Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
BGA Adapters
Table of Models
Description: Standard Adapter (A)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Standard Socket (S)
Description: Extraction Slot Adapter (AX)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Note: Mates with Extraction Socket (SB)
How To Order
Footprint Dash #
If Applicable*
1 F H A XXX - 715 G
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
F - FR-4
Number of Positions
See options - available with Standard,
male to male, or surface mount
terminal styles.
RoHS Compliant:
G - Gold
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
J = .0315/(0.80mm)
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter
(1.27 and 1.00mm only)
*See footprints section or
online database.
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
Consult factory for custom 0.75mm pitch designs.
For SMT Adapters, select Model Type A or AX
and appropriate SMT Terminal Type from page 7.
Features:
•Soldering BGA Device to adapter
subjects BGA to less thermal
stress than soldering BGA directly
to a PCB due to the adapter’s
lower mass.
•Uses same footprint as BGA
device.
•Custom adapters available for
heat sink attachment.
•Gold plated screw-machined
terminals for superior durability.
•Unique SMT Adapter provides
reliable solution for mounting or
socketing LGA or re-worked BGA
devices.
•SMT Adapters mate with our BGA
Sockets for LGA to BGA
conversion or SMT Board to
Board applications.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
Options
Extraction Tool
P/N 8125
Insulator Size:
BGA device body
+.079/(2.00mm)
Insulator Size:
BGA device body
+.157/(4.00mm)
•Insert “T” bar end of tool into extraction slot adapter.
•Slide tool to end of slot and pry adapter from socket.
•Repeat in additional slots until adapter is separated from socket.
• Works with LCP or FR-4 sockets.
Extraction
Tool
Socket
Adapter
BGA Device
Extraction
Slot
Note: For use with LGA or reworked BGA devices, select surface mount (SMT) terminals which
feature solder balls on device side.SMT Adapter terminals may also be used for surface mount
board to board applications.
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Extraction Slot Adapter (AX)
•Slots allow AIC extraction tool (sold separately) to easily
remove device/adapter assembly from socket
•Mates with Extraction Socket (SB)
•Adapter size equals BGA Device body + .157/(4.00)
Footprints:
•Footprint specific insulators
drilled to exact device pattern.
•Over 1000 footprints available -
see page 88, search online or
submit your device specs.
•Use our Build-A-Part feature or
search in our online BGA Socket
FinderTM at www.bgasockets.com.
.906 Sq.
(23.00)
.039/(1.00) Typ.
360 Pins
Footprint Number 360-2
22 x 22 rows
Available Online:
•RoHS Qualification Test Report
• Technical articles
• Test data
•Signal Integrity Performance
•CAD Drawings
•BGA Footprints
BGA Adapters
.009
(0.23)Dia.
.146
(3.71)
2X
.011/(0.28)
Dia.
.218
(5.54)
2X
.018/(0.44)
Dia.
.342
(8.69)
.062
(1.57)
Standard Terminals
Type -638 Type -715 Type -700
.018
(0.46) Dia.
.182
(4.62)
.062
(1.57)
2X
.009/(0.23)
Dia.
.230
(5.84)
.010/(0.25)
Dia.
.159
(4.04)
Type -721 Type -735 Type -732
Additional standard and custom terminals available.
See Terminals section or consult factory.
0.80mm pitch
1.00mm pitch1.27mm pitch
Dimensional Information
BGA Body + .079/(2.0)
BGA Device
.039/(1.0)
Standard Adapter (A)
How It Works
BGA Device
BGA Body + .157/(4.0)
.079/(2.0)
•Mates with Standard Socket (S)
•Adapter size equals BGA Device body + .079/(2.00)
.024/(0.61) Dia.
Solder Ball
.010/(0.25)
Dia.
.159
(4.04)
.018/(0.46)
Dia.
.182
(4.62)
.030/(0.76) Dia.
Solder Ball
.062
(1.57)
.020/(0.51) Dia.
Solder Ball
.009/(0.23)
Dia.
.146
(3.71)
Tin/Lead: Type -720
Lead-free: Type -823
Tin/Lead: Type -737
Lead-free: Type -824
Tin/Lead: Type -736
Lead-free: Type -829
Standard
Male to MaleSMT (Surface Mount)
0.80mm pitch
1.00mm pitch1.27mm pitch
0.80mm pitch
1.00mm pitch1.27mm pitch
Reflow (solder) BGA
Device to Adapter
Reflow (solder)
Socket to PCB
(See pgs.8-9
for sockets)
•Either Tin/Lead or Lead-free
device packages can be
attached to our RoHS
Compliant Adapters.
•PC boards can be processed
with Tin/Lead BGA sockets in
standard profiles or lead-free
BGA sockets in RoHS
Compliant, high temperature
profiles.
See page 15 for Generic Reflow Profiles.
BGA Adapter
Sockets
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
Features:
•Advanced®exclusive solder ball
terminals offer superior SMT
processing.
•Same footprint as BGA device.
•Proven long-term performance in
vigorous temperature cycling
applications - solder ball terminal
absorbs TCE mismatch.
•Closed bottom socket terminal for
100% anti-wicking of solder.
•Gold contacts allow gold/gold
interconnections to Adapter pins.
•Low insertion force socket with
multi-fingered high reliability
Beryllium Copper contacts.
•Coplanarity consistently under
.006 inch industry standard.
•Custom designs available.
Table of Models
Description: Standard Socket (S)
Mat’l: High Temp.Liquid Crystal Polymer (LCP)*
Index: -60°C to 260°C (-76°F to 500°F)
Description: Extraction Socket (SB)
Mat’l: High Temp.Liquid Crystal Polymer (LCP)*
Index: -60°C to 260°C (-76°F to 500°F)
Footprint Dash #
If Applicable*
1 M H S XXX - 788 G G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
F - FR-4 (0.80mm pitch)
M - Molded LCP (1.00mm pitch)*
R - Molded LCP (1.27mm pitch)
*some sizes may be available in FR-4 only
Number of Positions
See options
RoHS Compliant:
G - Gold
RoHS Compliant:
G - Gold
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
J = .0315/(0.80mm) Model Type
S = Standard Socket
SB = Extraction Socket (1.27 and 1.00mm only)
*See footprints section or online database.
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
Options
Tape and Reel Packaging
•Conforms to EIA-481 Standard.
•Pick-up tape included.
•Add -TR to end of part number when ordering.
•Custom packaging available
•If -TR is not specified, standard tray packs are
used.
•Extraction tool (P/N 8125) is available separately.
• Works with Extraction Slot Adapters and LCP or
FR-4 sockets.
RGS/RGSB replaces MGS/MGSB, MHS/MHSB replaces FHS/FHSB.
* Some sizes may only be available in FR-4. See How To Order section or consult factory.
Insulator Size:
Same size as
BGA device body
Insulator Size:
1.27mm Pitch:
BGA device body
+.079/(2.00)
1.00mm Pitch:
BGA device body
+.138/(3.50)
How To Order
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7 BGA Adapter
Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Footprints:
•Full grid molded insulators
populated to exact device pattern.
•Over 1000 footprints available -
see page 88, search online or
submit your device specs.
•Use our Build-A-Part feature or
search in our online BGA Socket
FinderTM at www.bgasockets.com.
.906 Sq.
(23.00)
.039/(1.00) Typ.
360 Pins
Footprint Number 360-2
22 x 22 rows
Available Online:
•RoHS Qualification Test Report
• Technical articles
• Test data
•Signal Integrity Performance
•CAD drawings
•Generic Tin/Lead and Lead-free
Reflow Profiles
Extraction Socket (SB)
•Mates with Extraction Slot Adapter (AX)
•Socket size equals BGA body + .079/(2.00) for 1.27mm pitch
or BGA body + .138/(3.50) for 1.00mm pitch
•Protects valuable PCB during device/adapter extraction - tool
never touches PCB
• Available in 1.00 and 1.27mm pitch only
.020 Dia.
(0.51)
.125
(3.18)
.105
(2.67) .088
(2.24)
.125
(3.18)
.011 Dia.
(0.28)
.018 Dia.
(0.46)
.117
(2.97) .095
(2.41)
.128
(3.25)
Standard Terminals
Tin/Lead: Type -636
Lead-free: Type -819
Tin/Lead: Type -790
Lead-free: Type -788
Tin/Lead: Type -702
Lead-free: Type -828
.030 Dia.
(0.76)
.117
(2.97) .095
(2.41)
.125
(3.18)
.011 Dia.
(0.28)
.080
(2.03)
.024 Dia.
(0.61)
.105
(2.67) .088
(2.24)
Type -673 Type -789 Type -731
Additional standard and custom terminals available.
See Terminals section or consult factory.
0.80mm pitch
0.80mm pitch1.00mm pitch1.27mm pitch
1.00mm pitch1.27mm pitch
Dimensional Information
Same Size as BGA Body
BGA Socket
PC Board
Standard Socket (S)
How It Works
BGA Body + .079/(2.00)
or + .138/(3.50)
BGA Socket
PC Board
•Mates with Standard Adapter (A)
•Socket size same as BGA device body
•Use with SMT Adapter for LGA and reworked BGA device
socketing (or board to board applications)
PATENTED PATENTED
SMT (Surface Mount)
Thru-Hole
PATENTED
•Either Tin/Lead or Lead-free
device packages can be
attached to our RoHS
Compliant Adapters.
•PC boards can be processed
with Tin/Lead BGA sockets in
standard profiles or lead-free
BGA sockets in RoHS
Compliant, high temperature
profiles.
Reflow (solder) BGA
Device to Adapter
(See pgs.6-7)
Reflow (solder)
Socket to PCB
See page 15 for Generic Reflow Profiles.
