MIL SPECS 44E D MM 0000125 0033687 2 MEMILS i |The documentation and process conversion |measures necessary to comply with this [revision shall be completed by 23 MAR 94. TFT | INCH-POUND | Ly MIL-S-19500/231F 23 September 1993 SUPERSEDING MIL~S-19500/231E 10 March 1992 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING TYPES 1N3600, 1N4150-1, AND 1N415QUR-1 JAN, JANTX, AND JANTXV f | JANS1N4150-1 1s superseded by MIL-S-19500/609 | | JANS1N6640 (see 6.3 and 6.3.1). L i This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for silicon, switching diodes. Three levels of product assurance are provided for each device type as specified in MIL-S-19500 (see 6.2). 4.2 Physical dimensions. See figures 2, 3, and 4. 1.3. Maximum ratings. f T T T T t r T T Oo | Type | VBR) | Veun ! Ip VV | lism | ste Ty | Z53x(max) | Rest Cmax) | Redec, | [Tp = 10 LAI IT = 425C | ty = 1 Us IT) or Tee | | 2/ i T T y T F 1 | vde v_(pk) | me | A (pk) Cc/u | CW C/W | | | | | | | |1N3600 | 75 50 | 200 | 4.0 |-65 to +175 50 | 250 100 |1N4150-1 ; 75 50 | 200 | 4.0 [-65 to #175 50 | 250 100 L i 1 1 1 L J 1/ Derate at 2.0 mA dc/C above T, = +75C for axial lead L = 3/8 inches or derate 3.1 mA dc/C above Tec = 110C for UR suffix devices. 2/ For UR devices only. 1.4 Primary electrical characteristics at T, = +25C, unless otherwise indicated. T T T T T T 1 ! | Vey | Ve2 | Ves | Vea | Ves | Ty at | | Limits} Ip = 1 mA de | Ip = 10 mA de | I, = 50 mA de [1p = 100 mA de |I, = 200 mA de | | | | | (pulsed) (pulsed) j pulsed) IV, = 50 Vv t t + | V_de V_de | Vide Vdc | Vide | HA de | | | | | | [minimum| 0.540 0.660 | 0.760 0.820 | 0.870 a | | maximum 0.620 0.740 | 0.860 0.920 | 4.000 l 0.1 L | 1 | 1 J |Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of juse in improving this document should be addressed to: Commander, Defense Electronics Supply |Center, ATTN: DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5270 by using the Standarcization |Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.IL SPECS 44E D MM 0000325 0033688 4 MHMILS M1L-S-19500/231F 4.4 Primary electrical characteristics at T, = +25C, unless otherwise indicated - Continued. T T T 1 | Tho ! c | tert | Limits| Vp = 50 V de | Vp =O, f = T MHz; [Ip = Ip = 10 to 100 mA dc; | | | | | | | | T, = +150C = [ac signals = 50 mV (p-p) | R= 100 ohms + a ; | A | = | jminimum| == ----- | ---- | ---- | | max imum | 100 | 2.5 \ 4 L J. 1 1 __-1 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1. Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-$-19500 - Semiconductor Devices, General Specification for. STANDARDS MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 40, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets, or MS standards), the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500. Veg ct Forward recovery voltage. Specified maximum forward voltage used to determine forward recovery time. Current for testing reverse breakdown voltage. BR c. Endcap 1 EMIL SPECS 44E D MM 0000125 0033689 & MEMILS MIL-S-19500/231F 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500 and figures 2 and 3 herein. 3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750 and MIL-S-19500, and herein. Lead finish may be specified in the contract (see 6.2), without affecting the qualified product status of the device or applicable JAN marking. 3.3.2 Diode construction. ALL "-1" devices shall be metallurgically bonded double plug construction in accordance with the requirements of category I , II, or III (see MIL-S-19500). The UR version devices shall be structurally identical to the leaded devices, except for lead terminations. 3.4 Marking. Devices shall be marked as specified in MIL-S-19500. 3.4 1 Marking for U devices. For U version devices only, ali marking may be omitted from the body (except for 3.5), but shall be retained on the initial container. 3.5 Polarity. alternately, the polarity of all types shall be indicated with a contrasting color band to denote the cathode end. for UR suffix devices a minimum of three contrasting color dots spaced around the cathode end of the device may be used. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500 and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2.1 Construction verification. Cross sectional photos from 3 devices shall be submitted in the qualification report. 4.2.2 Group E inspection. Group inspection shall be in accordance with MIL~S$-19500 and table [1 herein. Thermal resistance read and record data shall be included in the qualification report.MIL SPECS 44E D MM O00003e5 0033690 ec MENILS MIL~S~19500/231F 4.3 Screening (JAN, JANTX, AND JANTXV levels only). Screening shall be in accordance with MIL-S-19500 (table II), and as specified herein. The following measurements shalt be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. | Screen (see Measurement table 11 of MIL-S-19500) JAN Level JANTX and JANTXV Levels 3a Temperature cycling per Temperature cycling per MIL-S-19500 "TX level". MIL-S-19500. 3c Thermal impedance Thermal impedance (see 4.5.5) (see 4.5.5) 9 Not applicable Not applicable 10 Not applicable Method 1038, condition A, t = 48 hours 11 Not applicable Ip4 and Ves 12 Not applicable Method 1038, condition B, t = 48 hours (see 4.3.1) 13 Not applicable Subgroup 2 of table I herein; Ip, = 100 percent 2/ 3/ of initial value or +40 nA dc, whichever is greater. | [AVp5 = #0.025 V (pk). | i I ~ Thermal impedance shall be performed any time after screen 3a, temperature cycling. Zeux need not be performed at screen 13 if performed prior to screen 13. PDA 5%, TON | ~~ ~ 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows (see 4.5.3): a. MIL-STD-750, method 1038, test condition B, T, = room ambient as defined in the general requirements of MIL-STD-750, (see 4.5), f = 56-60 Hz, Ig = 200 mA dc, Very = 50 Vpk). b. MIL-STD-750, method 1038, test condition B, Ty = 120C, I, = 33.75 mA dc. c. MIL-STD-750, method 1038, test condition 8, I, = 180 mA dc, T, = room ambient as defined in the general requirements of paragraph 4.5 of MIL-STD-750. 4.4 Quality conformance inspection. Quality conformance inspection shail be in accordance with MIL-S-19500, and as specified herein.MIL SPECS 44E D MM OO001eS 0033691 4 MEMILS MIL-S-19500/231F 4.41 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. Thermal impedance Z aux conditions are as follows: he tr 300 mA to 500 mA H ty = 10 ms Iy = 1 mA to 10 mA tup = 100 Us maximum 4.4.2 Group 8 inspection. Group 8 inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Electrical measurements (end-points) shall be in accordance with the applicable steps and footnotes of table III herein. 4.4.2.1 Group 8 inspection, table IVb (JAN, JANTX and JANTXV) of MIL-S-19500. Subgroup Method Condition 2 4066 Test condition A, Teom = 0.5 A (pk); Ip = 0; 10 surges at 1 per minute (max) surge; duration = 1 s. 3 1027 T, = room ambient as defined in the general requirements of MIL-STD-750, (see 4.5), f = 50-60 Hz (see 4.5.1); ly = 200 mA. Vp = Vay = 50 V (pk). 4 2075 See 4.5.4 herein. 5 3101 or See 4.5.6 herein. 4081 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500. Electrical measurements (end-points) shall be in accordance with the applicable steps of table III herein. 4.4.3.1 Group C inspection, table V of MIL-S-19500. Subgroup Method Condition 2 2036 Tension: Test condition A; weight 4 pounds; t = 15 +3 seconds. Lead fatigue: Test condition E; weight = 16 ounces. 6 1026 Ty = room ambient as defined in the general requirements of MIL-STD-750, (see 4.5), f = 50-60 Hz (see 4.5.1); I, = 200 mA. Ve = Veum = 50 V (pk). 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables as follows. 4.5.1 Life tests. AC tests shall be conducted with a half-sine wave of the peak voltage specified herein impressed across the diode in the reverse direction, followed by a half-sine waveform of the average rectified current specified herein. The forward conduction angle of the rectified current shall be not greater than 180 nor less than 150. 4.5.2 Forward recovery voltage and time. Forward recovery time shall be measured as the time interval between zero time and the point where the pulsed has decreased to 110 percent of the steady-state value of Ve when I, = as specified in Group A, subgroup 7. The maximum rise time of the response detector shall be 1 ns.MIL SPECS 44E D MM 0000125 0033692 & MMILS MIL-S-19500/231F 4.5 3 Pulse measurements. Conditions of pulsed measurements shall be specified in section 4 of MIL-STD-750. 4.5.4 Decap internal visual scribe and break for -1 devices (DPA). Scratch glass at cavity area with diamond scribe. Carefully snap open. Using 30X magnification examine the area where die (or bond material) are in contact with the plugs, verify metallurgical bonding area. If the verification of the metallurgical bonding area is in question, an engineering evaluation shall be performed and the devices disposition accordingly. 4.5.5 Thermal impedance (Zo y measurements). The Z jx Measurements shall be performed in accordance with MIL-STO-750, method 3101. The maximum Limit (not to exceed the Group A, Subgroup 2 Limit) for 2 wn screening (table II of MIL-S-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening Limit. In addition to screening, once a fixed Limit has been established, monitor all future sealing lots using a random five piece sample from each Lot to be plotted on the applicable xX, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the Line and held for Engineering evaluation and disposition. 4.5.5.1 Thermal impedance (Z@jy measurements) for initial qualification or requalification. The Zajy measurements shall be performed in accordance with MIL-STD-750, method 3101 (read and record date Zo). Z5dX shall be supplied on one lot (500 devices minimum and a thermal response curve shall be submitted). Twenty two of these samples shall be serialized and provided to the qualifying activity for correlation prior to shipment of parts. Measurements conditions shall be in accordance with 4.4.1. 4.5.6 Thermal resistance. Thermal resistance measurement shall be performed in accordance with MIL-STD- 730, method 3101 or 4081. Forced moving air or draft shall not be permitted across the devices during test. The maximum Limit for R under these test condition shall be R = 250C/W and R = 100C/W. . -. @JL @JEC (max) The following conditions shall apply: eJL (max) ly = 75 mA to 300 mA ty = 25 seconds minimum I, = 1 mA to 10 mA typ = 70 Us maximum LS = Lead spacing = 3/8 inch as defined on figure 1 LS = 0 for UR versions. COPPER LEAD CLAMP COPPER LEAD CLAMP INFINITE HEAT-DISSIPATOR FIGURE 1. Mounting arrangement.MIL SPECS WUE D MM OOOOleS 00335693 6 MENILS MIL-S~19500/231F TABLE I. Group A inspection. | | MIL~STD-750 Limits | Inspection 1/ Symbol Unit | | Method Conditions Min Max | Subgroup 1 iVisual and mechanical 2071 | examination \ | | Subgroup 2 | | | | | [Thermal impedance | 3101 |See 4.4.1 lZoax | {| 50 | C/W | | | | | | | | Forward voltage | 4071 {1, = 1 mA de [Veq {0.540 (0.620 | Vv de | | | | | Forward voltage | 4011 [Ip = 10 mA de [Veo [0.660 (0.740 | V de | | | | | | |Forward voltage | 4011 |I, = 50 mA dc (pulsed) see 4.5.1 IVex [0.760 |0.860 | V de | | | | | | | [Forward voltage 4071 |I, = 100 mA de (pulsed) see 4.5.1 v 0.820 {0.920 | V de | if pe |Forward voltage | 4011 [1p = 200 mA dc (pulsed) see 4.5.1 \Veg {0.870 [1.000 | Vv dc | | | | | | | [Breakdown voltage | 4021 | cer) = 10 WA de [eR | 75 | | V de [Reverse current | 4016 |DC method; Vp = 50 V de [Ip4 | {0.10 |pA de | | | | | | | cemwes || Po | | [High temperature | [T, = +150C | | | ! operation | | | | | | |Reverse current | 4016 [DC method; Va = 50 V de [Ipo | | 100 pA de | | | | | | | [ees ot td |Junction capacitance | 4001 [Vp = OV de; f = 1 MHz; Jc | | 2.5 | pF | | |V.;. = 50 mVp-p maximum | | | *' | | | | |Reverse recovery time | 4031 |Test condition A; Itap4 | | 4] ns | | lI = Ipy = 10 to 100 mA dc; | | | | l 1, = 180 ohms; C= 1 nF; R= 10002 | | | | | RCREC) = 10% Try | | | | | Subgroups 5 and 6 | | | | | | | | | | Not applicable | | | | | | | | | | | jaemer | | Poi dd {Forward recovery | 4026 |I, = 200 ma de; [Ve | | 5 |v (pk) | voltage and time | jt, = O.4 ns; (see 4.5.2) It i | 10] ns | i" ph 4/ For sampling plan, see MIL-S-19500.MIL SPECS WUE D MM O0001%e5 0033694 T MEMILS MIL-S-19500/231F TABLE II. Group E inspection (all quality levels) for qualification only. Inspection Vv | | Method MIL-STD-750 Conditions | | Sampling plan Subgroup 1 Subgroup 2 | | Intermittent Subgroup 3 Not applicable Subgroup 4 Subgroup 5 Electrical measurements | | | | | | | | | | | | | | | | Temperature shock (glass strain) operating life Thermal reststance Monitored mission temperature cycling Electrical measurement Electrical measurement | | | | | | | | | | | | | | | | | | | | | | | | | | | | 1056 1037 3101 or 4081 4055 | | | | | | | | | | | | | | | | | | 500 cycles See table III, steps 1, 2, and 3. 6,000 cycles; V Ip = 200 mA RWM = 50 V; See table III, steps 1, 2, and 3. See 4.5.6 See table 111, steps 1, 2, and 3 45 devices c |45 devices c 22 devices c 45 devices c 1/ For sampling plan, see MIL-S-19500.MIL SPECS WUE D MM 0000325 0033695 1 MEMILS MIL-S-19500/231F TABLE III. Groups A, B, C, and electrical measurements. 1/ 2/ | | | | I MIL-STD=750 Limits |Step | Inspection Symbol Unit | | | | | Method Conditions Min Max iI | | 1 |Forward voltage 4011 {1, = 200 mA de Ves 0.870 1.000 | V de | | (pulsed) | | | | 2 |Reverse current 4016 |DC method; | Ipy | | 0.10 |paA de | pers pp | 3 |Thermal impedance | 3101 |see 4.5.5 lZosx | | 50 | c/w | i | | | ! | | 1/ The electrical measurements for table IVb of MIL-S-19500 are as follows: Subgroups 2, 3, and 6, see table III herein, steps 1, 2, and 3. 2/ The electrical measurements for table V of MIL-S-19500 are as follows: Subgroups 2 and 6, see table III herein, steps 1, 2, and 3.MIL SPECS WUE D MM O00001e5 0033656 3 MEMILS MIL-S-19500/231F NOTES: WN? aw i t T T 7 | | | Dimensions | | | | T | | | Types | Symbol | Inches | Millimeters | Notes | | [ + | | | | } Min | Max | Min {| Max | L | { J 4 | J f q q T t y T 1 | | a | .440 | .300 | 3.56] 7.62 | | | . f t t | { | 1n3600 | g@BCOT:CwOS6 | 107 | 1.42 | 2.72 | 3,4 | | +} +} + | | } 1.000 | 1.500 | 25.40 | 38.10 | 2 | | t t t { | go | .018 | .022| 0.46) 0.56] 6 | t t t t t t | | { A { .140 | .180 | 3.56 | 4.57] 5 | | + t t t t | | ge | 056} .075 | 1.42 | 1.91 | 3,4 | | 1NG150-1 + ! | | c | 1.000 | 1.500 | 25.40 | 38.10 | 2 | | t + t t | | g> |} .018 | .022 | 0.46 | 0.56] 6 | l 1 i i 1 1 L t Metric equivalents are given for general information only. Both leads shall be within the specified Limits (see 3.3.1). The maximum diameter of dimension B shall apply over full Length of dimension A. The minimum diameter of dimension 6 shall apply over at least .075 inch (1.91 mm) of dimension A. Ferrule is optional on type 1N3600 and 1N4150-1 for dimension A. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and 1.00 inches (25.4 mm) from the diode body to the end of the lead. Outside of this zone the lead diameter shall not exceed diameter 6. FIGURE 2. Physical dimensions (types 1N3600_ and 1N4150-1). 10MIL SPECS G T 1 | | Dimensions | f 1 | | Symbol | Inches | Millimeters | } tT | 1 | | | Min | Max | Min | Max | L 1 4 1 { J r T 1 1 T 1 | @> | .063 | .067 | 1.60 | 1.70 | t 1 t | j | t y y T T \ | F | .016 | .022 | 0.41 | 0.55 | pF} | G | 430 | .146 | 3.30 | 3.70 | | pt | G | .100 ref | 2.54 ref no ! {| Ss | .001 min | 0.03 min L a l j NOTES: 1. Dimensions are in inches. FIGURE 3. 2. WUE D Mm Ooo01eS MIL-S-19500/231F Metric equivalent are given Physical dimensions and configuration for IN4150UR-1 (DO-213AA). 41 for general information only. OO 003369? 5 MMMILSMIL SPECS WOE D MM 0000125 00336548 7? MBNILS MIL-S-19500/231F 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Issue of DODISS to be cited in the solicitation. b. Lead finish as specified (see 3.3.1). d. Type designation and product assurance level. 6.3 Substitution information. The 1N6640 (MIL-S-19500/609) supersedes the 1N4150-1. The JANS1N6640 supersedes the JANS1N4150-1. Existing stock of JANSIN4150-1 may be used until exhausted. 6.3.1 Cross reference supersession List. JANS Level will no longer be built to this specification. Devices in stock are acceptable provided the date code does not exceed the date of implementation of this specification. Devices required for space flight applications are found on MIL-S-19500/609. A PIN for PIN replacement table follows, and these devices are directly interchangeable: , JANS Nonpreferred PIN JANS Preferred PIN 1 | | | 1N4150-1 1N6640 | __} 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER Navy - EC Navy - EC Air Force - 17 Agent: NASA - NA DLA - ES Review activities: (Project 5961-1379) Army - AR, AV, MI Air Force - 85, 9 DLA - ES User activities: Army - SM Navy - AS, CG, MC, OS, SH Air Force - 19 12