Technical Data Sheet
LOCTITE GC 10
May-2015
PRODUCT DESCRIPTION
LOCTITE GC 10 provides the following product characteristics:
Technology No-clean and Halogen-free Solder Paste
Application Pb-free soldering
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low
voiding, Pb-free solder paste specially formulated to provide added
long term stability over a wide range of temperature conditions. The
enhanced paste stability created through its novel formulation strategy
increases both field application yields and on-line paste utilization.
LOCTITE GC 10 also shows excellent solderability when reflowed in
both air and nitrogen across a wide range of challenging surface
finishes and component metallizations including immersion Ag,
OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome
industry wide HiP and NWO challenges. The new flux chemistry
protects the solder joint longer, improves coalescence and optimizes
wetting performance, allowing for very shiny solder joints.
LOCTITE GC 10 is suitable for use with industry standard SAC alloys.
FEATURES AND BENEFITS
● Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
● Halogen-free flux classification: ROL0 to ANSI/J-STD-004
Rev. B
● Printing: down to 0.3 mm pitch
● Printing: up to 72 hours stencil life
● Printing: up to 24 hours abandon time
● Printing: up to 125 mms-1
● Printing: improved paste-transfer efficiency
● Printing: suitable for high-speed printing up to 125 mms-1
● Reflow: improved process window (high soak temperatures and
time) with superior coalescence and wetting
● Reflow: enhanced soak process window 150-200ºC
(temperature and time)
● Reflow: minimum hot slump at 182ºC
● Reflow: superior coalescence and wetting on small components
down to 01005
● Reflow: very shiny solder joints
● Reflow: clear, colorless residues for easy post-reflow inspection
● Reflow: residues print testable after 4x reflows
TYPICAL PROPERTIES
Solder Powder:
Solder powder is produced to a quality level that exceeds IPC industry
requirements for sphericity, size distribution, impurities and oxide
levels.
All solder powders are RoHS compliant.
Particle Size Distribution (PSD) (J-STD-005A)
Powder Description T4
Powder Particle Size Distribution 20 to 38 µm
Former PSD DAP
Solder Alloy (J-STD 006)
LOCTITE Code SAC305
Alloy Industry Standard
Melting Point (ºC) 217
Ag % 3.0
Based on type 4 powder.
Solder Paste Typical Properties
Metal Content, % 88.5
Brookfield Viscosity @ 25°C, mPa∙s
Spindle TF, speed 5, rpm, after 2 minutes
900,000
Malcom Viscosity @ 25°C, Pa.s
Speed 10 rpm
190
Malcom Thixotropic Index 0.5
IPC Slump A21 mm
25°C, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
0.10
0.33
IPC Slump A21 mm
182°C, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
0.20
0.33
DIRECTIONS FOR USE
Printing:
● LOCTITE GC 10 is available for stencil printing with Type 4
powder.
● Printing at speeds between 25 to 125 mms-1 can be achieved
using laser cut, electropolished or electroformed stencils with
metal squeegees.
Reflow:
● Suitable for convection, IR, hot belt and vapor phase.
● Proven profiles for multiple circuit board configurations.
Reflow Profile
TDS LOCTITE GC 10, May-2015
Cleaning:
● Cleaning Solder Paste from Stencils:
● LOCTITE GC 10 is a no-clean solder paste designed to be
left on the PCB in many applications post assembly; it does
not pose a hazard to long-term reliability
● For stencil cleaning and cleaning board misprints, LOCTITE
MSC 01 solvent cleaner is recommended
.
● Cleaning Solder Paste from Circuit Boards:
● Residues can be removed using conventional cleaning
processes based on solvents, such as LOCTITE MCF 800.
● Cleaning of some assemblies is best conducted in an
ultrasonic bath.
● Tap water is not recommended for rinsing. Ionic impurities
present in tap water can lead to reduced reliability of the
assembly.
.
RELIABILITY PROPERTIES
Solder Paste Medium:
LOCTITE GC 10 medium contains a stable resin system, slow
evaporating solvents and with minimal odor. The formulation has been
tested to the requirements of the ANSI/J-STD-004B for a type ROL0
classification specifications.
Test Specification Results
Flux Corrosion J-STD004B (2.6.15C) Pass
Copper Mirror J-STD004B (2.3.32D) Pass
Surface Insulation
Resistance (SIR)
J-STD004B (2.6.3.7) Pass
Electromigration (ECM) J-STD004B (2.6.14.1) Pass
Flux Activity Classification J-STD004B ROL0
PACKAGING
LOCTITE GC 10 is available in both jars and semco cartridges. Other
types of packaging may be available on request.
Storage:
Optimal storage: 5 to 26.5ºC
Storage information may be indicated on the product container
labelling. Material removed from containers may be contaminated
during use. Do not return products to the original container. Henkel
Corporation cannot assume responsibility for product that has been
contaminated or stored under conditions other than those previously
indicated. If additional information is required, please contact your
local Technical Service Center or Customer Service Representative.
Shelf Life:
Provided that LOCTITE GC 10 is stored in the original container, a
minimum shelf life of 365 days at 5 to 26.5˚C or 31 days at 40°C can
be expected.
Air shipment is recommended to minimize the time the containers are
exposed to higher temperatures.
DATA RANGES
The data contained herein may be reported as a typical value and/or a
range. Values are based on actual test data and are verified on a
periodic basis.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Not for Product Specifications
The technical information contained herein is intended for reference
only. Please contact Henkel Technologies Technical Service for
assistance and recommendations on specifications for this product.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
µm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing, Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits. The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office.
Reference 0.2
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