L15ESDxVE2
GENERAL DESCRIPTION
The L15ESDxVE2 is designed to protect sensitive semiconductor
components from damage or upset due to Electro Static Discharge
(ESD).
FEATURES
Uni-directional ESD Protectionof one line.
Max. peak pulse power : Ppp = 150W at tp = 8/20 us.
ESD protection>25KV per MIL-STD-883C,Method 3015-6;Class 3.
IEC 61000-4-2, level 4 (ESD), > ± 15KV (air);> ± 8KV (contact).
APPLICATION
Computers and peripherals
Communication system
Audio & video equipment
High-speed data lines
Parallel ports
MECHANICAL DATA
Case Material: "Green" molding compound UL flammability
classification 94V-0 (No Br.Sb, Cl)
Terminals: Lead Free Plating (Matte Tin Finish)
Component in accordance to RoHs 2002/95/EC
Dimension = DFN, 1.0mm (L) * 0.6mm (W)
ESD PROTECTION DIODE
STAND-OFF VOLTAGE -
12~24
Volts
POWER DISSIPATION -
150
WATTS
SEMICONDUCTOR
LITE-ON
REV. 8, May-2012, KSIR29
MAXIMUM RATINGS
(Tj= 25 unless otherwise noticed)
℃
℃℃
℃
Rating Symbol Value Unit
Peak pulse Power ( 8/20us Waveform ) P
PPM
150 (Max) W
Peak Pulse Current ( 8/20us Waveform ) I
PP
6 A
Operating Junction Temperature Range T
J
-55 to + 125
℃
℃℃
℃
Storage Temperature Range Tstg -55 to + 150
℃
℃℃
℃
Soldering Temperature, t max = 10s T
L
260
℃
℃℃
℃
SOD-882
1 Cathode
2 Anode
PIN ASSIGNMENT
1
2
All Dimensions in millimeter
SOD-882
DIM. MIN. MAX.
A
b
D
E
L
A1
0.47 0.53
0.05
0.00
0.25 0.55
1.075
0.95
0.55 0.675
0.20 0.45
ELECTRICAL CHARACTERISTICS
(Tj= 25
℃
unless otherwise noticed)
L15ESD12VE2
L15ESD24VE2
RATING AND CHARACTERISTIC CURVES
L15ESDxVE2
Parameter Symbol Conditions MIn Typ Max Unit
Reverse standoff voltage V
RWM
--- --- --- 12 V
Reverse leakage current I
RM
V
DRM
= 12 V --- --- 50 nA
Breakdown voltage V
BR
I
R
= 1 mA 14.2 --- 15.8 V
Clamping voltage V
CL
I
PP
= 6A, tp= 8/20us --- --- 25 V
Junction capacitance CJ VR = 0 V , f = 1MHz --- 45 75 pF
Parameter Symbol Conditions MIn Typ Max Unit
Reverse standoff voltage V
RWM
--- --- --- 24 V
Reverse leakage current I
RM
V
DRM
= 24 V --- --- 50 nA
Breakdown voltage V
BR
I
R
= 1 mA 26.5 --- 29.5 V
Clamping voltage V
CL
I
PP
= 3A, tp= 8/20us --- --- 50 V
Junction capacitance CJ VR = 0 V , f = 1MHz --- 25 50 pF
0
10
20
30
40
50
60
0 1 2 3 4 5
0.1
1.0
10.0
100.0
1000.0
0 25 50 75 100 125 150
0
40
80
120
0 10 20 30 40
Time (us)
Figure 1. 8/20 us pulse waveform according to IEC 61000-4-5
Percent of Peak Pulse Current
(%)
Figure 2. ESD pulse waveform according to IEC 61000-4-2
Time (ns)
10%
90%
100%
50% Ipp: 20us
100% Ipp: 8us
e
-1
30 ns
60 ns
tr = 0.7 ~1 ns
Percent of Peak Pulse Current
%
RATING AND CHARACTERISTIC CURVES
L15ESDxVE2
Figure 5. Typical Junction Capactiance Figure 6. Reverse Leakage Current versus T
J
Junction Temperature ( )
℃
Capacitance (pF)
Reverse Voltage (V)
IR / IR (25 )
℃
T
J
=25 , f=1MHz, Vosc=100mV
℃
Figure 3. Power Dissipation versus Pulse Time
10
100
1000
10000
1 10 100 1000
Pulse Time (us)
T
J
=25 , tp (us) = 8/20 us
℃
exponentially decay waveform
Peak pulse Power
(W)
0
0.4
0.8
1.2
0 25 50 75 100 125
Ppp / Ppp (25 )
℃
Figure 4. Peak pulse power versus T
J
Junction Temperature ( )
℃
12V
24V
RATING AND CHARACTERISTIC CURVES
L15ESDxVE2
Figure 8. Clamped +8 kV ESD voltage waveform
+/-8KV
ESD Contact
discharge V (i/o)
I/O1
Figure 7. ESD Test Configuration
Figure 9. Clamped -8 kV ESD voltage waveform
V (i/o)
V (i/o)
L15ESD12VE2
L15ESD24VE2
Figure 10. Clamped +8 kV ESD voltage waveform Figure 11. Clamped -8 kV ESD voltage waveform
V (i/o)
V (i/o)
Q'TY/REEL
(PCS)
REEL DIA.
(INCH)
Q'TY/BOX
(PCS)
Q'TY/CARTON
(PCS)
10K 7 150K 300K
DEVICE
L15ESD12VE2
L15ESD24VE2
SOD-882 Soldering Pad Layout
Packaging Information
Marking & Orientation
RATING AND CHARACTERISTIC CURVES
L15ESDxVE2
Marking & Orientation
XX
Marking: L15ESD12VE2, XX:MC
L15ESD24VE2, XX:MO
Legal Disclaimer Notice
L15ESDxVE2
LSC reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm
the latest product information and specifications before final design, purchase or
use.
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its products for any particular purpose, nor does LSC assume any liability for
application assistance or customer product design. LSC does not warrant or
accept any liability with products which are purchased or used for any
unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property
rights of LSC.
LSC products are not authorized for use as critical components in life support
devices or systems without express written approval of LSC.
Important Notice and Disclaimer
