GO2952
CWDM SINGLE OPTICAL TRANSMITTER MODULE (NON-MSA)
Datasheet name: GO2952_doc2.pdf
Contact information: info@embrionix.com
www.embrionix.com
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GO2952 CWDM Single Optical Transmitter
Data Sheet
57268 - 2 April 2012
GO2952 CWDM Single Optical Transmitter
www.gennum.com
Features
Robust error free transmission of signals from 50Mbps
to 3Gbps
Up to 50km reach in a 3Gbps CWDM installation
Available wavelengths: 1270nm ~ 1610nm, 20nm
spacing
Supports video pathological patterns for SD-SDI,
HD-SDI and 3G-SDI
Hot-pluggable
•Laser disable pin
Digital diagnostics and control via I2C interface
including:
Monitoring laser bias current, average output
power, supply voltage and temperature
Alarm reporting with self shut down when
transmitter is at fault
Module ID polling
Single +3.3V power supply
Low power consumption — typically 405mW
RoHS compliant
Operating temperature range: 0°C to 70°C
56.5mm x 13.4mm x 8.6mm SFP Package
SMPTE 297-2006 compatible
Applications
SMPTE 297-2006 compatible electrical-to-optical
interfaces
Uncompressed video transport systems
Description
The GO2952 is a single channel CWDM optical transmitter
module designed to transmit optical serial digital signals as
defined in SMPTE 297-2006. The GO2952 is specifically
designed for robust performance in the presence of SDI
pathological patterns for SMPTE 259M, SMPTE 344M,
SMPTE 292M and SMPTE 424M serial rates.
The GO2952 contains a DFB laser transmitter designed to
provide error-free transmission of signals from 50Mbps to
3Gbps. The GO2952 is hot-pluggable with typical power
consumption of 405mW using a single power supply of
+3.3V.
The GO2952 provides extensive operational status
monitoring through an I2C interface. Optical power, bias
current, supply voltage and operating temperature are
monitored. If a parameter monitored is outside the
pre-defined range, the alarm flag associated with the
parameter will be raised.
Ordering Information
Part Number Package Wavelength Temp. Range
GO2952-27CH SFP 1271nm 0°C to 70°C
GO2952-29CH SFP 1291nm 0°C to 70°C
GO2952-31CH SFP 1311nm 0°C to 70°C
GO2952-33CH SFP 1331nm 0°C to 70°C
GO2952-35CH SFP 1351nm 0°C to 70°C
GO2952-37CH SFP 1371nm 0°C to 70°C
GO2952-39CH SFP 1391nm 0°C to 70°C
GO2952-41CH SFP 1411nm 0°C to 70°C
GO2952-43CH SFP 1431nm 0°C to 70°C
GO2952-45CH SFP 1451nm 0°C to 70°C
GO2952-47CH SFP 1471nm 0°C to 70°C
GO2952-49CH SFP 1491nm 0°C to 70°C
GO2952-51CH SFP 1511nm 0°C to 70°C
GO2952-53CH SFP 1531nm 0°C to 70°C
GO2952-55CH SFP 1551nm 0°C to 70°C
GO2952-57CH SFP 1571nm 0°C to 70°C
GO2952-59CH SFP 1591nm 0°C to 70°C
GO2952-61CH SFP 1611nm 0°C to 70°C
GO2952 CWDM Single Optical Transmitter
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Revision History
Contents
Features................................................................................................................................................................. 1
Description...........................................................................................................................................................1
Ordering Information .......................................................................................................................................1
Revision History .................................................................................................................................................2
1. Functional Block Diagram..........................................................................................................................3
2. Pin Specifications ..........................................................................................................................................4
2.1 Pin Configuration .............................................................................................................................4
2.2 Pin Descriptions ................................................................................................................................4
2.3 Host Board Power Supply Requirements .................................................................................5
2.4 Optical Connector Requirements ................................................................................................6
3. Product Specifications .................................................................................................................................7
3.1 Absolute Maximum Ratings ..........................................................................................................7
3.2 Optical Performance Specifications ...........................................................................................7
3.3 DC Electrical Specifications ..........................................................................................................9
3.4 AC Electrical Specifications ..........................................................................................................9
3.5 Supporting Circuit Specifications ............................................................................................ 10
3.5.1 In-Rush Current Control Circuit ................................................................................... 10
3.5.2 Digital Diagnosis ................................................................................................................ 10
4. Application Reference Design ............................................................................................................... 17
4.1 Typical Application Circuit ........................................................................................................ 17
5. References and Relevant Standards .................................................................................................... 18
6. Package Information ................................................................................................................................. 19
6.1 Package Dimensions ..................................................................................................................... 19
6.2 Marking Information .................................................................................................................... 20
6.3 PCB Layout Recommendations .................................................................................................21
Version ECR Date Changes and/or Modifications
0 157039 October 2011 New document.
1 157263 November 2011 Updated Table 3-6.
2 157987 April 2012 Updated extinction ratio in Table 3-2.
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1. Functional Block Diagram
Figure 1-1: GO2952 Functional Block Diagram
I2C Bus Digital
Diagnostics
Laser
Driver
Tx_Disable
Tx provision and
analog maintenance
TOSA
Laser + PINmon
Feedback
1270 nm
to 1610nm
Differential Electrical
Input
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2. Pin Specifications
2.1 Pin Configuration
Figure 2-1: Pin Configuration for GO2952
2.2 Pin Descriptions
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Towards
Bezel
Towards
ASIC
VEE
NC
NC
I2C CLK
VEE
I2C DATA
VEE
NC
NC
NC
TX_DIS
TD-
TD+
VEE
NC
VEE
NC
NC
NC
VCC_TX
Table 2-1: Pin Descriptions
Number Name Typ e Description
1 VEE Ground Ground connection. Connect to GND.
2 NC No Connect No Connection
3 NC No Connect No Connection
4 VEE Ground Ground connection. Connect to GND.
5I2C CLK Digital (Input) I2C Clock
6I2C DATA Digital
(Bi-Directional)
I2C Data
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2.3 Host Board Power Supply Requirements
The host board is required to provide a regulated and filtered power supply of 3.3V +/-
5% for the GO2952 via the on board SFP connector. The host board is required to filter
the VCC_TX power supply as recommended by the SFP MSA. Figure 2-2 shows the
recommended board supply filtering. When the host board is loaded with a resistive
load in place of the SFP module and sourcing the maximum rated current, the
peak-to-peak power supply noise measured on the SFP connector should comply to
Table 2-2.
Figure 2-2: Recommended Host Board Supply Filtering
7 VEE Ground Ground connection. Connect to GND.
8 NC No Connect No Connection
9 NC No Connect No Connection
10 NC No Connect No Connection
11 VEE Ground Ground connection. Connect to GND.
12 NC No Connect No Connection
13 NC No Connect No Connection
14 NC No Connect No Connection
15 NC No Connect No Connection
16 VCC_TX Power Transmitter Power Supply
17 VEE Ground Ground connection. Connect to GND.
18 TD+ Input Positive Differential Input
19 TD- Input Negative Differential Input
20 TX_DIS Digital (Input) Transmitter Disable. The bias current and
modulation current are turned off if
TX1_Dis = HIGH. Internal 4.7kΩ pull-up.
Table 2-1: Pin Descriptions (Continued)
Number Name Typ e Description
V
CC_Tx
GO2952
0.1µF10µF0.1µF10µF
1µH
Host Board
3.3V
GO2952 CWDM Single Optical Transmitter
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2.4 Optical Connector Requirements
An LC connector with PC/UPC polish is required for each port.
Table 2-2: Host Board Power Supply Noise Requirement at VCCR
Frequency (MHz) Peak-to-Peak Noise Amplitude (%)
DC-1 2
1-10 3
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3. Product Specifications
3.1 Absolute Maximum Ratings
Table 3-1 lists the absolute maximum ratings for the GO2952. Conditions exceeding the
limits listed may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those listed in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
3.2 Optical Performance Specifications
Table 3-2 lists the optical performance specifications for the GO2952.
Table 3-1: Absolute Maximum Ratings
Parameter Conditions Value/Units
Supply Voltage 4V
Operating Case Temperature -20°C < TCASE < 80°C
Storage Temperature -40°C < TSTG < 100°C
ESD tolerance on all pins 1kV HBM
Relative Humidity
(non-condensing)
5% - 95% RH
Table 3-2: Optical Performance Specifications
All specifications apply for TCASE = 0ºC to 70ºC and VCC = 3.3V ± 5% unless otherwise noted.
Parameter Symbol Condition Min Ty p Max Units Notes
System
Wavelength λ X-6.5 X X+6.5 nm 1
Spectral Line Width 0.2 1.0 nm
Average Optical Output
Power
POUT 0 +2.5 +5.0 dBm
Extinction Ratio ER 8 dB
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Optical Signal Intrinsic Jitter Measured with PRBS
223-1 and colour bar
test signal at
2.97Gbps, 1.485Gbps,
270Mbps
–4060ps2
SMPTE 424M
2.97Gbps
Pathological
–5090ps2
SMPTE 292M
1.485Gbps
Pathological
60 120 ps 2
SMPTE 259M
270Mbps
Pathological
110 200 ps 2
Optical Signal Rise Time
(20% to 80%)
trSMPTE 424M
2.97Gbps
130 180 ps 2
SMPTE 292M
1.485Gbps
175 270 ps 2
SMPTE 259M
270Mbps
300 800 ps 2
Optical Signal Fall Time
(20% to 80%)
tfSMPTE 424M
2.97Gbps
130 180 ps 2
SMPTE 292M
1.485Gbps
175 270 ps 2
SMPTE 259M
270Mbps
300 800 ps 2
NOTES:
1. X = Centre Wavelength: 1271, 1291, 1311, 1331, 1351, 1371, 1391, 1411, 1431, 1451, 1471, 1491, 1511, 1531, 1551, 1571, 1591 &
1611nm
2. Measured following a fourth-order Bessel-Thompson filter with a bandwidth of 0.75 x clock frequency corresponding to the serial data rate.
Table 3-2: Optical Performance Specifications (Continued)
All specifications apply for TCASE = 0ºC to 70ºC and VCC = 3.3V ± 5% unless otherwise noted.
Parameter Symbol Condition Min Ty p Max Units Notes
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3.3 DC Electrical Specifications
Table 3-3 lists the DC electrical specifications for the GO2952.
3.4 AC Electrical Specifications
Table 3-4 lists the AC electrical specifications for the GO2952.
Table 3-3: DC Electrical Specifications
Parameter Symbol Condition Min Ty p Max Units Notes
System
Operating Temperature
Range
TCASE –070°C1
Power Supply Voltage VCC 3.13 3.3 3.47 V 1
Total Power Consumption 405 550 mW 2
Input Data Amplitude 0.2 1.2 Vpp 3
Laser
Laser Bias Current
Monitoring Accuracy
––-1+1dB2
Laser Power Monitoring
Accuracy
––-1+1dB2
NOTES
1. Outside the specified range, performance is not guaranteed.
2. Specifications apply at the beginning of life.
3. AC-coupled 50Ω single-ended termination.
Table 3-4: AC Electrical Specifications
Parameter Symbol Condition Min Max Units
Bit Rate BR 50 3000 Mbps
Tx_Disable Assert Time t_off Time from rising edge of TX_DIS to when the
optical output falls below 10% of nominal
–10μs
Tx_Disable Negate Time t_on Time from falling edge of TX_DIS to when the
modulated optical output rises above 90% of
nominal
–1ms
Time to Initialize t_init From power on 300 ms
Serial ID Clock Rate f_serial_clock 400 kHz
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3.5 Supporting Circuit Specifications
3.5.1 In-Rush Current Control Circuit
Due to the hot-pluggable requirement, the GO2952 has built-in circuits to limit the
in-rush current upon hot insertion. The specifications of the in-rush limiting circuits are
summarized in Table 3-5.
3.5.2 Digital Diagnosis
3.5.2.1 I2C Bus Interface
The I2C bus interface uses the 2-wire serial CMOS E2PROM protocol. The serial interface
meets the following specifications:
1. Support a maximum clock rate of 400kHz.
2. Input/Output levels comply with LVCMOS/LVTTL or compatible logics.
Low: 0 – 0.8V
High: 2.0 – 3.3V
Undefined: 0.8 – 2.0V
3.5.2.2 Serial Interface Memory Map
Module identification and diagnostic information is accessible through the address map
shown in Table 3-6.
Table 3-5: In-rush Current Limiting Circuits Specifications
Parameter Value
Max. In-rush current ramp rate 50mA/ms
Max. In-rush current 30mA over steady state
Table 3-6: Serial Interface Memory Map
Address Size Name Description and Value of the Field
Base ID Fields
(Block Address: A0h)
0 1 Identifier Type of serial transceiver. 83h
1 1 Ext. Identifier Extended identifier of type of serial
transceiver. 04h
2 1 Connector Code for connector type. 07h for LC
connectors.
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3 1 Standards
Compliance
41h, for SMPTE259M/344M/292M/424M and
SMPTE 297.
4-10 8 Transceiver Code Code for electronic compatibility or optical
compatibility. Not applicable for GO2952.
11 1 Encoding Code for serial encoding algorithm. Value:
03H for NRZ.
12 1 BR, Nominal Nominal bit rate, units of 100 Mbps, 1Eh for
3Gbps,
13 1 Reserved Xxh
14 1 Length(9mm) -
km
Link length supported for standard SMF,
units of km, 32h for 50km.
15 1 Length(9mm) Link length supported for standard SMF,
units of 100 m, 00h
16 1 Length (50mm) Link length supported for 50/125 mm fiber,
units of 10 m. 00h
17 1 Length (62.5mm) Link length supported for 62.5/125 mm
fiber, units of 10 m. 00h
18 1 Length (Copper) Link length supported for copper, units of
meters. 00h
19 1 Reserved Xxh
20-35 16 Vendor name SFP with OM transceiver vendor name
(ASCII). G E N N U M
20 1 G 47h
21 1 E 45h
22 1 N 4Eh
23 1 N 4Eh
24 1 U 55h
25 1 M 4Dh
26-35 10 20h for each byte
36 1 Reserved
37-39 3 Vendor OUI SFP with OM transceiver vendor IEEE
company ID. 00 00 00h
40-55 16 Vendor PN Part number provided by SFP with OM
transceiver vendor. G O 2 9 5 2.
40 1 G 47h
41 1 O 4Fh
42 1 2 32h
43 1 9 39h
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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44 1 5 35h
45 1 2 32h
46 1 X Model dependent.
47 1 X Model dependent.
48 1 C 43h
49 1 H 48h
50-55 6 20h for each byte.
56-58 3 Reserved
59 1 Vendor Rev Revision level for part number provided by
vendor.
60 1 Wavelength1 XX for the middle two digits of the
wavelength.
61-62 2 Reserved
63 1 CC_BASE Check code for Base ID Fields (The value of
the lower 8 bits of the sum of the contents
from address 0 to 62).
Extended ID Fields
(Block Address: A0h)
64-65 2 Options Indicates which optional SFP with OM
signals are implemented.
64 1 Xxh
65 1 x001100xh
66 1 BR, max Upper bit rate margin, units of %, 5h.
67 1 BR, min Lower bit rate margin, units of %, 5Fh.
68-83 16 Vendor SN Serial number provided by vendor (ASCII)
84-85 2 Year Manufacturing date code (ASCII).
86-87 2 Month Manufacturing date code (ASCII).
88-89 2 Day Manufacturing date code (ASCII).
90-91 2 Blank
92 1 Calibration flag 20h for calibrated average output power
93 1 E0h, Enhanced alarm/warning flags.
94 1 Reserved Xxh
95 1 CC_EXT Check code for the Extended ID Fields (The
value of the lower 8 bits of the sum of the
contents from address 64 to 94)
96-127 32 Reserved –
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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Alarm Flags and OM Output Calibration ID Fields
(Block Address: A2h)
0-1 2 Temp High Alarm MSB at lower address. 70°C ambient
2-3 2 Temp Low Alarm MSB at lower address. 0°C ambient
4-5 2 Temp High
Warning
MSB at lower address. 65°C ambient
6-7 2 Temp Low
Warning
MSB at lower address. 5°C ambient
8-9 2 Supply Voltage
High Alarm
MSB at lower address. 3.6V
10-11 2 Supply Voltage
Low Alarm
MSB at lower address. 3.0V
12-13 2 Supply Voltage
High Warning
MSB at lower address. 3.47V
14-15 2 Supply Voltage
Low Warning
MSB at lower address. 3.14V
16-17 2 Laser Bias High
Alarm
MSB at lower address. 100mA.
18-19 2 Laser Bias Low
Alarm
MSB at lower address. 5mA.
20-21 2 Laser Bias High
Warning
MSB at lower address. 90mA.
22-23 2 Laser Bias Low
Warning
MSB at lower address. 10mA
24-25 2 Tx Power High
Alarm
MSB at lower address. 5.5dBm
26-27 2 Tx Power Low
Alarm
MSB at lower address. -0.5dBm
28-29 2 Tx Power High
Warning
MSB at lower address. 5dBm
30-31 2 Tx Power Low
Warning
MSB at lower address. 0dBm
32-94 64 Reserved.
95 1 CC_EXT Byte 95 contains the low order 8 bits of the
check sum of byte 0 -94
96 1 Temperature
MSB
Internally measured module temperature
97 1 Temperature LSB Internally measured module temperature
98 1 VCC MSB Internally measured module supply voltage
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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99 1 VCC LSB Internally measured module supply voltage
100 1 Laser Bias MSB Internally measured laser bias current.
7530h corresponds to 60mA. All other
readings should be scaled linearly using this
factor.
101 1 Laser Bias LSB Internally measured laser bias current.
7530h corresponds to 60mA. All other
readings should be scaled linearly using this
factor.
102 1 Tx Power MSB Internally measured Tx Power.
103 1 Tx Power LSB Internally measured Tx Power.
104-109 11 Reserved
110 1 N/A Bit 7
N/A Bit 6
Reserved Bit 5
N/A Bit 4
N/A Bit 3
Tx Fault Bit 2
N/A Bit 1
Data_Ready Bit 0
111 1 Conversion
Update
Temp Update Bit 7 goes to high after a temperature
update
VCC Update Bit 6 goes to high after a VCC update
Mon1 Update Bit 5 goes to high after a Tx bias current
update
Mon2 Update Bit 4 goes to high after a Tx power update
Mon3 Update Bit 3 goes to high after a Tx modulation
current update.
Reserved Bit 0 to Bit 2.
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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112 1 Temp High Alarm
Flag
Bit 7, set when the internal temperature
exceeds the high temp alarm threshold.
Temp Low Alarm
Flag
Bit 6, set when the internal temperature
goes below the low temp alarm threshold.
Supply Voltage
High Alarm Flag
Bit 5, set when the internal VCC exceeds the
supply voltage high alarm threshold.
Supply Voltage
Low Alarm Flag
Bit 4, set when the internal VCC goes below
the supply voltage low alarm threshold.
Laser Bias High
Alarm Flag
Bit 3, set when the monitored laser bias
current exceeds the laser bias high alarm
threshold.
Laser Bias Low
Alarm Flag
Bit 2, set when monitored laser bias current
goes below the laser bias low alarm
threshold.
Tx Power High
Alarm Flag
Bit 1, set when the monitored Tx power
exceeds the Tx power high alarm threshold.
Tx Power Low
Alarm Flag
Bit 0, set when monitored Tx power current
goes below the Tx power low alarm
threshold.
113 1 Mod Current
High Alarm Flag
Bit 7, set when the monitored laser
modulation current exceeds the laser bias
high alarm threshold.
Mod Current
Low Alarm Flat
Bit 6, set when monitored laser bias current
goes below the laser modulation low alarm
threshold.
Reserved Bit 0 - 5.
114-115 2 Reserved
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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116 1 Temp High
Warning Flag
Bit 7, set when the internal temperature
exceeds the high temp warning threshold.
Temp Low
Warning Flag
Bit 6, set when the internal temperature
goes below the low temp warning
threshold.
Supply Voltage
High Warning
Flag
Bit 5, set when the internal VCC exceeds the
supply voltage high warning threshold.
Supply Voltage
Low Warning
Flag
Bit 4, set when the internal VCC goes below
the supply voltage low warning threshold.
Laser Bias High
Warning Flag
Bit 3, set when the monitored laser bias
current exceeds the laser bias high warning
threshold.
Laser Bias Low
Warning Flag
Bit 2, set when monitored laser bias current
goes below the laser bias low warning
threshold.
Tx Power High
Warning Flag
Bit 1, set when the monitored Tx power
exceeds the Tx power high warning
threshold.
Tx Power Low
Warning Flag
Bit 0, set when monitored Tx power current
goes below the Tx power low warning
threshold.
117 1 Mod Current
High Warning
Flag
Bit 7, set when the monitored laser
modulation current exceeds the laser bias
high alarm threshold.
Mod Current
Low Warning
Flag
Bit 6, set when monitored laser bias current
goes below the laser modulation low alarm
threshold.
Reserved Bit 0 - 5
118-119 2 Reserved
Vendor Specific ID Fields
120-127 8 Vendor Specific
128-247 8 Vendor
Writeable Area
248-288 41 Vendor Specific
Table 3-6: Serial Interface Memory Map (Continued)
Address Size Name Description and Value of the Field
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4. Application Reference Design
4.1 Typical Application Circuit
Figure 4-1 shows a typical application circuit for the GO2952.
Figure 4-1: Typical Application Circuit
10k
VCC_3V3 Differential
VCC_3V3
TD1+
TD1-
VEE
1
NC
2
NC
3
VEE
4
I
2
C CLK
5
I
2
C DATA
6
VEE
7
NC
8
NC
9
NC
10 VEE 11
NC 12
NC 13
NC 14
NC 15
VCC_TX 16
VEE 17
TD+ 18
TD- 19
TX_DIS 20
GO2952
I
2
C CLK
I
2
C DATA
10k
TX1_DIS
From GS2965 Reclocker
10
μ
F
1
μ
H
VCC_3V3
100nF
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5. References and Relevant Standards
Table 5-1: References and Relevant Standards
INF-8074i Rev 1.0 SFP (Small Formfactor Pluggable) Transceiver
SMPTE 259M-2008 SDTV Digital Signal/Data – Serial Digital Interface
SMPTE 292M-2008 1.5 Gb/s Signal / Data Serial Interface
SMPTE 297-2006 Serial Digital Fiber Transmission System for SMPTE 259M, SMPTE 344M, SMPTE 292 and SMPTE
424M Signals
SMPTE 344M-2000 540 Mb/s Serial Digital Interface
SMPTE 424M-2006 3 Gb/s Signal/Data Serial Interface
ITU-T G.694.2 Spectral grids for WDM applications: CWDM wavelength grid
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6. Package Information
6.1 Package Dimensions
A common mechanical outline, as shown in Figure 6-1, is used for all SFP modules.
Since the GO2952 is a single channel device, the receptacle for channel 2 is plugged with
a plastic insert.
Figure 6-1: Common SFP Package Outline
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6.2 Marking Information
Figure 6-2 illustrates the markings on the GO2952. Table 6-1 provides a description of
the parameters in the marking diagram.
Figure 6-2: GO2952 Marking Diagram
Table 6-1: Marking Information
Parameter Description
XX 2-digit wavelength code. See Ordering Information.
ZZZZZZZZZ 9-digit serial number.
UUUU Channel wavelength in nanometers.
YYYY Year of manufacture.
WW Week of manufacture.
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6.3 PCB Layout Recommendations
Figure 6-3: Host PCB Layout – Part 1
Notes:
1. Datum and basic dimensions
established by customer
2. Pads and vias are chassis-ground
in 11 places
3. Through-holes and plating are optional
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Figure 6-4: Host PCB Layout – Part 2
CANADA
Suite 320, 3553 31st St. N.W.
Calgary, Alberta T2L 2K7
Canada
Phone: +1 (403) 284-2672
Fax: +1 (905) 632-2055
415 Legget Drive, Suite 200
Kanata, Ontario K2K 2B2
Canada
Phone: +1 (613) 270-0458
Fax: +1 (613) 270-0429
GERMANY
Gennum Canada Limited
Niederlassung Deutschland
München, Germany
Phone: +49 89 309040 290
Fax: +49 89 309040 293
E-mail: gennum-germany@gennum.com
INDIA
#208(A), Nirmala Plaza,
Airport Road, Forest Park Square
Bhubaneswar 751009
India
Phone: +91 (674) 65304815
Fax: +91 (674) 259-5733
JAPAN KK
Shinjuku Green Tower Building 27F
6-14-1, Nishi Shinjuku
Shinjuku-ku, Tokyo, 160-0023
Japan
Phone: +81 (03) 3349-5501
Fax: +81 (03) 3349-5505
E-mail: gennum-japan@gennum.com
Web Site: http://www.gennum.co.jp
MEXICO
Venustiano Carranza 122 Int. 1
Centro, Aguascalientes
Mexico CP 20000
Phone: +1 (416) 848-0328
NORTH AMERICA WESTERN REGION
691 South Milpitas Blvd., Suite #200
Milpitas, CA 95035
United States
Phone: +1 (408) 934-1301
Fax: +1 (408) 934-1029
E-mail: naw_sales@gennum.com
NORTH AMERICA EASTERN REGION
4281 Harvester Road
Burlington, Ontario L7L 5M4
Canada
Phone: +1 (905) 632-2996
Fax: +1 (905) 632-2055
E-mail: nae_sales@gennum.com
TAI WA N
6F-4, No.51, Sec.2, Keelung Rd.
Sinyi District, Taipei City 11052
Taiwan R.O.C.
Phone: (886) 2-8732-8879
Fax: (886) 2-8732-8870
E-mail: gennum-taiwan@gennum.com
UNITED KINGDOM
South Building, Walden Court
Parsonage Lane,
Bishop’s Stortford Hertfordshire, CM23 5DB
United Kingdom
Phone: +44 1279 714170
Fax: +44 1279 714171
2, West Point Court, Great Park Road
Bradley Stoke, Bristol BS32 4PY
Great Britain
Phone: +44 1454 462200
Fax: +44 1454 462201
SNOWBUSH IP - A DIVISION OF GENNUM
439 University Ave. Suite 1700
Toronto, Ontario M5G 1Y8
Canada
Phone: +1 (416) 925-5643
Fax: +1 (416) 925-0581
E-mail: sales@snowbush.com
Web Site: http://www.snowbush.com
DOCUMENT IDENTIFICATION
APPLICATION NOTE
Information relating to this product and the application or design described
herein is believed to be reliable, however such information is provided as a
guide only and Gennum assumes no liability for any errors in this document, or
for the application or design described herein. Gennum reserves the right to
make changes to the product or this document at any time without notice.
GO2952 CWDM Single Optical Transmitter
Data Sheet
57268 - 2 April 2012
23 of 23
23
Proprietary & Confidential
Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of
the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent
infringement.
All other trademarks mentioned are the properties of their respective owners.
GENNUM and the Gennum logo are registered trademarks of Gennum Corporation.
© Copyright 2011 Gennum Corporation. All rights reserved.
www.gennum.com
GENNUM CORPORATE HEADQUARTERS
4281 Harvester Road, Burlington, Ontario L7L 5M4 Canada
Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055
E-mail: corporate@gennum.com www.gennum.com
CAUTION
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A
STATIC-FREE WORKSTATION
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