ISOCOM COMPONENTS IS7000 DESCRIPTION The IS7000 is an optically coupled isolator consisting of an infrared light emitting diode and a high voltage NPN silicon photo darlington which has an integral base-emitter resistor to optimise switching speed and elevated temperature characteristics in a standard 4 pin dual in line plastic package. FEATURES * * * * * * AC Isolation Voltage 5000VRMS High Current Transfer Ratio 1000% minimum Wide Operating Temperature Range -30C to +100C Lead Free and RoHS Compliant UL File No. E91231 Package Code "SS" VDE Approval Certificate No. 40028086 Modems Fax and Copying Machines Numerical Control Machines Signal Transmission between Systems of Different Potentials and Impedance ORDER INFORMATION * * * * 4 2 3 ABSOLUTE MAXIMUM RATINGS APPLICATIONS * * * * 1 Input Diode Forward Current Reverse Voltage Power Dissipation 50mA 6V 70mW Output Transistor Collector to Emitter Voltage BVCEO Collector to Emitter Voltage BVECO Collector Current Power Dissipation 300V 0.1V 150mA 150mW Total Package Operating Temperature Storage Temperature Total Power Dissipation Lead Soldering Temperature (for 10s) -30 to +100 C -55 to +125 C 200mW 260C Add X after PN for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1UD, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com 1 20/07/2015 ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail sales@isocom.com.hk DB92463 ISOCOM COMPONENTS IS7000 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.2 1.4 V Reverse Leakage Current IR VR = 4V 10 A Terminal Capacitance Ct V = 0V, f = 1KHz 30 250 pF Parameter Symbol Test Condition Min Typ. Max Unit Collector-Emitter Breakdown Voltage BVCEO IC = 0.1mA, IF = 0mA 300 V Emitter-Collector Breakdown Voltage BVECO IE = 0.01mA, IF = 0mA 0.1 V Collector-Emitter Dark Current ICEO VCE = 200V, IF = 0mA Symbol Test Condition Min Typ. CTR IF = 1mA, VCE = 2V 1000 4000 VCE(sat) IF = 20mA, IC = 100mA OUTPUT 200 nA Max Unit COUPLED Parameter Current transfer ratio Collector--Emitter Saturation Voltage (1) % 1.2 V Input to Output lation Voltage Iso- VISO See Note 1 5000 VRMS Input to Output lation Resistance Iso- RISO VIO= 500V See Note 1 5x1010 Floating Capacitance Cf V = 0V, f = 1MHz Output Rise Time tr Output Fall Time tf VCE = 2V, Ic = 20mA, RL = 100 0.6 1 100 s 20 s Note 1 : Measure with input leads shorted together and output leads shorted together. 2 20/07/2015 pF DB92463 ISOCOM COMPONENTS IS7000 Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA Fig 3 Forward Current vs Forward Voltage Fig 4 Collector Current vs Collector-Emitter Voltage Fig 5 Collector-emitter Saturation Voltage vs Forward Current Fig 6 Current Transfer Ratio vs Forward Current 3 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 Fig 7 Relative CTR vs TA Fig 8 Collector-Emitter Saturation Voltage vs TA Fig 9 Collector Dark Current vs TA Fig 10 Frequency Response Fig 11 Response Time vs Load Resistance Response Time Test Circuit 4 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 ORDER INFORMATION IS7000 (UL Approval) After PN PN Description Packing quantity None IS7000 Standard DIP 4 100 pcs per reel G IS7000G 10mm Lead Spacing 100 pcs per tube SM IS7000SM Surface Mount 100 pcs per tube SMT&R IS7000SMT&R Surface Mount Tape & Reel 1000 pcs per reel IS7000X (UL and VDE Approval) After PN PN Description Packing quantity None IS7000X Standard DIP 4 100 pcs per reel G IS7000XG 10mm Lead Spacing 100 pcs per tube SM IS7000XSM Surface Mount 100 pcs per tube SMT&R IS7000XSMT&R Surface Mount Tape & Reel 1000 pcs per reel 5 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 PACKAGE DIMENSIONS (mm) DIP G Form SMD 6 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 RECOMMENDED SOLDER PAD LAYOUT FOR SMD (mm) TAPE AND REEL PACKAGING (mm) 7 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) TP 260C TP - 5C Max Ramp Up Rate 3C/s TEMP (C) TL Tsmax Tsmin tP Max Ramp Down Rate 6C/s 217C TL 200C 150C ts Preheat 60s - 120s 25C TIME (s) Time 25C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150C 200C 60s - 120s Soldering Zone - Peak Temperature (TP) - Liquidous Temperature (TL) - Time within 5C of Actual Peak Temperature (TP 5C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260C 217C 30s 60s 3C/s max 6C/s max Average Ramp Up Rate (Tsmax to TP) 3C/s max Time 25C to Peak Temperature 8 minutes max 8 20/07/2015 DB92463 ISOCOM COMPONENTS IS7000 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any "specific" application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 9 20/07/2015 DB92463 ISOCOM COMPONENTS Disclaimer ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. __ The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer's own risk. __ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. __ The products described in this document are subject to the foreign exchange and foreign trade laws. __ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. __ The information contained herein is subject to change without notice. 10 15/07/2015 Dxxxxxx