To our custo mers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corpor ation took over all the business of both
companies. Therefore, althoug h the old company name remains in t his document, it is a valid
Renesas Electronics document. W e appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electr onics Corporat ion (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
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8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
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(Note 1) “Renesas Electronics” as used in this document means Ren esas E lectro nics Corpor ation and also inclu des its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
REJ03G0182-0300 Rev.3.00 Nov 06, 200 7
Page 1 of 5
HZ-L Series
Silicon Planar Zener Diode for Low Noise Application REJ03G0182-0300
Rev.3.00
Nov.06.2007
Features
• Diode noise level of this series is approximately 1/3-1/10 lower than the HZ series.
• Low leakage, low zener impedance and maximum power dissipation of 400 mW are ideally suited for stabilized
power supply, etc.
• Wide voltage r ange from 5.2 V throug h 38 V of zener voltage pro vide fl exi bl e a ppl i cat ion .
Ordering Information
Part No. Cathode Band Package Name Package Code
HZ-L Series Navy blue DO-35 GRZZ0002ZB-A
Pin Arrangement
1. Cathode
2. Anode
7
B 2
Cathode band
Part No.
12
Body color is orange
HZ-L Series
REJ03G0182-0300 Rev.3.00 Nov 06, 200 7
Page 2 of 5
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Value Unit
Power dissipation Pd 400 mW
Junction temperature Tj 175 °C
Storage temperature Tstg −55 to +175 °C
Electrical Characteristics
(Ta = 25°C)
Zener Voltage Reverse Current Dynamic Resistance
VZ (V) *1 Test
Condition IR (μA) Test
Condition rd (Ω) Test
Condition
Part No. Min Max IZ (mA) Max VR (V) Max IZ (mA)
HZ6A1L 5.2 5.5
HZ6A2L 5.3 5.6
HZ6A3L 5.4 5.7
0.5 1 2.0 150 0.5
HZ6B1L 5.5 5.8
HZ6B2L 5.6 5.9
HZ6B3L 5.7 6.0
0.5 1 2.0 80 0.5
HZ6C1L 5.8 6.1
HZ6C2L 6.0 6.3
HZ6C3L 6.1 6.4
0.5 1 2.0 60 0.5
HZ7A1L 6.3 6.6
HZ7A2L 6.4 6.7
HZ7A3L 6.6 6.9
HZ7B1L 6.7 7.0
HZ7B2L 6.9 7.2
HZ7B3L 7.0 7.3
HZ7C1L 7.2 7.6
HZ7C2L 7.3 7.7
HZ7C3L 7.5 7.9
0.5 1 3.5 60 0.5
HZ9A1L 7.7 8.1
HZ9A2L 7.9 8.3
HZ9A3L 8.1 8.5
HZ9B1L 8.3 8.7
HZ9B2L 8.5 8.9
HZ9B3L 8.7 9.1
HZ9C1L 8.9 9.3
HZ9C2L 9.1 9.5
HZ9C3L 9.3 9.7
0.5 1 6.0 60 0.5
HZ11A1L 9.5 9.9
HZ11A2L 9.7 10.1
HZ11A3L 9.9 10.3
HZ11B1L 10.2 10.6
HZ11B2L 10.4 10.8
HZ11B3L 10.7 11.1
HZ11C1L 10.9 11.3
HZ11C2L 11.1 11.6
HZ11C3L 11.4 11.9
0.5 1 8.0 80 0.5
Note: 1. Tested with DC.
HZ-L Series
REJ03G0182-0300 Rev.3.00 Nov 06, 200 7
Page 3 of 5
(Ta = 25°C)
Zener Voltage Reverse Current Dynamic Resistance
VZ (V) *1 Test
Condition IR (μA) Test
Condition rd (Ω) Test
Condition
Part No. Min Max IZ (mA) Max VR (V) Max IZ (mA)
HZ12A1L 11.6 12.1
HZ12A2L 11.9 12.4
HZ12A3L 12.2 12.7
HZ12B1L 12.4 12.9
HZ12B2L 12.6 13.1
HZ12B3L 12.9 13.4
HZ12C1L 13.2 13.7
HZ12C2L 13.5 14.0
HZ12C3L 13.8 14.3
0.5 1 10.5 80 0.5
HZ15-1L 14.1 14.7
HZ15-2L 14.5 15.1
HZ15-3L 14.9 15.5
0.5 1 13.0 80 0.5
HZ16-1L 15.3 15.9
HZ16-2L 15.7 16.5
HZ16-3L 16.3 17.1
0.5 1 14.0 80 0.5
HZ18-1L 16.9 17.7
HZ18-2L 17.5 18.3
HZ18-3L 18.1 19.0
0.5 1 15.0 80 0.5
HZ20-1L 18.8 19.7
HZ20-2L 19.5 20.4
HZ20-3L 20.2 21.1
0.5 1 18.0 100 0.5
HZ22-1L 20.9 21.9
HZ22-2L 21.6 22.6
HZ22-3L 22.3 23.3
0.5 1 20.0 100 0.5
HZ24-1L 22.9 24.0
HZ24-2L 23.6 24.7
HZ24-3L 24.3 25.5
0.5 1 22.0 120 0.5
HZ27-1L 25.2 26.6
HZ27-2L 26.2 27.6
HZ27-3L 27.2 28.6
0.5 1 24.0 150 0.5
HZ30-1L 28.2 29.6
HZ30-2L 29.2 30.6
HZ30-3L 30.2 31.6
0.5 1 27.0 200 0.5
HZ33-1L 31.2 32.6
HZ33-2L 32.2 33.6
HZ33-3L 33.2 34.6
0.5 1 30.0 250 0.5
HZ36-1L 34.2 35.7
HZ36-2L 35.3 36.8
HZ36-3L 36.4 38.0
0.5 1 33.0 300 0.5
Note: 1. Tested with DC.
HZ-L Series
REJ03G0182-0300 Rev.3.00 Nov 06, 200 7
Page 4 of 5
Main Characteristic
5 101520253035400
HZ6B2L
HZ16-2L
HZ9B2L
HZ12B2L
HZ20-1L
HZ24-2L
HZ30-2L
HZ36-2L
0 5 10 15 20 25 30 35 40
%/°C
mV/°C
500
400
300
200
100
20015010050
00
2.5 mm
3 mm
Printed circuit board
100 180 1.6t mm
Material: paper phenol
××
l
l = 10 mm
l = 5 mm
Zener Current I
Z
(A)
10−
5
10−
6
10−
4
10−
3
10−
2
10−
7
10−
8
Fig.1 Zener current vs. Zener voltage
Zener Voltage V
Z
(V)
Power Dissipation Pd (mW)
l = 20 mm
(Publication value)
0.10
0.08
0.06
0.04
0.02
−0.02
−0.04
−0.06
−0.08
−0.10
Zener Voltage Temperature Coefficient γ
Z
(%/°C)
0
Fig.2 Temperature Coefficient vs. Zener voltage
Zener Voltage V
Z
(V)
50
40
30
20
10
0
−10
−20
−30
−40
−50
Zener Voltage Temperature Coefficient γ
Z
(mV/°C)
Fig.3 Power Dissipation vs. Ambient Temperature
Ambient Temperature Ta (°C)
HZ-L Series
REJ03G0182-0300 Rev.3.00 Nov 06, 200 7
Page 5 of 5
Package Dimensions
LEL
Min Nom Max
φb- 0.5
φD-2.0
E--4.2
L26.0 - -
-
-
φbφD
Dimension in Millimeters
Reference
Symbol
SC-40 0.13g
MASS[Typ.]
DO-35 / DO-35VGRZZ0002ZB-A
RENESAS CodeJEITA Package Code Previous Code
Package Name
DO-35
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
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or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
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undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
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Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
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http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2
