3M™Thermally Conductive Interface Pads 5595 and 5595S
Product Description
3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path
between heat-generating components and heat sinks, heat spreaders or other cooling devices.
• The specialized silicone chemistry of Interfacel Pads 5595 and 5595S provides for good thermal stability of the base
polymer with excellent softness of the thermal pad.
• Interface Pad 5595 offers good thermal conductivity in a soft silicone polymer base.
• Interface Pad 5595S has a permanent PEN film 9 micrometer thick on one side to provide for a non-tacky surface,
increased puncture resistance, ease of handling and rework.
• Interface Pads 5595 and 5595S have a tacky feel. The product tack is such that a mechanical means to support the pad in
a final assembly is required.
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Technical Data July, 2010
Product Construction
3M™ Thermally Conductive Interface Pads 5595 and 5595S
Color Grey
Pad Type Filled Silicone Polymer
Pad Thickness 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm (>2 mm thickness available. Please inquire.)
Primary Filler Type Ceramic
Top Liner / Film Type Interface Pad 5595 – Silicone Coated Polyester removable Liner /
Interface Pad 5595S – 9 µm PEN Film
Base Liner Thickness Base Liner 3 mils (75 µm)
Polyethylene Naphthalate (PEN) film (9 µm) =
Interface Pad 5595S or Interface Pad 5595
with release liner
Filled Silicone Elastomer
Release Liner
3M™Thermally Conductive Interface Pads 5595 and 5595S
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Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be
used for specification purposes.
Property Method Value
Product Number* 3M™ Thermally Conductive Interface Pads 5595 and 5595S
Thermal Conductivity (W/m-K) 1.6 W/m-K 3M Test Method
with low pressure
(<10 psi)
Operating Temperature Range**** -60° to 125°C 3M Test Method
Shelf Life
Product shelf life is 24 months from date of manufacture when
3M Test Method
stored at room temperature conditions (23-25C & 50% RH)
and in the products original packaging.
Hardness Shore 00** Shore 00 results depend on test method and thickness of the Modified
sample tested. Typical results are in the 50-60 Shore 00 ASTM D2240
range @ 6 mm test thickness without the PEN film.
Ask 3M for more details on pad softness.
Dielectric Breakdown 400 V/mil AC (Interface Pad 5595S tested) 3M TM
(ASTM D149)
Volume Resistivity 5 x 1012 Ohms (Interface Pad 5595S tested) ASTM D257
Flammability Rating*** UL-94-V0 (3M tested.) UL-94-V0 TM
Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and
rework. **Interface Pad 5595 tested with-out PET film on product. ***9 µm PEN film is a non-FR version. ****Potential Operating Temperature
Range (°C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested
Temperature range is based on a 3M Test Method.
Application Guidelines
Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.
A clean surface can improve the thermal performance of an application.
1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily
components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents
(such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease,
machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to
help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner
before application.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with
the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat.
Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because
one of the flexible substrate can conform to the other substrates during application.
3M™Thermally Conductive Interface Pads 5595 and 5595S
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3M™ Thermally Conductive Interface Pads
5506 0.5 to 2.0 2.3
5509 0.5 to 2.0 5.0
General Information
Product selection table for 3M™ Thermally Conductive Materials.
Bulk Thermal
Thickness Conductivity
Product (mm) (W/m-K) Typical Applications
3M™ Thermally Conductive Tapes
8805 0.127
8810 0.25 0.6
8815 0.375
8820 0.50
9889FR 1.0 0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M™ Thermally Conductive Adhesives
TC-2707 — 0.7
TC-2810 — 1.0 - 1.4
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
3M™ Thermally Conductive Interface Pads (acrylic)
5590H 0.5 to 1.5 3.0
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M™ Thermally Conductive Interface Pads (silicone based)
5591S 0.5 to 2.0 1.0
5592 1.0 to 2.0 1.1
5592S 0.5 to 2.0 —
5595 1.0 to 2.0 1.6
5595S 0.5 to 2.0 —
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Application Ideas
• 3M™ Thermally Conductive Interface Thermal Pads are designed to provide a preferential heat-transfer path between
heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
3M™Thermally Conductive Interface Pads 5595 and 5595S
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3M is a trademark of 3M Company.
Please recycle. Printed in U.S.A.
©3M 2010. All rights reserved.
60-5002-0133-4 3
For Additional Information
To request additional product information or to arrange for sales assistance, call toll free 1-866-599-4227. Address
correspondence to: 3M, Electronics Markets Materials Division, 3M Center, Building 225-3S-06, St. Paul, MN 55144-
1000. Our fax number is 651-778-4244 or 1-877-369-2923. In Canada, phone: 1-800-364-3577. In Puerto Rico, phone:
1-787-750-3000. In Mexico, phone: 52-70-04-00.
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Electronics Markets Materials Division
3M Center, Building 225-3S-06
St. Paul, MN 55144-1000
1-866-599-4227 phone
651-778-4244 fax
www.3M.com/electronics
