FEATURES
APPLICATIONS
DESCRIPTION
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
1.5 °C ACCURATE DIGITAL TEMPERATURE SENSOR WITH SPI™ INTERFACE
•Accuracy: ±1.5 °C from –25 °C to 85 °C (max)•Controlled Baseline •Low Quiescent Current: 50 µA (max)– One Assembly/Test Site, One Fabrication •Wide Supply Range: 2.7 V to 5.5 VSite
•Tiny SOT23-6 Package•Extended Temperature Performance of -40 °C
•Operation to 150 °Cto 125 °C•Enhanced Diminishing ManufacturingSources (DMS) Support
•Power-Supply Temperature Monitoring•Enhanced Product-Change Notification
•Computer Peripheral Thermal Protection•Notebook Computers•Qualification Pedigree
(1)
•Battery Management•Digital Output: SPI-Compatible Interface
•Environmental Monitoring•Resolution: 12-Bit + Sign, 0.0625 °C(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package.Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2 °Cof accuracy over a temperature range of –40 °C to 125 °C. Low supply current and a supply range from 2.7 V to5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer,consumer, environmental, industrial, and instrumentation applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.SPI is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
and Temp.
Register
TMP121
Temperature
GND
NC
NC = No Connection(1)
1
2
3
6
5
4
V+
SO
CS
SCK
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
and Temp.
Register
TMP123
NC
GND
NC = No Connection(1)
1
2
3
6
5
4
V+
SO
CS
SCK
Temperature
ABSOLUTE MAXIMUM RATINGS
(1)
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
(1) Pins Labeled NC should be left floating or connected to GND.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integratedcircuits be handled with appropriate precautions. Failure to observe proper handling and installationprocedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precisionintegrated circuits may be more susceptible to damage because very small parametric changes couldcause the device not to meet its published specifications.
ORDERING INFORMATION
T
A
PACKAGE-LEAD ORDERABLE PART NUMBER PACKAGE MARKING
TMP121AQDBVREP 121E–40 °C to 125 °C SOT23-6 (DBV) Reel of 3000
TMP123AQDBVREP
(1)
123E
(1) Product Preview
UNIT
V+ Power supply 7 VInput voltage
(2)
–0.3 V to 7 VInput current 10 mAOperating temperature range –55 °C to 150 °CStorage temperature range –60 °C to 150 °CT
J
max Junction temperature 150 °CLead temperature (soldering) 300 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods maydegrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose specified is not supported.(2) Input voltage rating applies to all TMP121 and TMP123 input voltages.
2
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ELECTRICAL CHARACTERISTICS
PIN CONFIGURATIONS
Top V iew SOT23-6
Pin 1 orientation is determined by package marking.
NC
GND
V+
SO
CS
SCK
1
2
3
6
5
4
121E
SOT23−6
NC = No Connection(2)
TMP121(1)
GND
NC
V+
SOT23−6
NC = No Connection(2)
TMP123(1)
SO
CS
SCK
1
2
3
6
5
4
123E
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
At T
A
= –40 °C to 125 °C and V+ = 2.7 V to 5.5 V, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range –40 125 °C–25 °C to 85 °C±0.5 ±1.5Accuracy (temperature error) –40 °C to 125 °C±1±2°C–40 °C to 150 °C±1.5Accuracy vs Supply 0.1 °C/VResolution ±0.0625 °C
DIGITAL INPUT/OUTPUT
V
IH
0.7(V+)Input logic levels VV
IL
0.3(V+)I
IN
Input current, SO, SCK, CS 0 V ≤V
IN
≤V+ ±1µAV
OL
SO I
SINK
= 3 mA 0.4Output logic levels VV
OH
SO I
SOURCE
= 2 mA (V+)–0.4Resolution 12 BitsInput capacitance, SO, SCK, CS 2.5 pFConversion time 12-Bit 240 320 msConversion period
(1)
12-BIt 480 640 ms
POWER SUPPLY
Operating range 2.7 5.5 VI
Q
Quiescent current Serial bus inactive 35 50 µAI
SD
Shutdown current (TPM121) Serial bus inactive 0.1 1 µAI
SD
Shutdown current (TMP123) Serial bus inactive 0.1 3 µA
TEMPERATURE RANGE
Specified range –40 125 °COperating range –55 150 °CStorage range –60 150 °Cθ
JA
Thermal resistance SOT23-6 surface-mount 200 °C/W
(1) Period indicates time between conversion starts.
(1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown.(2) Pins labeled NC should be left floating or connected to GND.
3
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TYPICAL CHARACTERISTICS
50
40
30
20
10
Temperature (C)
−60 −40 −20 0 20 40 60 80 100 120 140
IQ(µA)
Serial Bus Inactive
V+ = 5V
V+ = 2.7V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
−0.1
Temperature (C)
−60 −40 −20 0 20 40 60 80 100 120 140
ISD (µA)
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
Temperature (C)
−60 −40 −20 0 20 40 60 80 100 120 160140
Temperature Error (C)
3 Typical Units 12−Bit Resolution
400
300
200
100
Temperature (C)
−60 −40 −20 0 20 40 60 80 100 120 140
Conversion Time (ms)
V+ = 5V
V+ = 2.7V
12−Bit Resolution
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
At T
A
= 25 °C and V+ = 5 V, unless otherwise noted.
QUIESCENT CURRENT SHUTDOWN CURRENTvs vsTEMPERATURE TEMPERATURE
Figure 1. Figure 2.
CONVERSION TIME TEMPERATURE ACCURACYvs vsTEMPERATURE TEMPERATURE
Figure 3. Figure 4.
4
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APPLICATION INFORMATION
TMP121
0.1µF
V+
GND
2
5
1
3
CS
NC(1)
4
6
SCK
SO TMP123
0.1µF
V+
GND
1
5
2
3
CS
NC = No Connection
NC(1)
4
6
SCK
SO
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
The TMP121 and TMP123 are 12-bit plus sign read-only digital temperature sensors optimal for thermalmanagement and thermal protection applications. The TMP121 and the TMP123 communicate through a serialinterface that is SPI-compatible. Temperature is converted to a 12-bit plus sign data word with 0.0625 °Cresolution. The TMP121 and TMP123 are specified for a temperature range of –40 °C to 125 °C, with operationextending from –55 °C to 150 °C.
The TMP121 and TMP123 are optimal for low power applications, with a 0.5 s conversion period for reducedpower consumption. The TMP121 and TMP123 are specified for a supply voltage range of 2.7 V to 5.5 V, andalso feature a hardware shutdown to provide additional power savings.
The TMP121 and TMP123 require no external components for operation, though a 0.1- µF supply bypasscapacitor is recommended. Figure 5 shows typical connections for the TMP121 and TMP123.
NOTE: Pins labeled NC should be left floating or connected to GND.
Figure 5. Typical Connections of the TMP121 and TMP123
The sensing device of both the TMP121 and TMP123 is the chip itself; the die flag of the lead frame is thermallyconnected to pin 2 of the TMP121 and of the TMP123. Thermal paths run through the package leads as well asthe plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermalpath. The GND pin (pin 2) of the TMP121 and the NC pin (pin 2) of the TMP123 are thermally connected to themetal lead frame and are the best choice for thermal input.
To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken toisolate the package and leads from ambient air temperature.
5
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TEMPERATURE REGISTER
COMMUNICATING WITH THE TMP121
0.25s
0.5s
50µA (active)
20µA (idle)
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
APPLICATION INFORMATION (continued)
The temperature register of the TMP121 and TMP123 is a 16 bit, signed read-only register that stores the outputof the most recent conversion. Up to 16 bits can be read to obtain data and are described in Table 1 . The first 13bits are used to indicate temperature with bits D2 = 0 and D1, D0 in a high impedance state. Data format fortemperature is summarized in Table 2 . Following power-up or reset, the temperature register reads 0 °C until thefirst conversion is complete.
Table 1. Temperature Register
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 Z Z
Table 2. Temperature Data Format
TEMPERATURE DIGITAL OUTPUT
(1)
HEX(°C) (BINARY)
150 0100 1011 0000 0000 4B00125 0011 1110 1000 0000 3E8025 0000 1100 1000 0000 0C800.0625 0000 0000 0000 1000 00080 0000 0000 0000 0000 0000–0.0625 1111 1111 1111 1000 FFF8–25 1111 0011 1000 0000 F380–55 1110 0100 1000 0000 E480
(1) The last two bits are high impedance and are shown as 00 in the table.
The TMP121 and TMP123 continuously convert temperatures to digital data while CS is high. CS must be highfor a minimum of one conversion time (320 ms max) to update the temperature data. Reading temperature datafrom the TMP121 and TMP123 is initiated by pulling CS low, which causes any conversion in progress toterminate, and places the device into analog shutdown. Quiescent current is reduced to 1 µA during analogshutdown. Once CS is pulled low, temperature data from the last completed conversion prior to dropping CS islatched into the shift register and clocked out at SO on the falling SCK edge. The 16-bit data word is clocked outsign bit first, followed by the MSB. Any portion of the 16-bit word can be read before raising CS. The TMP121and TMP123 typically require 0.25 s to complete a conversion and consume 50 µA of current during this period.If CS is held high for longer than one conversion time period the TMP121 and TMP123 goes into idle mode for0.25 s, requiring only 20 µA of current. A new conversion begins every 0.5 s. Figure 6 describes the conversiontiming for the TMP121 and TMP123.
Figure 6. Conversion Time and Period
The serial data of the TMP121 and TMP123 consists of 12-bit plus sign temperature data followed by aconfirmation bit and two high impedance bits. Data is transmitted in binary two's complement format. Figure 7describes the output data of the TMP121 and TMP123.
6
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SO/I
SCK
CS
ZZ1D3D4D5D6D7D8D9D10D11D12D13D14D15Z
Timing Diagrams
SCK
CS
SO
t1
t3
t2
t4
SCK
CS
SO
t5t5
SCK
CS
SO
TMP121-EP
TMP123-EP
SGLS315 – SEPTEMBER 2005
Figure 7. Data READ
The TMP121 and TMP123 are SPI-compatible. Figure 8 and Figure 9 describe the various timing requirements,with parameters defined in Table 3 .
Table 3. Timing Description
MIN MAX UNIT
t
1
SCK period 100 nst
2
SCK falling edge to output data delay 30 nst
3
CS to rising edge SCK set-up time 40 nst
4
CS to output data delay 30 nst
5
CS rising edge to output high impedance 30 ns
Figure 8. Output Data Timing Diagram
Figure 9. High Impedance Output Timing Diagram
7
PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TMP121AQDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 121E
V62/06608-01XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 121E
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP121-EP :
•Catalog: TMP121
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
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