge Current Pin 2; VIN = 1 V 0.2 0.8 mA
RSET Pin Reference Voltage Pin 6;(3) 1.1 1.22 1.35 V
Composite Sync. & Vertical IOUT = 40 µA; VCC = 5 V 4.0 4.5 V
Outputs Logic 1 VCC = 12 V 11
IOUT = 1.6 mA VCC = 5 V 2.4 3.6 V
Logic 1 VCC = 12 V 10
Burst Gate and Odd and Even IOUT = 40 µA; VCC = 5 V 4 4.5 V
Outputs Logic 1 VCC = 12 V 11
Composite Sync. Output IOUT =−1.6 mA; Logic 0; Pin 1 0.2 0.8 V
Vertical Sync. Output IOUT =−1.6 mA; Logic 0; Pin 3 0.2 0.8 V
Burst Gate Output IOUT =−1.6 mA; Logic 0; Pin 5 0.2 0.8 V
Odd and Even Output IOUT =−1.6 mA; Logic 0; Pin 7 0.2 0.8 V
Vertical Sync Width 190 230 300 µs
Burst Gate Width 2.7 kΩfrom Pin 5 to VCC 2.5 4 4.7 µs
Vertical Default Time See (4) 32 65 90 µs
(1) Typicals are at TJ= 25°C and represent the most likely parametric norm.
(2) Relative difference between the input clamp voltage and the minimum input voltage which produces a horizontal output pulse.
(3) Careful attention should be made to prevent parasitic capacitance coupling from any output pin (Pins 1, 3, 5 and 7) to the RSET pin (Pin
6).
(4) Delay time between the start of vertical sync (at input) and the vertical output pulse.
6.5 Dissipation Ratings MIN MAX UNIT
Package Dissipation(1) 1100 mW
(1) For operation in ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
package thermal resistance of 110°C/W, junction to ambient.
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-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
100
200
300
400
500
VERTICAL PULSE WIDTH (Ps)
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6.6 Typical Characteristics
Figure 1. RSET Value Selection vs Vertical Serration Pulse Figure 2. Vertical Default Sync Delay Time vs RSET
Separation
Figure 4. Vertical Pulse Width vs RSET
Figure 3. Burst or Black Level Gate Time vs RSET
Figure 5. Vertical Pulse Width vs Temperature Figure 6. Supply Current vs Supply Voltage
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7 Detailed Description
7.1 Overview
The LM1881 is designed to strip the synchronization signals from composite video sources that are in, or similar
to, the N.T.S.C. format. Input signals with positive polarity video (increasing signal voltage signifies increasing
scene brightness) from 0.5 V (p-p) to 2 V (p-p) can be accommodated. The LM1881 operates from a single
supply voltage between 5-V DC and 12-V DC. The only required external components besides a power supply
decoupling capacitor at pin 8 and a set current decoupling capacitor at pin 6, are the composite input coupling
capacitor at pin 2 and one resistor at pin 6 that sets internal current levels. The resistor on pin 6 (that is, Rset)
allows the LM1881 to be adjusted for source signals with line scan frequencies differing from 15.734 kHz. Four
major sync signals are available from the I/C; composite sync including both horizontal and vertical scan timing
information; a vertical sync pulse; a burst gate or back porch clamp pulse; and an odd and even output. The odd
and even output level identifies which video field of an interlaced video source is present at the input. The
outputs from the LM1881 can be used to gen-lock video camera/VTR signals with graphics sources, provide
identification of video fields for memory storage, recover suppressed or contaminated sync signals, and provide
timing references for the extraction of coded or uncoded data on specific video scan lines.
To better understand the LM1881 timing information and the type of signals that are used, refer to Figure 7(a-e)
which shows a portion of the composite video signal from the end of one field through the beginning of the next
field.
7.2 Functional Block Diagram
*Components Optional, See Text
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7.3 Feature Description
7.3.1 Composite Sync Output
The composite sync output, Figure 7(b), is simply a reproduction of the signal waveform below the composite
video black level, with the video completely removed. This is obtained by clamping the video signal sync tips to
1.5-V DC at Pin 2 and using a comparator threshold set just above this voltage to strip the sync signal, which is
then buffered out to Pin 1. The threshold separation from the clamped sync tip is nominally 70 mV which means
that for the minimum input level of 0.5 V (p-p), the clipping level is close to the halfway point on the sync pulse
amplitude (shown by the dashed line on Figure 7(a). This threshold separation is independent of the signal
amplitude, therefore, for a 2-V (p-p) input the clipping level occurs at 11% of the sync pulse amplitude. The
charging current for the input coupling capacitor is 0.8 mA,
Normally the signal source for the LM1881 is assumed to be clean and relatively noise-free, but some sources
may have excessive video peaking, causing high-frequency video and chroma components to extend below the
black level reference. Some video discs keep the chroma burst pulse present throughout the vertical blanking
period so that the burst actually appears on the sync tips for three line periods instead of at black level. A clean
composite sync signal can be generated from these sources by filtering the input signal. When the source
impedance is low, typically 75 Ω, a 620-Ωresistor in series with the source and a 510-pF capacitor to ground will
form a lowpass filter with a corner frequency of 500 kHz. This bandwidth is more than sufficient to pass the sync
pulse portion of the waveform; however, any subcarrier content in the signal will be attenuated by almost 18 dB,
effectively taking it below the comparator threshold. Filtering will also help if the source is contaminated with
thermal noise. The output waveforms will become delayed from between 40 ns to as much as 200 ns due to this
filter. This much delay will not usually be significant but it does contribute to the sync delay produced by any
additional signal processing. Because the original video may also undergo processing, the need for time delay
correction will depend on the total system, not just the sync stripper.
7.3.2 Vertical Sync Output
A vertical sync output is derived by internally integrating the composite sync waveform (Functional Block
Diagram). To understand the generation of the vertical sync pulse, refer to the lower left hand section Functional
Block Diagram. Note there are two comparators in the section. One comparator has an internally generated
voltage reference called V1going to one of its inputs. The other comparator has an internally generated voltage
reference called V2going to one of its inputs. Both comparators have a common input at their noninverting input
coming from the internal integrator. The internal integrator is used for integrating the composite sync signal. This
signal comes from the input side of the composite sync buffer and are positive going sync pulses. The capacitor
to the integrator is internal to the LM1881. The capacitor charge current is set by the value of the external
resistor RSET. The output of the integrator is going to be at a low voltage during the normal horizontal lines
because the integrator has a very short time to charge the capacitor, which is during the horizontal sync period.
The equalization pulses will keep the output voltage of the integrator at about the same level, below the V1.
During the vertical sync period the narrow going positive pulses shown in Figure 7 is called the serration pulse.
The wide negative portion of the vertical sync period is called the vertical sync pulse. At the start of the vertical
sync period, before the first Serration pulse occurs, the integrator now charges the capacitor to a much higher
voltage. At the first serration pulse the integrator output should be between V1and V2. This would give a high
level at the output of the comparator with V1as one of its inputs. This high is clocked into the “D” flip-flop by the
falling edge of the serration pulse (remember the sync signal is inverted in this section of the LM1881). The “Q”
output of the “D” flip-flop goes through the OR gate, and sets the R/S flip-flop. The output of the R/S flip-flop
enables the internal oscillator and also clocks the ODD/EVEN “D” flip-flop. The ODD/EVEN field pulse operation
is covered in Odd and Even Field Pulse. The output of the oscillator goes to a divide by 8 circuit, thus resetting
the R/S flip-flop after 8 cycles of the oscillator. The frequency of the oscillator is established by the internal
capacitor going to the oscillator and the external RSET. The “Q” output of the R/S flip-flop goes to pin 3 and is the
actual vertical sync output of the LM1881. By clocking the “D” flip-flop at the start of the first serration pulse
means that the vertical sync output pulse starts at this point in time and lasts for eight cycles of the internal
oscillator as shown in Figure 7.
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Feature Description (continued)
How RSET affects the integrator and the internal oscillator is shown under the Typical Performance
Characteristics. The first graph is “RSET Value Selection vs Vertical Serration Pulse Separation”. For this graph to
be valid, the vertical sync pulse should last for at least 85% of the horizontal half line (47% of a full horizontal
line). A vertical sync pulse from any standard should meet this requirement; both NTSC and PAL do meet this
requirement (the serration pulse is the remainder of the period, 10% to 15% of the horizontal half line).
Remember this pulse is a positive pulse at the integrator but negative in Figure 7. This graph shows how long it
takes the integrator to charge its internal capacitor above V1.
With RSET too large the charging current of the integrator will be too small to charge the capacitor above V1, thus
there will be no vertical synch output pulse. As mentioned above, RSET also sets the frequency of the internal
oscillator. If the oscillator runs too fast its eight cycles will be shorter than the vertical sync portion of the
composite sync. Under this condition another vertical sync pulse can be generated on one of the later serration
pulse after the divide by 8 circuit resets the R/S flip-flop. The first graph also shows the minimum RSET necessary
to prevent a double vertical pulse, assuming that the serration pulses last for only three full horizontal line periods
(six serration pulses for NTSC). The actual pulse width of the vertical sync pulse is shown in the “Vertical Pulse
Width vs RSET” graph. Using NTSC as an example, lets see how these two graphs relate to each other. The
Horizontal line is 64 µs long, or 32 µs for a horizontal half line. Now round this off to 30 µs. In the “RSET Value
Selection vs Vertical Serration Pulse Separation” graph the minimum resistor value for 30 µs serration pulse
separation is about 550 kΩ. Going to the “Vertical Pulse Width vs RSET” graph one can see that 550 kΩgives a
vertical pulse width of about 180 µs, the total time for the vertical sync period of NTSC (3 horizontal lines). A 550
kΩwill set the internal oscillator to a frequency such that eight cycles gives a time of 180 µs, just long enough to
prevent a double vertical sync pulse at the vertical sync output of the LM1881.
The LM1881 also generates a default vertical sync pulse when the vertical sync period is unusually long and has
no serration pulses. With a very long vertical sync time the integrator has time to charge its internal capacitor
above the voltage level V2. Since there is no falling edge at the end of a serration pulse to clock the “D” flip-flop,
the only high signal going to the OR gate is from the default comparator when output of the integrator reaches
V2. At this time the R/S flip-flop is toggled by the default comparator, starting the vertical sync pulse at pin 3 of
the LM1881. If the default vertical sync period ends before the end of the input vertical sync period, then the
falling edge of the vertical sync (positive pulse at the “D” flip-flop) will clock the high output from the comparator
with V1as a reference input. This will retrigger the oscillator, generating a second vertical sync output pulse. The
“Vertical Default Sync Delay Time vs RSET” graph shows the relationship between the RSET value and the delay
time from the start of the vertical sync period before the default vertical sync pulse is generated. Using the NTSC
example again the smallest resistor for RSET is 500 kΩ. The vertical default time delay is about 50 µs, much
longer than the 30 µs serration pulse spacing.
A common question is how can one calculate the required RSET with a video timing standard that has no
serration pulses during the vertical blanking. If the default vertical sync is to be used this is a very easy task. Use
the “Vertical Default Sync Delay Time vs RSET” graph to select the necessary RSET to give the desired delay time
for the vertical sync output signal. If a second pulse is undesirable, then check the “Vertical Pulse Width vs RSET”
graph to make sure the vertical output pulse will extend beyond the end of the input vertical sync period. In most
systems the end of the vertical sync period may be very accurate. In this case the preferred design may be to
start the vertical sync pulse at the end of the vertical sync period, similar to starting the vertical sync pulse after
the first serration pulse. A VGA standard is to be used as an example to show how this is done. In this standard
a horizontal line is 32 µs long. The vertical sync period is two horizontal lines long, or 64 µs. The vertical default
sync delay time must be longer than the vertical sync period of 64 µs. In this case RSET must be larger than 680
kΩ. RSET must still be small enough for the output of the integrator to reach V1before the end of the vertical
period of the input pulse. The first graph can be used to confirm that RSET is small enough for the integrator.
Instead of using the vertical serration pulse separation, use the actual pulse width of the vertical sync period, or
64 µs in this example. This graph is linear, meaning that a value as large as 2.7 MΩcan be used for RSET (twice
the value as the maximum at 30 µs). Due to leakage currents it is advisable to keep the value of RSET under 2.0
MΩ. In this example a value of 1.0 MΩis selected, well above the minimum of 680 kΩ. With this value for RSET
the pulse width of the vertical sync output pulse of the LM1881 is about 340 µs.
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Feature Description (continued)
Figure 7. (a) Composite Video; (b) Composite Sync; (c) Vertical Output Pulse;
(d) Odd and Even Field Index; (e) Burst Gate or Back Porch Clamp
7.3.3 Odd and Even Field Pulse
An unusual feature of LM1881 is an output level from Pin 7 that identifies the video field present at the input to
the LM1881. This can be useful in frame memory storage applications or in extracting test signals that occur in
alternate fields. For a composite video signal that is interlaced, one of the two fields that make up each video
frame or picture must have a half horizontal scan line period at the end of the vertical scan—that is, at the bottom
of the picture. This is called the “odd field” or “even field”. The “even field” or “field 2” has a complete horizontal
scan line at the end of the field. An odd field starts on the leading edge of the first equalizing pulse, whereas the
even field starts on the leading edge of the second equalizing pulse of the vertical retrace interval. Figure 7(a)
shows the end of the even field and the start of the odd field.
To detect the odd and even fields the LM1881 again integrates the composite sync waveform (Functional Block
Diagram). A capacitor is charged during the period between sync pulses and discharged when the sync pulse is
present. The period between normal horizontal sync pulses is enough to allow the capacitor voltage to reach a
threshold level of a comparator that clears a flip-flop which is also being clocked by the sync waveform. When
the vertical interval is reached, the shorter integration time between equalizing pulses prevents this threshold
from being reached and the Q output of the flip-flop is toggled with each equalizing pulse. Because the half-line
period at the end of the odd field will have the same effect as an equalizing pulse period, the Q output will have a
different polarity on successive fields. Thus by comparing the Q polarity with the vertical output pulse, an odd
and even field index is generated. Pin 7 remains low during the even field and high during the odd field.
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Feature Description (continued)
7.3.4 Burst or Back Porch Output Pulse
In a composite video signal, the chroma burst is located on the back porch of the horizontal blanking period. This
period, approximately 4.8 µs long, is also the black level reference for the subsequent video scan line. The
LM1881 generates a pulse at Pin 5 that can be used either to retrieve the chroma burst from the composite video
signal (thus providing a subcarrier synchronizing signal) or as a clamp for the DC restoration of the video
waveform. This output is obtained simply by charging an internal capacitor starting on the trailing edge of the
horizontal sync pulses. Simultaneously the output of Pin 5 is pulled low and held until the capacitor charge circuit
times out—4 µs later. A shorter output burst gate pulse can be derived by differentiating the burst output using a
series C-R network. This may be necessary in applications which require high horizontal scan rates in
combination with normal (60 Hz–120 Hz) vertical scan rates.
7.4 Device Functional Modes
7.4.1 Operation Mode
In the normal operation mode, the LM1881 will extract video timing information and split the data up into the
respective signals.
The LM1881 will output four sync signals including the composite sync, a vertical sync pulse, a burst gate or
back porch clamp pulse, and an odd and even output.
The outputs from the LM1881can be used to gen-lock video camera/VTR signals with graphics sources, provide
identification of video fields for memory storage, recover suppressed or contaminated sync signals, and provide
timing references for the extraction of coded or uncoded data on specific video scan lines.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
Apart from extracting a composite sync signal free of video information, the LM1881 outputs allow a number of
interesting applications to be developed. As mentioned above, the burst gate or back porch clamp pulse allows
DC restoration of the original video waveform for display or remodulation on an R.F. carrier, and retrieval of the
color burst for color synchronization and decoding into R.G.B. components. For frame memory storage
applications, the odd and even field lever allows identification of the appropriate field ensuring the correct read or
write sequence. The vertical pulse output is particularly useful since it begins at a precise time—the rising edge
of the first vertical serration in the sync waveform. This means that individual lines within the vertical blanking
period (or anywhere in the active scan line period) can easily be extracted by counting the required number of
transitions in the composite sync waveform following the start of the vertical output pulse.
The vertical blanking interval is proving popular as a means to transmit data which will not appear on a normal
T.V. receiver screen. Data can be inserted beginning with line 10 (the first horizontal scan line on which the color
burst appears) through to line 21. Usually lines 10 through 13 are not used which leaves lines 14 through 21 for
inserting signals, which may be different from field to field. In the U.S., line 19 is normally reserved for a vertical
interval reference signal (VIRS) and line 21 is reserved for closed caption data for the hearing impaired. The
remaining lines are used in a number of ways. Lines 17 and 18 are frequently used during studio processing to
add and delete vertical interval test signals (VITS) while lines 14 through 18 and line 20 can be used for
Videotex/Teletext data. Several institutions are proposing to transmit financial data on line 17 and cable systems
use the available lines in the vertical interval to send decoding data for descrambler terminals.
Because the vertical output pulse from the LM1881 coincides with the leading edge of the first vertical serration,
sixteen positive or negative transitions later will be the start of line 14 in either field. At this point simple counters
can be used to select the desired line(s) for insertion or deletion of data.
8.2 Typical Applications
8.2.1 Video Line Selector
The circuit in Figure 8 puts out a singe video line according to the binary coded information applied to line select
bits b0–b7. A line is selected by adding two to the desired line number, converting to a binary equivalent and
applying the result to the line select inputs. The falling edge of the LM1881's vertical pulse is used to load the
appropriate number into the counters (MM74C193N) and to set a start count latch using two NAND gates.
Composite sync transitions are counted using the borrow out of the desired number of counters. The final borrow
out pulse is used to turn on the analog switch (CD4066BC) during the desired line. The falling edge of this signal
also resets the start count latch, thereby terminating the counting.
The circuit, as shown, will provide a single line output for each field in an interlaced video system (television) or a
single line output in each frame for a non-interlaced video system (computer monitor). When a particular line in
only one field of an interlaced video signal is desired, the odd and even field index output must be used instead
of the vertical output pulse (invert the field index output to select the odd field). A single counter is needed for
selecting lines 3 to 14; two counters are needed for selecting lines 15 to 253; and three counters will work for up
to 2046 lines. An output buffer is required to drive low impedance loads.
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Typical Applications (continued)
Figure 8. Video Line Selector
8.2.1.1 Design Requirements
The design must have a single line output in an interlaced video system.
The use case can be used for televisions of computer monitors.
8.2.1.2 Detailed Design Procedure
For the composite input pin, a 510-pF capacitor and 620-Ωresistor are selected to create a lowpass filter for 500
kHz.
For Rset, a 680-kΩwas selected to allow for the Vertical Default Sync Delay Time to be set for 64 uS. Please
refer to Figure 2 for Rset value selection.
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Typical Applications (continued)
8.2.2 Multiple Contiguous Video Line Selector With Black Level Restoration
The circuit in Figure 9 will select a number of adjoining lines starting with the line selected as in the previous
example. Additional counters can be added as described previously for either higher starting line numbers or an
increased number of contiguous output lines. The back porch pulse output of the LM1881 is used to gate the
video input's black level through a lowpass filter (10-kΩ, 10-µF) providing black level restoration at the video
output when the output selected line(s) is not being gated through.
Figure 9. Multiple Contiguous Video Line Selector With Black Level Restoration
8.2.2.1 Design Requirements
The design will select a number of adjoining lines starting with the line selected in the previous application
example.
8.2.2.2 Detailed Design Procedure
Another MM74C193N counter is added to the design to support the additional line outputs.
A 10-kΩresistor and 10-uF capacitor is added to the output of the BURST/BLACK Porch pin to create a low pass
filter which adds in black level restoration to the video.
For the composite input pin, a 510-pF capacitor and 620-Ωresistor are selected to create a lowpass filter for 500
kHz.
For Rset, a 680-kΩwas selected to allow for the Vertical Default Sync Delay Time to be set for 64 uS. Please
refer to Figure 2 for Rset value selection.
9 Power Supply Recommendations
The LM1881 is designed to operate from an input voltage supply range between 5 VDC and 12 VDC.
The LM1881 requires external a decoupling capacitor at Pin 8 and another at Pin 6.
Copyright © 1995–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM1881
LM1881
SNLS384G –FEBRUARY 1995–REVISED JUNE 2015
www.ti.com
10 Device and Documentation Support
10.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14 Submit Documentation Feedback Copyright © 1995–2015, Texas Instruments Incorporated
Product Folder Links: LM1881
PACKAGE OPTION ADDENDUM
www.ti.com 21-Oct-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1881M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM
1881M
LM1881MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM
1881M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Oct-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM1881MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM1881MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-May-2015
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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