DS-M21252G-21 - M/A-COM Technology Solutions

August, 2012 − Rev. 1

1Publication Order Number:

NLAS3899B/D

NLAS3899B

Dual DPDT Low RON, Low

Capacitance Switch

The NLAS3899B is a dual DPDT analog switch designed for low

power audio and dual SIM card applications. The low RON of 3.0 

(typical) is ideal for routing audio signals to or from a moderately high

impedance load. In addition, the low CON of 20 pF (typical) gives the

NLAS3899B a high bandwidth of 280 MHz, perfect for dual SIM card

applications.

Features

•Single Supply Operation

1.65 to 4.3 V VCC

Function Directly from Li−Ion Battery

•Low ON Resistance (3.0  Typical Across VCC)

•Low CON (20 pF Typical)

•Bandwidth 280 MHz

•Maximum Breakdown Voltage: 5.5 V

•Low Static Power

•Interfaces with 1.8 V Chipset

•These are Pb−Free Devices

Typical Applications

•Cell Phone Speaker/Microphone Switching

•Ringtone−Chip/Amplifier Switching

•Dual SIM Card Data Switching

•Four Unbalanced (Single−Ended) Switches

Important Information

•ESD Protection:

Human Body Model (HBM) 1000 V − All Pins

Human Body Model (HBM) 5000 V − I/O to GND

•Continuous Current Rating Through each Switch ±300 mA

•Conforms to: JEDEC MO−220, Issue H, Variation VEED−6

•Package:

♦1.8 x 2.6 x 0.75 mm WQFN16 Pb−Free

♦3.0 x 3.0 x 0.9 mm QFN16 Pb−Free

WQFN16

CASE 488AP

MARKING

DIAGRAMS

See detailed ordering and shipping information in the package

dimensions section on page 8 of this data sheet.

ORDERING INFORMATION

AAMG

ÇÇ

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16 13

310

211

COMA NOA Vcc NCD

NCB GND NOCCOMC

NCC

C−D IN

NOD

COMD

COMB

NOB

A−B IN

NCA

QFN16

CASE 485AE

(Note: Microdot may be in either location)

NLAS

3899

ALYW

ÇÇÇ

XX = Specific Device Code

A = Assembly Location

M= Date Code/Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

NLAS3899B

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NCCOM

Figure 1. Input Equivalent Circuit

PIN DESCRIPTION

QFN PIN # Symbol Name and Function

1, 3, 5, 7, 9, 11, 13, 15 NO A−D, NC A−DIndependent Channels

2, 10 A−B IN, C−D IN Controls

4, 8, 12, 16 COM A−DCommon Channels

6 GND Ground (V)

14 VCC Positive Supply Voltage

TRUTH TABLE

IN NO NC

H ON OFF*

L OFF* ON

*High impedance.

OPERATING CONDITIONS

MAXIMUM RATINGS

Symbol Pins Parameter Value Condition Unit

VCC VCC Positive DC Supply Voltage −0.5 to +5.5 V

VIS NOx, NCx, or

COMx

Analog Signal Voltage −0.5 to VCC + 0.5 V

VIN A−B IN, C−D IN Control Input Voltage −0.5 to 5.5 V

IIS_CON NOx, NCx, or

COMx

Analog Signal Continuous Current ±300 Closed Switch mA

IIS_PK NOx, NCx, or

COMx

Analog Signal Peak Current ±500 10% Duty Cycle mA

IIN A−B IN, C−D IN Control Input Current ±20 mA

TSTG Storage Temperature Range −65 to 150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NLAS3899B

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RECOMMENDED OPERATING CONDITIONS

Symbol Pins Parameter Value Condition Unit

VCC VCC Positive DC Supply Voltage 1.65 to 4.3 V

VIS NOx, NCx, or

COMx

Analog Signal Voltage GND to VCC V

VIN A−B IN, C−D IN Control Input Voltage GND to 4.3 V

TAOperating Temperature Range −40 to +85 °C

tr, tfInput Rise or Fall Time 20 VCC = 1.6 V − 2.7 V ns/V

10 VCC = 3.0 V − 4.5 V

Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where

applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where

applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.

ESD PROTECTION

Pins Description Minimum Voltage

All Pins Human Body Model 1 kV

I/O to GND Human Body Model 5 kV

NLAS3899B

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DC Electrical Characteristics

Typical: T = 25°C; VCC = 3.0 V

CONTROL INPUT (Typical: T = 25°C; VCC = 3.0 V)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

VIH A−B IN,

C−D IN

Control Input High 3.0

4.3

1.3

1.6

VIL A−B IN,

C−D IN

Control Input Low 3.0

4.3

0.5

0.6

IIN A−B IN,

C−D IN

Control Input Leakage 0 v VIN v VCC 4.3 ±0.1 ±1.0 A

SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C; VCC = 3.0 V)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

INO/NC

(OFF)

NCx, NOx OFF State Leakage VIN = VIL or VIH

VNC/NO = 0.3 V

VCOM = 4.0 V

4.3 ±10 ±300 nA

ICOM

(ON)

COMx ON State Leakage VIN = VIL or VIH

VNO = 0.3 V or 4.0 V with

VNC floating or

VNC = 0.3 V or 4.0 V with

VNO floating

VCOM = 0.3 V or 4.0 V

4.3 ±10 ±300 nA

ICC VCC Quiescent Supply VIN and VIS = VCC or GND

ID = 0 A

1.65 − 4.3 ±1.0 ±2.0 A

IOFF A−B IN,

C−D IN

Power Off Leakage VIN = 4.3 V or GND 0±0.5 ±2.0 A

ON RESISTANCE (Typical: T = 25°C; VCC = 3.0 V)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

RON NOx, NCx

COMx

ON Resistance ION = −100 mA

VIS = 0 to VCC

2.5

3.0

3.6

4.3

3.0

2.6

2.5

2.2

4.0

3.0

2.5



RFLAT NOx, NCx

COMx

RON Flatness ION = −100 mA

VIS = 0 to VCC

3.0

4.3

0.8

1.1



RON NOx, NCx

COMx

RON Matching ION = −100 mA

VIS = 0 to VCC

3.0

4.3

0.8

0.7



NLAS3899B

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AC ELECTRICAL CHARACTERISTICS

TIMING/FREQUENCY (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 35 pF, f = 1 MHz)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

tON IN to

NCx or NOx

Turn On Time 2.3 − 4.3 30 40 ns

tOFF IN to

NCx or NOx

Turn Off Time 2.3 − 4.53 20 30 ns

tBBM IN to

NCx or NOx

Break Before Make 3.0 2 15 ns

BW −3dB Bandwidth CL = 5 pF 1.65 − 4.3 280 MHz

ISOLATION AND THD (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

QCharge Injection VIN = VCC to GND

RIS = 0 , CL = 1.0 nF

Q = CL − ΔVOUT

1.65 − 4.3 111 pC

THD Total Harmonic Dis-

tortion

FIS = 20 Hz to 20 kHz

RL = Rgen = 600 ,

CL = 1.0 pF

VIS = 1.0 VPP

3.0 0.007 %

VONL Maximum Feed-

through On Loss

VIN = 0 dBm @ 100 kHz to 50 MHz

VIN centered between VCC & GND

1.65 − 4.3 −0.06 dB

OIRR NOx Off Isolation VIN = 0

VNO or VNC (pk−pk) = 1.0 V

1.65 − 4.3 −67 dB

Xtalk COMx to

COMy

Non−Adjacent Chan-

nel

VNO or VNC (pk−pk) = 1.0 V 1.65 − 4.3 −100 dB

CAPACITANCE (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz)

Symbol Pins Parameter Test Conditions

VCC

(V)

−405C to +855C

Unit

Min Typ Max

CIN A−B IN, C−D

Control Input 0 V 5.0 pF

CON NCx to COMx Through Switch VIN = 0V 3.0 V 20 pF

COFF NCx

NOx

Unselected Port VIS = 3.0V, VIN = 3.0V 3.0 V 10 pF

NLAS3899B

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Figure 2. ICC vs. Vin Figure 3. (Expanded View) ICC vs. Vin

Vin (V) Vin (V)

3.53.02.52.01.51.00.50

−0.002

0.002

0.004

0.006

0.010

0.012

0.014

2.01.21.00.80.60.40.20

0.00010

0.00015

0.00020

0.00025

0.00030

0.00035

ICC (A)

0.008

4.0

3.0 V @ 25°C

3.6 V @ 25°C

4.3 V @ 25°C

1.61.4 1.8

3.0 V @ 25°C

3.6 V @ 25°C

4.3 V @ 25°C

Figure 4. tBBM (Time Break−Before−Make)

Output

DUT

50 35 pF

VCC

Switch Select Pin

90%

Output

Input

VCC

GND

90% of VOH

GND

Figure 5. tON/tOFF

50% 50%

90% 90%

tON tOFF

VOH

Output

Input

VCC

0 V

Figure 6. tON/tOFF

DUT

Open 35 pF

VCC

Input

50% 50%

10%

tON

tOFF

Output

Input

VCC

0 V

10%

50 

0.1 FtBMM

Output

VOUT

VOL

VOUT VOH

VOL

DUT

Open

VCC

Input

Output

50 35 pF

VOUT

0.1 F

NLAS3899B

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Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is

the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction.

VISO = Off Channel Isolation = 20 Log for VIN at 100 kHz

VONL = On Channel Loss = 20 Log for VIN at 100 kHz to 50 MHz

Bandwidth (BW) = the frequency 3 dB below VONL

VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 

Output

DUT

Input

50 

50  Generator

Reference

Transmitted

Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk

(On Channel to Off Channel)/VONL

50 

ǒVOUT

VIN Ǔ

ǒVOUT

VIN Ǔ

Off On Off VOUT

VCC

GND

Output

VIN

DUT

Figure 8. Charge Injection: (Q)

VIN

Open Output

NLAS3899B

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DEVICE ORDERING INFORMATION

Device Order Number Package Type Tape & Reel Size†

NLAS3899BMNTBG WQFN16

(Pb−Free)

3000 / Tape & Reel

NLAS3899BMNTWG QFN16

(Pb−Free)

3000 / Tape & Reel

NLAS3899BMNTXG QFN16

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NLAS3899B

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PACKAGE DIMENSIONS

WQFN16, 1.8x2.6, 0.4P

CASE 488AP

ISSUE B

MOUNTING FOOTPRINT

ǒmm

inchesǓ

SCALE 20:1

0.400

0.0157

0.225

0.0089

0.463

0.0182

0.562

0.0221

2.900

0.1142

1.200

0.0472

2.100

0.0827

*For additional information on our Pb−Free strategy

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

ÉÉ

0.08 C SEATING

PLANE

NOTE 3

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND 0.30 MM

FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD

AS WELL AS THE TERMINALS.

5. EXPOSED PADS CONNECTED TO DIE FLAG.

USED AS TEST CONTACTS.

DIM MIN MAX

MILLIMETERS

1.80 BSC

0.40 BSC

0.70 0.80

0.30 0.50

0.20 REF

0.00 0.050

PIN 1 REFERENCE

D A

0.15 C

0.10 C

0.05 C

0.10 CAB

16 X

L15 X

0.00 0.15

2.60 BSC

0.15 0.25

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

ÉÉ

ÇÇ

ÉÉÉ

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2 0.40 0.60

NLAS3899B

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PACKAGE DIMENSIONS

QFN16 3x3, 0.5 P

CASE 485AE

ISSUE A

16X

SEATING

PLANE

0.15 C

16 13

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. OUTLINE MEETS JEDEC DIMENSIONS PER

MO−220, VARIATION VEED−6.

ÇÇ

0.15 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

LOCATION

0.10 C

0.08 C

(A3)

16 X

16X

NOTE 5

0.10 C

0.05 C

A B

NOTE 3

16X

EXPOSED PAD

DIM MIN NOM MAX

MILLIMETERS

A0.80 0.90 1.00

A1 0.00 0.03 0.05

A3 0.20 REF

b0.18 0.25 0.30

D3.00 BSC

D2 1.25 1.40 1.55

E3.00 BSC

E2 1.25 1.40 1.55

e0.50 BSC

K0.20 −−− −−−

L0.30 0.40 0.50

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

ÉÉ

ÇÇ

ÉÉÉ

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L1 0.00 −−− 0.15

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NLAS3899B/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loca

Sales Representative