UPC8112TB-E3-A - RENESAS TECHNOLOGY

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BIPOLAR ANALOG INTEGRATED CIRCUI T

µµ

PC8112TB

SILICON MMIC 1st FREQUENCY DOWN-CONVERTER

FOR CELLULAR/CORDLESS TELEPHONE

1997, 2000

Document No. P12808EJ3V0DS00 (3rd edition)

Date Published November 2000 N CP(K)

Printed in Japan

DATA SHEET

The mark shows major revised poi nts.

DESCRIPTION

The

PC8112TB is a silicon monolithic integrated circuit designed as 1st frequency down-converter for

cellular/cordless telephone receiver stage. This IC consists of mixer and local amplifier. The

PC8112TB features

high impedance output of open collector. Similar ICs of the

PC2757TB and

PC2758TB feature low impedance

output of emitter follower. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to

reduce your system size.

The

PC8112TB is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses

silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution

and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• Excellent RF performance : IIP3 = –7 dBm@fRFin = 1.9 GHz (reference)

IM3 = –88 dBm@PRFin = –38 dBm, 1.9 GHz (reference)

• Similar conversion gain to

PC2757 and lower noise figure than

PC2758

• Minimized carrier leakage : RFLO = –80 dB@fRFin = 900 MHz (reference)

RFLO = –55 dB@fRFin = 1.9 GHz (reference)

• High linearity : PO(sat) = –2.5 dBm TYP.@fRFin = 900 MHz

PO(sat) = –3 dBm TYP.@fRFin = 1.9 GHz

• Low current consumption : ICC = 8.5 mA TYP.

• Supply voltage : VCC = 2.7 to 3.3 V

• High-density surface mounting: 6-pin super minimold package

APPLICATIONS

• 1.5 to 1.9 GHz cellular/cordless telephone (PHS, DECT, PDC1.5G and so on)

• 800 to 900 MHz cellular telephone (PDC800M and so on)

ORDER INFORMATION

Part Number Package Markings Supplyi ng Form

PC8112TB-E3 6-pin super mini m ol d C2K Embossed tape 8 mm wi de.

Pin 1, 2, 3 face the t ape perforation s i de.

Qty 3k pc s/reel.

Remark To order evaluation samples, please contact your local NEC sales office (Part number for sample order:

PC8112TB).

Caution Electro-static sensitive devices

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

CONTENTS

1. PIN CONNECTIONS.............................................................................................................................................3

2. PRODUCT LINE-UP.............................................................................................................................................3

3. INTERNAL BLOCK DIAGRAM...........................................................................................................................4

4. SYSTEM APPLICATION EXAMPLE...................................................................................................................4

5. PIN EXPLANATION .............................................................................................................................................5

6. ABSOLUTE MAXIMUM RATINGS......................................................................................................................6

7. RECOMMENDED OPERATING RANGE............................................................................................................6

8. ELECTRICAL CHARACTERISTICS ....................................................................................................................6

9. STANDARD CHARACTERISTICS FOR REFERENCE .....................................................................................7

10. TEST CIRCUIT .....................................................................................................................................................7

11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD.................................8

12. TYPICAL CHARACTERISTICS............................................................................................................................9

12.1 Without Signals...........................................................................................................................................9

12.2 IF 100 MHz Matching (fRFin = 900 MHz)....................................................................................................10

12.3 IF 100 MHz Matching (fRFin = 1.5 GHz).....................................................................................................12

12.4 IF 240 MHz Matching ................................................................................................................................14

13. S-PARAMETERS ................................................................................................................................................16

13.1 Calibrated on pin of DUT..........................................................................................................................16

13.2 IF Output Matching...................................................................................................................................17

14. PACKAGE DIMENSIONS....................................................................................................................................18

15. NOTE ON CORRECT USE................................................................................................................................19

16. RECOMMENDED SOLDERING CONDITIONS..................................................................................................19

Data Sheet P12808EJ3V0DS00 3

PC8112TB

1. PIN CONNECTIONS

2. PRODUCT LINE-UP (TA = +25°C, VCC = VPS = 3.0 V, ZS = ZL = 50 :

Items No RF

ICC

(mA)

900 MHz

SSB · NF

(dB)

1.5 GHz

SSB · NF

(dB)

1.9 GHz

SSB · NF

(dB)

900 MHz

(dB)

1.5 GHz

(dB)

1.9 GHz

(dB)

900 MHz

IIP3

(dBm)

1.5 GHz

IIP3

(dBm)

1.9 GHz

IIP3

(dBm)

PC2757T 5.6 10 10 13 15 15 13 ð14 ð14 ð12

PC2757TB

PC2758T 11 9 10 13 19 18 17 ð13 ð12 ð11

PC2758TB

PC8112T 8.5 9 11 11 15 13 13 ð10 ð9ð7

PC8112TB

Items 900 MHz

PO(sat)

(dBm)

1.5 GHz

PO(sat)

(dBm)

1.9 GHz

PO(sat)

(dBm)

900 MHz

RFLO

(dB)

1.5 GHz

RFLO

(dB)

1.9 GHz

RFLO

(dB)

IF Output

Configuration Package

PC2757T ð3ðð

8 – – – Emitter follower 6-pin minimold

PC2757TB 6-pin super mi ni m ol d

PC2758T +1 ðð

4 – – – 6-pin minim ol d

PC2758TB 6-pin super mi ni m ol d

PC8112T ð2.5 ð3ð3ð80 ð57 ð55 Open collect or 6-pin minim ol d

PC8112TB 6-pin super mi ni m ol d

Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.

Cautions 1. The

PC2757 and

PC2758’s IIP3 are calculated with

IM3 = 3 which is the same IM3

inclination as

PC8112. On the other hand, OIP3 of Standard characterisitcs in page 7 is

cross point IP.

2. This document is to be specified for

PC8112TB. The other part number mentioned in this

document should be referred to the data sheet of each part number.

Pin No. Pin Name

1 RFinput

2GND

3 LOinput

4PS

6 IFoutput

Part

Number

Part

Number

(Top View) (Bottom View)

C2K

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

3. INTERNAL BLOCK DIAGRAM

RFinput IFoutput

LOinput

4. SYSTEM APPLICATION EXAMPLE

Digital cordless phone

DEMOD. I

÷N PLL PLL

0˚

90˚

VCO

Low noise Tr. PC8112TB

Data Sheet P12808EJ3V0DS00 5

µµ

PC8112TB

5. PIN EXPLANATION

No. Pin

Name

Applied

Voltage

(V)

Pin Voltage

(V) Functi on and Application Internal E qui valent Circuit

1 RFinput −1.2 RF input pin of mi xer. This

mixer is designed as doubl e

balanced type.

This pin s houl d be externally

coupled to front s t age with DC cut

capacitor.

2GND GND −Ground pin. This pi n m ust be

connect ed t o the system ground.

Form the ground patt ern as wide

as poss i bl e and t he truck l ength

as short as possibl e t o m i ni mize

ground impedance.

CC 2.7 to 3.3 −Supply v ol tage pin.

This pin s houl d be connected wi t h

bypass capacit or (ex ample: 1 000

pf) to mi ni m i ze ground

impedance.

6 IFoutput as same as

VCC voltage

through

external

inductor

−IF output pi n. This out put i s

configured wi t h open collec t or of

high impedance. This pin should

be externall y equipped with

matchi ng circuit of induc t or should

be selected as sm al l resist ance

and high frequency use.

3 LOinput −1. 4 Input pin of local am pl i fier. This

amplifi er i s designed as di fferen-

tial type.

This pin s houl d be externally

coupled to l ocal signal source

with DC cu t capacitor.

Recommendable i nput level i s

−15 to 0 dBm.

4PS V

CC or

GND −Power save control pin. This pin

can control ON/ O FF operat i on

with bias as follows;

Bias: V Operation

≥ 2.5 ON

VPS

0 to 0.5 OFF

From

To mixer

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

6. ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

Supply V ol tage VCC TA = +25°C, 5 pin and 6 pi n 3.6 V

Total Circ ui t Current ICC TA = +25°C 77.7 mA

Total P ower Dissi pation PDMounted on doubl e sided copper c l ad 50 × 50 ×

1.6 mm epox y glass PWB (TA = +85°C) 270 mW

Operating Ambient Temperature TA−40 to +85 °C

Storage Temperat ure Tstg −55 to +150 °C

7. RECOMMENDED OPERATING RANGE

Parameter Symbol MIN. TYP. MAX. Unit Remarks

Supply V ol tage VCC 2.7 3.0 3.3 V 5 pin and 6 pin shoul d be appl i ed

to same voltage.

Operating Ambient Temperature TA−40 +25 +85 °C

LO Input Power PLOin −15 −10 0 dBm Zs = 50 Ω

RF Input Frequency fRFin 0.8 1.9 2.0 GHz

IF Output Frequency fIFout 100 250 300 MHz With external matching

8. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +

+25°

°°

°C, VCC = VPS = VIFout

= 3.0 V, PLOin = −

−−

−10 dBm, ZS = ZL = 50 Ω

ΩΩ

Ω)

Parameter Symbol Test Condit i ons MIN. TYP. MAX. Unit

Circuit Current ICC No input signal 4.9 8.5 11.7 mA

Circuit Current at Power Save

Mode ICC(PS) VCC = 3.0 V, VPS = 0. 5 V −−

0.1

Conversion Gai n CG fRFin = 900 MHz , f LOin = 1 000 MHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz 11.5

9.5 15

13 17.5

15.5 dB

SSB Noise Figure SSB•NF fRFin = 900 MHz, fLOin = 1 000 MHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz −

−9.0

11.2 11

13.2 dB

Saturated Output Power Po(sat) fRFin = 900 MHz , f LOin = 1 000 MHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz

(PRFin = −10 dBm each)

−6.5

−7−2.5

−3−

−dBm

Data Sheet P12808EJ3V0DS00 7

µµ

PC8112TB

9. STANDARD CHARACTERISTICS FOR REFERENCE

(TA = +

+25°

°°

°C, VCC = VPS = VIFout = 3.0 V, PLOin = −

−−

−10 dBm, ZS = ZL = 50 Ω

ΩΩ

Ω)

Parameter Symbol Test Conditi ons Reference Unit

Conversion Gai n CG fRFin = 1.5 GHz, fLOin = 1.6 GHz 13 dB

SSB Noise Figure SSB•NF fRFin = 1.5 GHz, fLOin = 1.6 GHz 11 dB

LO Leakage at RF pin LORF fRFin = 900 MHz, fLOin = 1 000 MHz

fRFin = 1.5 GHz , fLOin = 1.6 GHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz

−45

−46

−45

RF Leakage at LO pin RFLO fRFin = 900 MHz, fLOin = 1 000 MHz

fRFin = 1.5 GHz , fLOin = 1.6 GHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz

−80

−57

−55

LO Leakage at IF pi n LO if fRFin = 900 MHz, f LOin = 1 000 MHz

fRFin = 1.5 GHz , fLOin = 1.6 GHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz

−32

−33

−30

3rd Order Distort i on Input

Intercept PointNote IIP3fRFin = 900 MHz, f LOin = 1 000 MHz

fRFin = 1.5 GHz , fLOin = 1.6 GHz

fRFin = 1.9 GHz , fLOin = 1.66 GHz

−10

−9

−7

dBm

Note IIP3 is determined by comparing two method; theoretical calculation and cross point of IM3 curve.

IIP3 = (

∆

IM3 × Pin + CG − IM3) ÷ (

∆

IM3 − 1) (dBm) [

∆

IM3: IM3 curve inclination in linear range]

PC8112’s

∆

IM3 is closer to 3 (theoretical inclination) than

PC2757 and

PC2758 of conventional ICs.

10. TEST CIRCUIT

1 000 pF

50 Ω

(Top View)

LOinput

GND

RFinput

IFoutput

POWER

SAVE

3 V

50 Ω

1 000 pF

Spectrum Analyzer

Signal Generator

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

input

PS bias

→

Voltage supply

output

Short

Chip

Short Chip = 1 000 pF

GND

Component Number IF 100 MHz Matchi ng IF 240 MHz Matchi ng Remarks

C1 to C51 000 pF 1 000 pF CHIP C

C65 pF 2 pF CHIP C

L1330 nH 84 nH CHIP L

EVALUATION BOARD CHARACTERS AND NOTE

(1) 35

m thick double-sided copper clad 35 × 42 × 0.4 mm polyimide board

(2) Back side: GND pattern

(3) Solder plated patterns

(4) {: Through holes

(5) To mount C6, pattern should be cut.

Caution Test circuit or print pattern in this sheet is for testing IC characteristics. They are not an

application circuit or recommended system circuit.

In the case of actual system application, external circuits including print pattern and matching

circuit constant of output port should be designed in accordance with IC’s S-parameters and

environmental components.

Remark External circuits of the IC can be referred to following application notes.

•USAGE AND APPLICATION CHARACTERISTICS OF

PC2757,

PC2758, AND

PC8112, 3-V

POWER SUPPLY, 1.9-GHz FREQUENCY DOWN-CONVERTER ICS FOR MOBILE COMMUNICATION

(Document No. P11997E)

Data Sheet P12808EJ3V0DS00 9

µµ

PC8112TB

12. TYPICAL CHARACTERISTICS (TA = +25°

°°

°C, unless otherwise specified, measured on test

circuits)

12.1 Without Signals

Circuit Current I

(mA)

Circuit Current I

(mA)

Circuit Current I

(mA)

0234

Supply Voltage V

(V)

0234

PS Pin Applied Voltage V

(V)

0234

Supply Voltage V

(V)

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

CIRCUIT CURRENT vs.

PS PIN APPLIED VOLTAGE

= V

IFout

= V

IFout

= V

IFout

= +85°C

= +25°C

= –40°C

= 3.3 V

= 3.0 V

= 2.7 V

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

12.2 IF 100 MHz Matching (fRFin = 900 MHz)

–5

–10

–15

–20

–25

–30

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–35 0

–5

–10

–15

–20

–25

–30

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–35 0

–10

–20

–30

–40

IF Output Power of Each Tone P

IFout(each)

(dBm)

3rd Order Intermodulation Distortion IM

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER OF EACH TONE,

vs. RF INPUT POWER

–50

–60

–70

–5

Conversion Gain CG (dB)

–40

–50 –30 –20 –10

LO Input Power P

LOin

(dBm)

CONVERSION GAIN vs. LO INPUT POWER

–10 10

= 3.3 V V

= 3.0 V

= 2.7 V

out

RFin

= 900 MHz

LOin

= 1 000 MHz

IFout

= 100 MHz

LOin

= –10 dBm

= V

IFout

= 3.0 V

RFin

= 900 MHz

LOin

= 1 000 MHz

IFout

= 100 MHz

LOin

= –10 dBm

= V

IFout

= 3.0 V

RFin

= 900 MHz

RFin

= –40 dBm

LOin

= 1 000 MHz

IFout

= 100 MHz

= V

IFout

= 3.0 V

RFin1

= 900 MHz

RFin2

= 905 MHz

LOin

= 1 000 MHz

LOin

= –10 dBm

= V

IFout

= 3.0 V

IFout

= 100 MHz

Data Sheet P12808EJ3V0DS00 11

µµ

PC8112TB

Conversion Gain CG (dB)

2.5

233.5

Supply Voltage V

(V)

CONVERSION GAIN vs. SUPPLY VOLTAGE

RFin

= 900 MHz

LOin

= 1 000 MHz

IFout

= 100 MHz

= V

IFout

= 3.0 V

SSB Noise Figure SSB•NF (dB)

–30

–40 –20 –10

LO Input Power P

LOin

(dBm)

SSB NOISE FIGURE vs. LO INPUT POWER

RFin

= 900 MHz

LOin

= 1 000 MHz

IFout

= 100 MHz

= V

IFout

= 3.0 V

Conversion Gain CG (dB)

0100 150

IF Output Frequency f

IFout

(MHz)

CONVERSION GAIN vs.

IF OUTPUT FREQUENCY

–25 500

RFin

= 900 MHz

RFin

= –40 dBm

LOin

= –10 dBm

= V

IFout

= 3.0 V

–5

–10

–15

–20

250

200 300 350 400 450

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

12.3 IF 100 MHz Matching (fRFin = 1.5 GHz)

–5

–10

–15

–20

–25

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–30 10

RFin

= 1.5 GHz

LOin

= 1.6 GHz

LOin

= –10 dBm

IFout

= 100 MHz

= V

IFout

= 3.0 V

–5

–10

–15

–20

–25

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–30 10

= 3.3 V

= 3.0 V

= 2.7 V

RFin

= 1.5 GHz

LOin

= 1.6 GHz

LOin

= –10 dBm

IFout

= 100 MHz

= V

IFout

= 3.0 V

–10

–20

–30

–40

–50

IF Output Power of Each Tone P

IFout(each)

(dBm)

3rd Order Intermodulation Distortion IM

(dBm)

–40 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER OF EACH TONE,

vs. RF OUTPUT POWER

–60

–70

–80

out

RFin1

= 1.5 GHz

RFin2

= 1.505 GHz

LOin

= 1.6 GHz

LOin

= –10 dBm

IFout

= 100 MHz

= V

IFout

= 3.0 V

–90

–5

–10

Conversion Gain CG (dB)

–40

–50 –30 –20 –10

LO Input Power P

LOin

(dBm)

CONVERSION GAIN vs. LO INPUT POWER

–15 10

RFin

= 1.5 GHz

LOin

= 1.6 GHz

RFin

= –40 dBm

IFout

= 100 MHz

= V

IFout

= 3.0 V

Data Sheet P12808EJ3V0DS00 13

µµ

PC8112TB

Conversion Gain CG (dB)

2.5

233.5

Supply Voltage V

(V)

CONVERSION GAIN vs. SUPPLY VOLTAGE

RFin

= 1.5 GHz

LOin

= 1.6 GHz

IFout

= 100 MHz

= V

IFout

= 3.0 V

SSB Noise Figure SSB•NF (dB)

–30

–40 –20 –10

LO Input Power P

LOin

(dBm)

SSB NOISE FIGURE vs. LO INPUT POWER

RFin

= 1.5 GHz

LOin

= 1.6 GHz

IFout

= 100 MHz

= V

IFout

= 3.0 V

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

12.4 IF 240 MHz Matching

–5

–10

–15

–20

–25

–30

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–35

–5

–10

–15

–20

–25

–30

IF Output Power P

IFout

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER vs. RF INPUT POWER

–35

= 3.3 V

= 3.0 V

= 2.7 V

RFin

= 1.9 GHz

LOin

= 1.66 GHz

LOin

= –10 dBm

IFout

= 240 MHz

= V

IFout

= 3.0 V

RFin

= 1.9 GHz

LOin

= 1.66 GHz

LOin

= –10 dBm

IFout

= 240 MHz

= V

IFout

= 3.0 V

–40

= –40°C

= +25°C

= +85°C

–40

–10

–20

–30

–40

IF Output Power of Each Tone P

IFout(each)

(dBm)

3rd Order Intermodulation Distortion IM

(dBm)

–40

–50 –30 –20 –10

RF Input Power P

RFin

(dBm)

IF OUTPUT POWER OF EACH TONE,

vs. RF INPUT POWER

–50

–60

–70

–5

–10

Conversion Gain CG (dB)

–40

–50 –30 –20 –10

LO Input Power P

LOin

(dBm)

CONVERSION GAIN vs. LO INPUT POWER

–15 10

out

RFin

= 1.9 GHz

RFin

= –40 dBm

LOin

= 1.66 GHz

IFout

= 240 MHz

= V

IFout

= 3.0 V

RFin1

= 1.9 GHz

RFin2

= 1.905 GHz

LOin

= 1.66 GHz

LOin

= –10 dBm

= V

IFout

= 3.0 V

IFout

= 240 MHz

Data Sheet P12808EJ3V0DS00 15

µµ

PC8112TB

Conversion Gain CG (dB)

2.5

233.5

Supply Voltage V

(V)

CONVERSION GAIN vs. SUPPLY VOLTAGE

RFin

= 1.9 GHz

RFin

= –40 dBm

LOin

= 1.66 GHz

LOin

= –10 dBm

IFout

= 240 MHz

= V

IFout

= 3.0 V

SSB Noise Figure SSB•NF (dB)

–30

–40 –20 –10

LO Input Power P

LOin

(dBm)

SSB NOISE FIGURE vs. LO INPUT POWER

RFin

= 1.9 GHz

LOin

= 1.66 GHz

IFout

= 240 MHz

= V

IFout

= 3.0 V

Conversion Gain CG (dB)

0100

IF Output Frequency f

IFout

(MHz)

CONVERSION GAIN vs.

IF OUTPUT FREQUENCY

600

RFin

= 1.9 GHz

RFin

= –40 dBm

LOin

= –10 dBm

= V

IFout

= 3.0 V

–5

–10

–15

–20 200 300 400 500

SSB Noise Figure SSB•NF (dB)

–20

–40 020

Operating Ambient Temperature T

(°C)

SSB NOISE FIGURE vs.

OPERATING AMBIENT TEMPERATURE

5100

RFin

= 1.9 GHz

LOin

= 1.66 GHz

LOin

= –10 dBm

= V

IFout

= 3.0 V

40 60 80

Remark The graphs indicate nominal characteristics.

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

13. S-PARAMETERS

13.1 Calibrated on pin of DUT

REF

1.0 Units

200.0 mUnits/

62.711 Ω –224.07 Ω

MARKER 1

500.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

RF PORT

= V

= 3.0V

1:500 MHz 62.711 Ω-j224.07 Ω

2:900 MHz 48.977 Ω-j219.18 Ω

3:1 500 MHz 40.641 Ω-j129.94 Ω

4:1 900 MHz 37.422 Ω-j101.51 Ω

5:2 500 MHz 34.801 Ω-j74.141 Ω

REF

1.0 Units

200.0 mUnits/

76.656 Ω –421.67 Ω

MARKER 1

500.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

RF PORT

= 3.0V V

= GND

1:500 MHz 76.656 Ω-j421.67 Ω

2:900 MHz 53.102 Ω-j234.55 Ω

3:1 500 MHz 44.844 Ω-j140.82 Ω

4:1 900 MHz 40.898 Ω-j109.73 Ω

5:2 500 MHz 38.063 Ω-j80.547 Ω

REF

1.0 Units

200.0 mUnits/

169.11 Ω –429.98 Ω

MARKER 1

500.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

LO PORT

= V

= 3.0V

1:500 MHz 169.11 Ω-j429.98 Ω

2:900 MHz 91.875 Ω-j263.7 Ω

3:1 500 MHz 60.781 Ω-j162.56 Ω

4:1 900 MHz 56.789 Ω-j125.66 Ω

5:2 500 MHz 49.652 Ω-j97.602 Ω

REF

1.0 Units

200.0 mUnits/

135.53 Ω –575.06 Ω

MARKER 1

500.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

LO PORT

= 3.0V V

= GND

1:500 MHz 135.53 Ω-j575.06 Ω

2:900 MHz 78.266 Ω-j337.66 Ω

3:1 500 MHz 55.883 Ω-j201.43 Ω

4:1 900 MHz 52.734 Ω-j159.63 Ω

5:2 500 MHz 44.262 Ω-j122.66 Ω

REF

1.0 Units

200.0 mUnits/

201.00 Ω –1.7173 kΩ

MARKER 1

100.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

IF PORT

= V

= 3.0V

1:100 MHz 201.88 Ω-j1.7173 kΩ

2:240 MHz 92.094 Ω-j715.72 Ω

REF

1.0 Units

200.0 mUnits/

056.56 Ω –1.7468 kΩ

MARKER 1

100.0 MHz

START

STOP 0.050000000 GHz

3.000000000 GHz

IF PORT

= 3.0V V

= GND

1:100 MHz 56.56 Ω-j1.7468 kΩ

2:240 MHz 85.5 Ω-j722.22 Ω

Data Sheet P12808EJ3V0DS00 17

µµ

PC8112TB

13.2 IF Output Matching (VCC = VPS = VIFout = 3.0 V) −

−−

−on Test Circuit−

−−

−

(This S11 is monitored at IF connector on test circuit fixture)

IF 100 MHz MATCHING IF 240 MHz MATCHING

100.000 000 MHz

1 U FS 1 : 50.277 Ω –22.559 Ω 70.552 pF

MARKER 1

100 MHz

START 50.000 000 MHz STOP 3 000.000 000 MHz

240.000 000 MHz

1 U FS 1 : 31.052 Ω –84.961 mΩ 7.8053 nF

MARKER 1

240 MHz

START 50.000 000 MHz STOP 3 000.000 000 MHz

102.366 002 MHz

log MAG. 10 dB/ REF 0 dB 1 : –27.655 dB

MARKER 1

102.366002 MHz

START 90.000 000 MHz STOP 110.000 000 MHz

241.770 000 MHz

log MAG. 10 dB/ REF 0 dB 1 : –13.556 dB

MARKER 1

241.770000 MHz

START 230.000 000 MHz STOP 250.000 000 MHz

The data in this page are to make clear the test condition of impedance matched to next stage, not specify the

recommended condition. The S11 smith charts of the test fixture setting IC are normalized to ZO = 50 Ω, because the

IC's load is the measurement equipment of 50 Ω impedance.

In your use, the output return loss value can be helpful information to adjust your circuit matching to next stage.

Data Sheet P12808EJ3V0DS00

µµ

PC8112TB

14. PACKAGE DIMENSIONS

6-PIN SUPER MINIMOLD (UNIT: mm)

0.9±0.1

0.7

0 to 0.1

0.15

+0.1

–0.05

2.0±0.2

1.3

0.650.65

0.2

+0.1

–0.05

2.1±0.1

1.25±0.1

0.1 MIN.

Data Sheet P12808EJ3V0DS00 19

µµ

PC8112TB

15. NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

Keep the track length of the ground pins as short as possible.

(3) The bypass capacitor (example: 1 000 pF) should be attached to the VCC pin.

(4) The matching circuit should be externally attached to the IF output pin.

(5) The DC cut capacitor must be each attached to the input and output pins.

16. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Condition Recommended Condition Sy m bol

Infrared Refl ow Package peak temperat ure: 235°C or below

Time: 30 s econds or les s (at 210°C)

Count: 3, Exposure l i m i t: NoneNote

IR35-00-3

VPS Package peak temperat ure: 215°C or below

Time: 40 s econds or les s (at 200°C)

Count: 3, Exposure l i m i t: NoneNote

VP15-00-3

Wave Solderi ng Soldering bath temperature: 260° C or bel ow

Time: 10 seconds or less

Count: 1, Exposure l i m i t: NoneNote

WS60-00-1

Partial Heating Pi n temperature: 300° C

Time: 3 s econds or les s (per side of device)

Exposure l i mit: NoneNote

–

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµ

PC8112TB

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

SENSITIVE

DEVICES

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

M8E 00. 4

The information in this document is current as of November, 2000. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or

data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all

products and/or types are available in every country. Please check with an NEC sales representative

for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of NEC semiconductor products listed in this document or any other

liability arising from the use of such products. No license, express, implied or otherwise, is granted under any

patents, copyrights or other intellectual property rights of NEC or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of customer's equipment shall be done under the full

responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third

parties arising from the use of these circuits, software and information.

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers

agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize

risks of damage to property or injury (including death) to persons arising from defects in NEC

semiconductor products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment, and anti-failure features.

NEC semiconductor products are classified into the following three quality grades:

"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products

developed based on a customer-designated "quality assurance program" for a specific application. The

recommended applications of a semiconductor product depend on its quality grade, as indicated below.

Customers must check the quality grade of each semiconductor product before using it in a particular

application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's

data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not

intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness

to support a given application.

(Note)

(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

•