
IXYS reserves the right to change limits, test conditions, and dimensions.
IXFA110N15T2
IXFP110N15T2
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) Min. Typ. Max.
gfs VDS = 10V, ID = 55A, Note 1 75 115 S
Ciss 8600 pF
Coss VGS = 0V, VDS = 25V, f = 1MHz 685 pF
Crss 77 pF
td(on) 33 ns
tr 16 ns
td(off) 33 ns
tf 18 ns
Qg(on) 150 nC
Qgs VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 42 nC
Qgd 46 nC
RthJC 0.31 °C/W
RthCH TO-220 0.50 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) Min. Typ. Max.
IS VGS = 0V 110 A
ISM Repetitive, Pulse width limited by TJM 440 A
VSD IF = 100A, VGS = 0V, Note 1 1.3 V
trr 85 ns
IRM 6.8 A
QRM 290 nC
Notes: 1. Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
2. On through-hole packages, RDS(on) Kelvin test contact
location must be 5mm or less from the package body.
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3.3Ω (External)
IF = 55A, VGS = 0V
-di/dt = 100A/μs
VR = 75V
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
TO-263 (IXFA) Outline
Pins: 1 - Gate 2 - Drain
3 - Source 4 - Drain
TO-220 (IXFP) Outline
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.