TMP121-EP TMP123-EP SGLS315 - SEPTEMBER 2005 1.5C ACCURATE DIGITAL TEMPERATURE SENSOR WITH SPITM INTERFACE FEATURES * * * * * * * (1) Controlled Baseline - One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of -40C to 125C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Digital Output: SPI-Compatible Interface Resolution: 12-Bit + Sign, 0.0625C * * * * * Accuracy: 1.5C from -25C to 85C (max) Low Quiescent Current: 50 A (max) Wide Supply Range: 2.7 V to 5.5 V Tiny SOT23-6 Package Operation to 150C APPLICATIONS * * * * * Power-Supply Temperature Monitoring Computer Peripheral Thermal Protection Notebook Computers Battery Management Environmental Monitoring Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package. Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2C of accuracy over a temperature range of -40C to 125C. Low supply current and a supply range from 2.7 V to 5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications. The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005, Texas Instruments Incorporated TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 Temperature (1) Temperature NC 1 Diode Temp. Sensor Control Logic 6 SO GND 1 Diode Temp. Sensor Control Logic 6 SO GND 2 A/D Converter Serial Interface 5 CS NC 2 A/D Converter Serial Interface 5 CS V+ 3 OSC Config. and Temp. Register 4 SCK V+ 3 OSC Config. and Temp. Register 4 SCK TMP121 TMP123 NC = No Connection(1) NC = No Connection(1) Pins Labeled NC should be left floating or connected to GND. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION TA -40C to 125C (1) PACKAGE-LEAD SOT23-6 (DBV) Reel of 3000 ORDERABLE PART NUMBER PACKAGE MARKING TMP121AQDBVREP 121E TMP123AQDBVREP (1) 123E Product Preview ABSOLUTE MAXIMUM RATINGS (1) UNIT V+ Power supply Input voltage (2) Input current TJ max (1) (2) 2 7V -0.3 V to 7 V 10 mA Operating temperature range -55C to 150C Storage temperature range -60C to 150C Junction temperature 150C Lead temperature (soldering) 300C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input voltage rating applies to all TMP121 and TMP123 input voltages. TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 ELECTRICAL CHARACTERISTICS At TA = -40C to 125C and V+ = 2.7 V to 5.5 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 125 C TEMPERATURE INPUT Range -40 0.5 1.5 -40C to 125C 1 2 -40C to 150C 1.5 -25C to 85C Accuracy (temperature error) Accuracy vs Supply C/V 0.1 0.0625 Resolution C C DIGITAL INPUT/OUTPUT VIH 0.7(V+) Input logic levels VIL IIN 0.3(V+) Input current, SO, SCK, CS VOL SO VOH SO Output logic levels 0 V VIN V+ 1 ISINK = 3 mA 0.4 ISOURCE = 2 mA (V+)-0.4 V A V Resolution 12 Bits Input capacitance, SO, SCK, CS 2.5 pF Conversion time 12-Bit 240 320 ms Conversion period (1) 12-BIt 480 640 ms POWER SUPPLY 5.5 V IQ Operating range Quiescent current Serial bus inactive 2.7 35 50 A ISD Shutdown current (TPM121) Serial bus inactive 0.1 1 A ISD Shutdown current (TMP123) Serial bus inactive 0.1 3 A TEMPERATURE RANGE Specified range -40 125 C Operating range -55 150 C Storage range JA (1) -60 Thermal resistance 150 SOT23-6 surface-mount 200 C C/W Period indicates time between conversion starts. PIN CONFIGURATIONS Top View SOT23-6 TMP121(1) GND 2 V+ 3 6 SO GND 1 5 CS NC 2 4 SCK V+ 3 SOT23-6 NC = No Connection(2) 123E 1 121E NC TMP123(1) 6 SO 5 CS 4 SCK SOT23-6 NC = No Connection(2) Pin 1 orientation is determined by package marking. (1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown. (2) Pins labeled NC should be left floating or connected to GND. 3 TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 TYPICAL CHARACTERISTICS At TA = 25C and V+ = 5 V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE SHUTDOWN CURRENT vs TEMPERATURE 50 1.0 0.9 V+ = 5V 0.8 40 0.7 30 ISD (A) IQ (A) 0.6 V+ = 2.7V 0.5 0.4 0.3 0.2 20 0.1 0.0 Serial Bus Inactive 10 -60 -40 -20 0 20 40 60 80 100 -0.1 -60 -40 -20 120 140 0 20 40 60 80 100 Temperature ( C) Temperature ( C) Figure 1. Figure 2. CONVERSION TIME vs TEMPERATURE TEMPERATURE ACCURACY vs TEMPERATURE 120 140 2.0 400 300 Temperature Error (C) Conversion Time (ms) 1.5 V+ = 5V 200 V+ = 2.7V 1.0 0.5 0.0 -0.5 -1.0 -1.5 12-Bit Resolution 100 -60 -40 -20 4 0 20 40 60 80 100 120 140 3 Typical Units 12-Bit Resolution -2.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 Temperature ( C) Temperature ( C) Figure 3. Figure 4. TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 APPLICATION INFORMATION The TMP121 and TMP123 are 12-bit plus sign read-only digital temperature sensors optimal for thermal management and thermal protection applications. The TMP121 and the TMP123 communicate through a serial interface that is SPI-compatible. Temperature is converted to a 12-bit plus sign data word with 0.0625C resolution. The TMP121 and TMP123 are specified for a temperature range of -40C to 125C, with operation extending from -55C to 150C. The TMP121 and TMP123 are optimal for low power applications, with a 0.5 s conversion period for reduced power consumption. The TMP121 and TMP123 are specified for a supply voltage range of 2.7 V to 5.5 V, and also feature a hardware shutdown to provide additional power savings. The TMP121 and TMP123 require no external components for operation, though a 0.1-F supply bypass capacitor is recommended. Figure 5 shows typical connections for the TMP121 and TMP123. V+ V+ 0.1F 0.1F 3 SCK 4 SO 6 3 1 NC(1) SCK 4 SO 6 TMP121 5 2 TMP123 5 CS 2 NC(1) CS 1 NC = No Connection GND GND NOTE: Pins labeled NC should be left floating or connected to GND. Figure 5. Typical Connections of the TMP121 and TMP123 The sensing device of both the TMP121 and TMP123 is the chip itself; the die flag of the lead frame is thermally connected to pin 2 of the TMP121 and of the TMP123. Thermal paths run through the package leads as well as the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal path. The GND pin (pin 2) of the TMP121 and the NC pin (pin 2) of the TMP123 are thermally connected to the metal lead frame and are the best choice for thermal input. To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to isolate the package and leads from ambient air temperature. 5 TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 APPLICATION INFORMATION (continued) TEMPERATURE REGISTER The temperature register of the TMP121 and TMP123 is a 16 bit, signed read-only register that stores the output of the most recent conversion. Up to 16 bits can be read to obtain data and are described in Table 1. The first 13 bits are used to indicate temperature with bits D2 = 0 and D1, D0 in a high impedance state. Data format for temperature is summarized in Table 2. Following power-up or reset, the temperature register reads 0C until the first conversion is complete. Table 1. Temperature Register D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 Z Z Table 2. Temperature Data Format (1) TEMPERATURE (C) DIGITAL OUTPUT (1) (BINARY) HEX 150 0100 1011 0000 0000 4B00 125 0011 1110 1000 0000 3E80 25 0000 1100 1000 0000 0C80 0.0625 0000 0000 0000 1000 0008 0 0000 0000 0000 0000 0000 -0.0625 1111 1111 1111 1000 FFF8 -25 1111 0011 1000 0000 F380 -55 1110 0100 1000 0000 E480 The last two bits are high impedance and are shown as 00 in the table. COMMUNICATING WITH THE TMP121 The TMP121 and TMP123 continuously convert temperatures to digital data while CS is high. CS must be high for a minimum of one conversion time (320 ms max) to update the temperature data. Reading temperature data from the TMP121 and TMP123 is initiated by pulling CS low, which causes any conversion in progress to terminate, and places the device into analog shutdown. Quiescent current is reduced to 1 A during analog shutdown. Once CS is pulled low, temperature data from the last completed conversion prior to dropping CS is latched into the shift register and clocked out at SO on the falling SCK edge. The 16-bit data word is clocked out sign bit first, followed by the MSB. Any portion of the 16-bit word can be read before raising CS. The TMP121 and TMP123 typically require 0.25 s to complete a conversion and consume 50 A of current during this period. If CS is held high for longer than one conversion time period the TMP121 and TMP123 goes into idle mode for 0.25 s, requiring only 20 A of current. A new conversion begins every 0.5 s. Figure 6 describes the conversion timing for the TMP121 and TMP123. 0.5s 0.25s 50A (active) 20A (idle) Figure 6. Conversion Time and Period The serial data of the TMP121 and TMP123 consists of 12-bit plus sign temperature data followed by a confirmation bit and two high impedance bits. Data is transmitted in binary two's complement format. Figure 7 describes the output data of the TMP121 and TMP123. 6 TMP121-EP TMP123-EP www.ti.com SGLS315 - SEPTEMBER 2005 CS SCK SO/I Z D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z Figure 7. Data READ Timing Diagrams The TMP121 and TMP123 are SPI-compatible. Figure 8 and Figure 9 describe the various timing requirements, with parameters defined in Table 3. Table 3. Timing Description MIN MAX 100 UNIT t1 SCK period t2 SCK falling edge to output data delay ns t3 CS to rising edge SCK set-up time t4 CS to output data delay 30 ns t5 CS rising edge to output high impedance 30 ns 30 40 ns ns SCK t3 t1 t2 CS t4 SO Figure 8. Output Data Timing Diagram SCK SCK CS CS t5 t5 SO SO Figure 9. High Impedance Output Timing Diagram 7 PACKAGE OPTION ADDENDUM www.ti.com 31-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TMP121AQDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 121E V62/06608-01XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 121E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 31-May-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP121-EP : * Catalog: TMP121 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: TMP121AQDBVREP V62/06608-01XE