1
Product Description
EDS-103301 Rev A
303 South Technology Court Phone: (800) SMI-MMIC http://www.sirenza.com
Broomfield, CO 80021
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of
this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are
implied or granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc..
All worldwide rights reserved.
Symbol Parameter Units Frequency Min. Typ. Max.
GpSmall Signal Power Gain [2]
dB
dB
dB
850 MHz
1950 MHz
2400 MHz
20.5
20.0
23.0
22.0
21.5
23.5
23.0
BW 3dB 3dB Bandwidth GHz 3.0
P1dB Output Power at 1dB Compression [2] dBm 1950 MHz 8.0 10.0
OIP3Output Third Order Intercept Point [2] dBm 1950 MHz 20.0 23.0
NF Noise Figure dB 1950 MHz 4.0
RL Input / Output Return Loss dB 1950 11.7
ISOL Reverse Isolation dB 0.1-3.0 GHz 20.0
VDDevice Operating Voltage [1] V 3.3 3.7 4.1
IDDevice Operating Current [1] mA 30.0 35.0 40.0
dG/dT Device Gain Temperature Coefficient dB/°C -0.003
RTH , j-b Thermal Resistance (junction to backside) °C/W 260.0
Sirenza Microdevices’ SNA-300S is a GaAs monolithic broad-
band amplifier (MMIC) in die form. At 1950 MHz, this amplifier
provides 22dB of gain when biased at 35mA .
These unconditionally stable amplifiers are designed for use
as general purpose 50 ohm gain blocks. Its small size
(0.350mm x 0.345mm) and gold metallization make it an ideal
choice for use in hybrid circuits. The SNA-300S is 100% DC
tested and sample tested for RF performance.
External DC decoupling capacitors determine low frequency
response. The use of an external resistor allows for bias
flexibility and stability.
The SNA-300S is supplied in gel paks at 100 devices per
pak. Also available in packaged form (SNA-376 & SNA-
386)
SNA-300S
DC-3 GHz, Cascadable
GaAs HBT MMIC Amplifier
Product Features
• Cascadable 50 Ohm Gain Block
• 22dB Gain, +10dBm P1dB
• 1.5:1 Input and Output VSWR
• Operates From Single Supply
• Through wafer via for ground
Applications
• Broadband Driver Amplifier
• IF Amplifier or gain stage for VSAT, LMDS,
WLAN, and Cellular Systems
Output Power vs. Frequency
8
9
10
11
12
0.10.511.5246810
GHz
dBm
Test Conditions: VS = 8 V ID = 35 mA Typ. OIP3 Tone Spacing = 1 MHz, Pout per tone = 0
RBIAS = 120 Ohms TL = 25ºC, ZS = ZL = 50 Ohms, [1] 100% DC tested, [2] Sample tested
2EDS-103301 Rev A
Preliminary
SNA-300S DC-3 GHz Cascadable MMIC Amplifier
303 South Technology Court Phone: (800) SMI-MMIC http://www.sirenza.com
Broomfield, CO 80021
Noise Figure vs. Frequency
3
3.5
4
4.5
5
0.1 0.5 1.0 1.5 2.0 2.5 3.0
GHz
dB
|S11| vs. Frequency |S21| vs. Frequency
|S12| vs. Frequency |S22| vs. Frequency
TOIP vs. Frequency
-40
-30
-20
-10
0
0.1 0.5 1 1.5 2 2.5 3 3.5 4
-30
-25
-20
-15
-10
-5
0
0.1 0.5 1 1.5 2 2.5 3 3.5 4
16
18
20
22
24
0.1 0.5 1 1.5 2 2.5 3 3.5 4
-40
-30
-20
-10
0
0.1 0.5 1 1.5 2 2.5 3 3.5 4
20
22
24
26
0.5 1 1.5 2 2.5 3 3.5 4
GHz
dB
dBm
GHz
dB
GHz
dB
GHz
dB
GHz
Absolute Maximum Ratings
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Typical Performance at 25
°°
°°
°
C (Vds =3.7V, Ids = 35mA)
(data includes bond wires)
3EDS-103301 Rev A
Preliminary
SNA-300S DC-3 GHz Cascadable MMIC Amplifier
303 South Technology Court Phone: (800) SMI-MMIC http://www.sirenza.com
Broomfield, CO 80021
Part Number Ordering Information
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Caution: ESD sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Typical Application Circuit
For recommended handling, die attach, and bonding methods, see the following application note at
www.sirenza.com.
AN-041 (PDF) Handling of Unpackaged Die
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RF in RF out
1 uF
CB
CB
CD
RBIAS
LC
1
2
3
4
1000
pF
SNA-300
Suggested Bonding Arrangement
(above configuration used for S-parameter data)
Application Circuit Element Values
Simplified Schematic of MMIC
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RFIN RFOUT
GND
VIA Die Thickness - 0.004 [0.1]
Dimensions - inches [mm]
