0854350701 - MOLEX - Datasheet.Live

Film Capacitors

Metallized Polypropylene Film Capacitors (MKP)

Series/Type: B32774 ... B32778

Date: February 2017

information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Recommended applications

Frequency converters

Industrial and high-end power supplies

Solar inverters

Climatic

Max. operating temperature: 105 °C (case)

Climatic category (IEC 60068-1): 40/105/56

Construction

Dielectric: Polypropylene (MKP)

Plastic case (UL 94 V-0)

Epoxy resin sealing (UL 94 V-0)

Features

Capacitance values up to 480 µF

High CV product, compact

Good self-healing properties

Over-voltage capability

Low losses with high current capability

High reliability

Long useful life

RoHS-compatible

Terminals

Parallel wire leads, lead-free tinned

2-pin, 4-pin and 12-pin versions

Standard lead lengths: 6 1 mm

Marking

Manufacturer's logo and lot number,

date code, rated capacitance (coded),

capacitance tolerance (code letter) and

rated DC voltage

Delivery mode

Bulk (untaped)

Metallized polypropylene film capacitors (MKP) B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 2 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Dimensional drawings

Dimensions in mm

Number of wires Lead spacing ±0.4 Lead diameter d1±0.05 Type

2-pin 27.5 0.8 B32774D

2-pin 37.5 1.0 B32776E

2-pin 37.5 1.0 B32776T

4-pin 37.5 1.2 B32776G

4-pin 37.5 1.2 B32776T

4-pin 52.5 1.2 B32778T

4-pin 52.5 1.2 B32778G

12-pin 52.5 1.2 B32778J

Dimensional drawings 2-pin versions

B32774D, B32776E

B32774D B32776E

Lead spacing ±0.4: 27.5 37.5

Lead diameter d1: 0.8 1.0

(Dimensions in mm)

B32776T (low profile)

Lead spacing ±0.4: 37.5

Lead diameter d1: 1.0

(Dimensions in mm)

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 3 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Dimensional drawings 4-pin versions

B32776G, B32778G

B32776G B32778G

Lead spacing ±0.4: 37.5 52.5

Lead diameter d1: 1.2 1.2

(Dimensions in mm)

B32776T, B32778T (low profile)

B32776T B32778T

Lead spacing ±0.4: 37.5 52.5

Lead diameter d1: 1.2 1.2

(Dimensions in mm)

Dimensional drawing 12-pin version

B32778J

Lead spacing ±0.4: 52.5

Lead diameter d1: 1.2

(Dimensions in mm)

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 4 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Overview of available types

Lead spacing 27.5 mm 37.5 mm

Type B32774 B32776

Page 7 8

VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300

CR(µF)

1.5

2.0

2.7

3.0

3.3

3.5

3.9

5.0

6.8

7.0

7.5

8.0

8.5

9.0

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 5 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Lead spacing 52.5 mm

Type B32778

Page 11

VR(V DC) 450 575 800 900 1100 1300

CR(µF)

100

110

120

130

150

170

180

200

210

270

360

480

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 6 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 27.5 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC

5.0 11.0 ×21.0 ×31.5 B32774D4505+000 5.0 21.1 19.0 1.2 10.7 2352

10.0 15.0 ×24.5 ×31.5 B32774D4106+000 8.0 10.9 24.0 1.2 11.0 1680

22.0 22.0 ×36.5 ×31.5 B32774D4226+000 14.5 5.4 30.0 1.3 12.1 784

VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC

3.0 11.0 ×21.0 ×31.5 B32774D8305+000 4.5 24.8 19.0 0.9 7.6 2352

5.0 14.0 ×24.5 ×31.5 B32774D8505+000 6.5 15.3 23.0 0.9 7.7 1848

12.0 22.0 ×36.5 ×31.5 B32774D8126+000 13.0 6.8 34.0 1.0 8.3 784

VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC

2.0 12.5 ×21.5 ×31.5 B32774D0205+000 4.5 26.3 19.0 0.7 5.3 2100

3.3 18.0 ×27.5 ×31.5 B32774D0335+000 7.0 16.2 22.0 0.7 5.4 1428

5.0 19.0 ×30.0 ×31.5 B32774D0505+000 9.0 10.9 27.0 0.7 5.5 896

7.0 22.0 ×36.5 ×31.5 B32774D0705+000 12.0 8.1 30.0 0.7 5.8 784

VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC

1.5 12.5 ×21.5 ×31.5 B32774D1155K000 4.4 31.3 20.0 0.6 4.8 2100

3.0 18.0 ×27.5 ×31.5 B32774D1305K000 7.0 16.0 24.0 0.6 4.9 1428

5.0 22.0 ×36.5 ×31.5 B32774D1505K000 10.5 9.8 33.0 0.7 5.1 784

B32774

MKP DC link high density series up to 480 µF

Page 7 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 37.5 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC

12 24.0 ×15.0 ×41.5 B32776T4126K000 7.0 17.1 19.0 2.2 21.0 1040

16 24.0 ×19.0 ×41.5 B32776T4166K000 8.0 13.0 18.0 2.3 21.2 780

30 20.0 ×39.5 ×41.5 10.2 B32776G4306+000 14.0 7.0 11.0 2.3 21.3 640

30 20.0 ×39.5 ×41.5 B32776E4306+000 14.0 7.3 28.0 2.4 22.3 640

35 28.0 ×37.0 ×42.0 10.2 B32776G4356+000 16.5 6.0 10.0 2.3 21.4 440

35 28.0 ×37.0 ×42.0 B32776E4356+000 16.0 6.4 24.0 2.4 22.6 440

40 28.0 ×37.0 ×42.0 10.2 B32776G4406+000 17.5 5.3 11.0 2.3 21.4 440

40 28.0 ×37.0 ×42.0 B32776E4406+000 17.0 5.6 26.0 2.4 22.7 440

40 43.0 ×22.0 ×41.5 20.3 B32776T4406K000 17.0 5.2 13.0 2.3 21.2 280

50 28.0 ×42.5 ×41.5 10.2 B32776G4506+000 20.0 4.3 12.0 2.3 21.7 440

50 28.0 ×42.5 ×41.5 B32776E4506+000 19.0 4.7 30.0 2.5 23.8 440

60 30.0 ×45.0 ×42.0 20.3 B32776G4606+000 23.5 3.6 14.0 2.4 22.3 400

60 30.0 ×45.0 ×42.0 B32776E4606+000 22.0 4.0 32.0 2.5 24.2 400

65 33.0 ×48.0 ×42.0 20.3 B32776G4656+000 25.5 3.3 14.0 2.3 22.2 180

VR,70 °C= 575 V DC, Vop,85 °C= 500 V DC

8.5 24.0 ×15.0 ×41.5 B32776T5855+000 6.5 19.9 19.0 1.9 17.2 1040

12 24.0 ×19.0 ×41.5 B32776T5126K000 8.0 14.4 18.0 1.9 17.4 780

25 20.0 ×39.5 ×41.5 10.2 B32776G5256K000 14.0 7.0 12.0 1.9 17.5 640

25 20.0 ×39.5 ×41.5 B32776E5256K000 13.5 7.4 28.0 2.0 18.3 640

30 28.0 ×37.0 ×42.0 10.2 B32776G5306K000 16.5 5.8 11.0 1.9 17.6 440

30 28.0 ×37.0 ×42.0 B32776E5306K000 16.5 6.1 26.0 2.0 18.5 440

30 43.0 ×22.0 ×41.5 20.3 B32776T5306K000 16.5 5.8 13.0 1.9 17.3 280

35 28.0 ×42.5 ×41.5 10.2 B32776G5356+000 19.0 5.0 12.0 1.9 17.8 440

35 28.0 ×42.5 ×41.5 B32776E5356+000 18.0 5.3 29.0 2.0 19.0 440

45 30.0 ×45.0 ×42.0 20.3 B32776G5456K000 22.0 4.0 13.0 1.9 17.9 400

45 30.0 ×45.0 ×42.0 B32776E5456K000 21.0 4.4 32.0 2.1 19.7 400

50 33.0 ×48.0 ×42.0 20.3 B32776G5506K000 25.0 3.5 14.0 2.0 18.1 180

B32776

MKP DC link high density series up to 480 µF

Page 8 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 37.5 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC

6.8 24.0 ×15.0 ×41.5 B32776T8685+000 6.0 22.1 18.0 1.7 15.1 1040

8.5 24.0 ×19.0 ×41.5 B32776T8855+000 7.5 17.8 18.0 1.7 15.1 780

14 18.0 ×32.5 ×41.5 B32776E8146+000 10.0 11.5 23.0 1.8 16.3 720

15 20.0 ×39.5 ×41.5 10.2 B32776G8156+000 12.0 9.6 10.0 1.7 15.2 640

15 20.0 ×39.5 ×41.5 B32776E8156+000 11.5 10.3 24.0 1.7 15.7 640

20 28.0 ×37.0 ×42.0 10.2 B32776G8206+000 14.5 7.5 10.0 1.7 15.3 440

20 28.0 ×37.0 ×42.0 B32776E8206+000 14.5 7.8 24.0 1.7 15.9 440

20 43.0 ×22.0 ×41.5 20.3 B32776T8206K000 14.5 7.2 14.0 1.7 15.1 280

22 28.0 ×37.0 ×42.0 10.2 B32776G8226+000 15.5 6.8 11.0 1.7 15.3 440

22 28.0 ×37.0 ×42.0 B32776E8226+000 15.0 7.1 25.0 1.7 16.0 440

25 28.0 ×42.5 ×41.5 10.2 B32776G8256+000 17.0 6.1 11.0 1.7 15.4 440

25 28.0 ×42.5 ×41.5 B32776E8256+000 16.5 6.4 28.0 1.8 16.3 440

30 30.0 ×45.0 ×42.0 20.3 B32776G8306+000 19.5 5.1 12.0 1.7 15.6 400

30 30.0 ×45.0 ×42.0 B32776E8306+000 19.0 5.5 30.0 1.8 16.7 400

35 33.0 ×48.0 ×42.0 20.3 B32776G8356+000 22.0 4.3 14.0 1.7 15.7 180

VR,70 °C= 900 V DC, Vop,85 °C= 800 V DC

5 24.0 ×15.0 ×41.5 B32776T9505+000 5.5 26.1 19.0 1.5 13.4 1040

7.5 24.0 ×19.0 ×41.5 B32776T9755K000 7.5 17.8 18.0 1.5 13.5 780

15 20.0 ×39.5 ×41.5 10.2 B32776G9156K000 12.5 9.1 12.0 1.5 13.6 640

15 20.0 ×39.5 ×41.5 B32776E9156K000 12.0 9.4 28.0 1.5 14.1 640

16 43.0 ×22.0 ×41.5 20.3 B32776T9166K000 14.0 8.1 14.0 1.5 13.5 280

20 28.0 ×37.0 ×42.0 10.2 B32776G9206K000 15.0 7.0 11.0 1.5 13.6 440

20 28.0 ×37.0 ×42.0 B32776E9206K000 15.0 7.3 26.0 1.6 14.2 440

22 28.0 ×42.5 ×41.5 10.2 B32776G9226K000 17.0 6.3 12.0 1.5 13.7 440

22 28.0 ×42.5 ×41.5 B32776E9226K000 16.5 6.6 29.0 1.6 14.5 440

25 30.0 ×45.0 ×42.0 20.3 B32776G9256+000 19.0 5.5 13.0 1.5 13.8 400

25 30.0 ×45.0 ×42.0 B32776E9256+000 18.5 5.9 32.0 1.6 14.7 400

30 33.0 ×48.0 ×42.0 20.3 B32776G9306+000 21.5 4.7 14.0 1.5 13.9 180

B32776

MKP DC link high density series up to 480 µF

Page 9 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 37.5 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC

3.9 24.0 ×15.0 ×41.5 B32776T0395+000 5.0 30.5 18.0 1.4 12.1 1040

5 24.0 ×19.0 ×41.5 B32776T0505+000 6.5 23.6 18.0 1.4 12.1 780

12 20.0 ×39.5 ×41.5 10.2 B32776G0126+000 12.0 10.2 12.0 1.4 12.2 640

12 20.0 ×39.5 ×41.5 B32776E0126+000 11.5 10.5 28.0 1.4 12.6 640

13 43.0 ×22.0 ×41.5 20.3 B32776T0136K000 13.0 8.9 14.0 1.4 12.1 280

14 28.0 ×37.0 ×42.0 10.2 B32776G0146+000 13.5 8.7 21.0 1.4 12.2 440

14 28.0 ×37.0 ×42.0 B32776E0146+000 13.5 9.0 25.0 1.4 12.6 440

16 28.0 ×42.5 ×41.5 10.2 B32776G0166+000 15.5 7.4 12.0 1.4 12.3 440

16 28.0 ×42.5 ×41.5 B32776E0166+000 15.0 7.8 30.0 1.4 12.9 440

20 30.0 ×45.0 ×42.0 20.3 B32776G0206+000 18.0 6.0 14.0 1.4 12.4 400

20 30.0 ×45.0 ×42.0 B32776E0206+000 17.5 6.5 32.0 1.4 13.1 400

22 33.0 ×48.0 ×42.0 20.3 B32776G0226+000 21.0 4.9 15.0 1.3 11.4 180

VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC

2.7 24.0 ×15.0 ×41.5 B32776T1275+000 5.0 34.7 19.0 1.1 9.6 1040

3.5 24.0 ×19.0 ×41.5 B32776T1355+000 6.0 27.4 18.0 1.1 9.7 780

8.0 20.0 ×39.5 ×41.5 10.2 B32776G1805+000 11.0 12.1 12.0 1.1 9.7 640

8.0 20.0 ×39.5 ×41.5 B32776E1805+000 10.5 12.4 24.0 1.2 10.0 640

9.0 43.0 ×22.0 ×41.5 20.3 B32776T1905K000 12.0 10.7 13.0 1.1 9.7 280

10 28.0 ×37.0 ×42.0 10.2 B32776G1106+000 13.0 9.6 11.0 1.1 9.7 440

10 28.0 ×37.0 ×42.0 B32776E1106+000 12.5 9.9 26.0 1.2 10.0 440

12 28.0 ×42.5 ×41.5 10.2 B32776G1126+000 14.5 8.1 12.0 1.1 9.8 440

12 28.0 ×42.5 ×41.5 B32776E1126+000 14.0 8.5 28.0 1.2 10.1 440

14 30.0 ×45.0 ×42.0 20.3 B32776G1146+000 17.0 6.8 14.0 1.1 10.1 400

14 30.0 ×45.0 ×42.0 B32776E1146+000 16.5 7.3 32.0 1.2 10.4 400

16 33.0 ×48.0 ×42.0 20.3 B32776G1166+000 19.0 6.0 15.0 1.1 9.9 180

B32776

MKP DC link high density series up to 480 µF

Page 10 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 52.5 mm, P1= 20.3 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 450 V DC, Vop,85 °C= 450 V DC

55 43.0 ×24.0 ×57.5 B32778T4556K000 16.5 7.2 13.0 4.3 41.7 420

75 30.0 ×45.0 ×57.5 B32778G4756+000 21.0 5.6 12.0 4.4 42.6 280

80 30.0 ×45.0 ×57.5 B32778G4806+000 21.5 5.3 13.0 4.4 42.7 280

100 35.0 ×50.0 ×57.5 B32778G4107+000 26.0 4.3 14.0 4.5 43.3 108

110 35.0 ×50.0 ×57.5 B32778G4117K000 27.0 3.9 15.0 4.5 43.6 108

150 130.0 ×24.0 ×57.5 B32778J4157K000 43.5 2.7 4.0 4.4 42.1 80

170 45.0 ×57.0 ×57.5 B32778G4177+000 36.5 2.6 17.0 4.6 45.7 140

180 60.0 ×45.0 ×57.5 B32778G4187+000 39.0 2.5 19.0 4.6 44.6 200

480 130.0 ×58.0 ×57.5 B32778J4487K000 79.5 0.9 6.0 4.8 45.4 40

VR,70 °C= 575 V DC, Vop,85 °C= 500 V DC

40 43.0 ×24.0 ×57.5 B32778T5406K000 15.5 8.5 13.0 3.6 34.5 420

60 30.0 ×45.0 ×57.5 B32778G5606+000 20.5 5.8 13.0 3.7 35.3 280

80 35.0 ×50.0 ×57.5 B32778G5806+000 25.5 4.4 15.0 3.7 36.0 108

110 130.0 ×24.0 ×57.5 B32778J5117K000 40.5 3.0 5.0 3.6 34.5 80

120 45.0 ×57.0 ×57.5 B32778G5127+000 34.5 3.1 17.0 3.8 37.2 140

130 60.0 ×45.0 ×57.5 B32778G5137+000 36.5 2.8 19.0 3.8 36.7 200

360 130.0 ×58.0 ×57.5 B32778J5367K000 75.0 1.0 6.0 4.0 37.3 40

VR,70 °C= 800 V DC, Vop,85 °C= 700 V DC

30 43.0 ×24.0 ×57.5 B32778T8306K000 14.5 9.8 14.0 3.2 30.2 420

45 30.0 ×45.0 ×57.5 B32778G8456+000 19.5 6.6 14.0 3.2 30.9 280

50 30.0 ×45.0 ×57.5 B32778G8506+000 20.0 6.3 13.0 3.2 30.9 280

55 35.0 ×50.0 ×57.5 B32778G8556+000 23.0 5.6 14.0 3.2 31.1 108

60 35.0 ×50.0 ×57.5 B32778G8606+000 23.5 5.1 15.0 3.3 31.2 108

80 130.0 ×24.0 ×57.5 B32778J8806K000 37.5 3.6 4.0 3.2 30.2 80

90 45.0 ×57.0 ×57.5 B32778G8906+000 32.5 3.5 17.0 3.3 32.2 140

100 60.0 ×45.0 ×57.5 B32778G8107+000 34.5 3.2 19.0 3.3 31.9 200

270 130.0 ×58.0 ×57.5 B32778J8277K000 70.5 1.2 6.0 3.5 32.4 40

B32778

MKP DC link high density series up to 480 µF

Page 11 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ∆T≤20 °C at ∆ESRtyp ≤ ±5%

3) Typical ESL value measured at resonance frequency (see specific graphs of Z vs freq)

Ordering codes and packing units (lead spacing 52.5 mm, P1= 20.3 mm)

CR1)

µF

Max. dimensions

w×h×l

Ordering code

(composition see

below)

IRMS,max2)

70 °C

10 kHz

ESRtyp

70 °C

10 kHz

mΩ

ESLtyp3)

70 °C

10 kHz

tan δ

1 kHz

10-3

tan δ

10 kHz

10-3

pcs.

MOQ

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code:

J = ±5%

K = ±10%

VR,70 °C= 900 V DC, Vop,85 °C= 800 V DC

25 43.0 ×24.0 ×57.5 B32778T9256K000 13.5 10.7 13.0 2.8 26.8 420

35 30.0 ×45.0 ×57.5 B32778G9356+000 18.0 7.7 13.0 2.9 27.3 280

50 35.0 ×50.0 ×57.5 B32778G9506K000 22.5 5.6 15.0 2.9 27.7 108

70 45.0 ×57.0 ×57.5 B32778G9706+000 31.0 3.8 18.0 3.0 28.5 140

70 130.0 ×24.0 ×57.5 B32778J9706K000 36.0 3.8 4.0 2.9 27.2 80

75 60.0 ×45.0 ×57.5 B32778G9756+000 32.5 3.6 20.0 2.9 28.2 200

210 130.0 ×58.0 ×57.5 B32778J9217K000 66.0 1.3 6.0 3.1 28.6 40

VR,70 °C= 1100 V DC, Vop,85 °C= 920 V DC

20 43.0 ×24.0 ×57.5 B32778T0206K000 13.0 11.9 13.0 2.6 24.1 420

30 30.0 ×45.0 ×57.5 B32778G0306+000 17.5 8.2 13.0 2.6 24.5 280

40 35.0 ×50.0 ×57.5 B32778G0406+000 21.5 6.2 15.0 2.7 25.9 108

58 45.0 ×57.0 ×57.5 B32778G0586+000 29.0 4.3 17.0 2.7 25.4 140

60 60.0 ×45.0 ×57.5 B32778G0606+000 30.5 4.0 19.0 2.7 25.2 200

60 130.0 ×24.0 ×57.5 B32778J0606K000 34.5 4.1 4.0 2.7 25.1 80

200 130.0 ×58.0 ×57.5 B32778J0207K000 66.0 1.4 6.0 3.0 26.8 40

VR,70 °C= 1300 V DC, Vop,85 °C= 1100 V DC

14 43.0 ×24.0 ×57.5 B32778T1146K000 12.0 13.8 13.0 2.1 19.5 420

20 30.0 ×45.0 ×57.5 B32778G1206+000 16.0 9.7 13.0 2.1 19.8 280

25 35.0 ×50.0 ×57.5 B32778G1256+000 19.0 7.8 15.0 2.1 19.9 108

27 35.0 ×50.0 ×57.5 B32778G1276+000 19.5 7.3 15.0 2.1 20.0 108

38 130.0 ×24.0 ×57.5 B32778J1386K000 31.5 5.1 4.0 2.1 19.5 80

40 45.0 ×57.0 ×57.5 B32778G1406+000 26.5 5.0 17.0 2.2 20.3 140

42 60.0 ×45.0 ×57.5 B32778G1426+000 28.0 4.7 19.0 2.2 20.2 200

120 130.0 ×58.0 ×57.5 B32778J1127K000 58.5 1.7 6.0 2.3 20.5 40

B32778

MKP DC link high density series up to 480 µF

Page 12 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Technical data

Reference standard: IEC 61071.

All data given at T = 20 °C, unless otherwise specified.

Operating temperature range (case) Max. operating temperature, Top,max

Upper category temperature Tmax

Lower category temperature Tmin

+105 °C

–40 °C

Insulation Resistance Rins

given as time constant

τ= CRRins, rel. humidity ≤65%

(minimum as-delivered values)

τ> 10 000 s (after 1 min.)

For VR≥500 V measured at 500 V

For VR< 500 V measured at VR

DC test voltage between terminals (10 s) 1.5 VR

Voltage test terminal to case (10 s) 2110 V AC, 50 Hz

Pulse Handling Capability (V/µs) IP(A) / C (µF)

Reliability: Failure rate λ10 fit (≤110-9/h) at 0.5 VR,40°C

For conversion to other operating conditions and

temperatures, refer to chapter "Quality, 2 Reliability".

Service life tSL 100 000 h at VRand 70 °C

VR(V DC) 450 575 800 900 1100 1300

Continuous operation voltage

Vop (V DC) at 70 °C

450 575 800 900 1100 1300

Continuous operation voltage

Vop (V DC) at 85 °C

450 500 700 800 920 1100

For temperatures between

85 °C and 105 °C

1.33%/°C of Vop derating compared to Vop at 85 °C

Typical waveforms

Restrictions:

VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which

the capacitor has been designed for continuous operation.

AC ≤0.2 VR

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 13 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Overvoltage Maximum duration within one day Observation

1.1 VR

1.15 VR

1.2 VR

1.3 VR

30% of on-load duration

30 min.

5 min.

1 min.

System regulation

NOTE 1 An overvoltage equal to 1.5 VRfor 30 ms is permitted 1000 times during the life of

the capacitor.

The amplitudes of the overvoltages that may be tolerated without significant reduction in the life

time of the capacitor depend on their duration, the number of application and the capacitor

temperature.

In addition these values assume that the overvoltages may appear when the internal

temperature of the capacitor is less than 0 °C but within the temperature category.

NOTE 2 The average applied voltage must not be higher than the specified voltage.

Pulse handling capability

"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal

voltages, expressed in V/µs.

Note:

The values of dV/dt provided below must not be exceeded in order to avoid damaging the

capacitor.

dV/dt values

Lead spacing 27.5 mm 37.5 mm

Type B32774 B32776

VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300

dV/dt in V/µs 30 40 75 100 21 22 22 35 54 73

Lead spacing 52.5 mm

Type B32778

VR(V DC) 450 575 800 900 1100 1300

dV/dt in V/µs 14 14 15 22 35 50

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 14 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Additional technical information can be found under "Design support" on www.epcos.com

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 27.5 mm / B32774D4* Lead spacing 27.5 mm / B32774D4*

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 27.5 mm / B32774D8* Lead spacing 27.5 mm / B32774D8*

B32774

MKP DC link high density series up to 480 µF

Page 15 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 27.5 mm / B32774D0* Lead spacing 27.5 mm / B32774D0*

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 27.5 mm / B32774D1* Lead spacing 27.5 mm / B32774D1*

B32774

MKP DC link high density series up to 480 µF

Page 16 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E4x Lead spacing 37.5 mm / B32776-E4x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G4x Lead spacing 37.5 mm / B32776-G4x

B32776

MKP DC link high density series up to 480 µF

Page 17 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E5x Lead spacing 37.5 mm / B32776-E5x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G5x Lead spacing 37.5 mm / B32776-G5x

B32776

MKP DC link high density series up to 480 µF

Page 18 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E8x Lead spacing 37.5 mm / B32776-E8x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G8x Lead spacing 37.5 mm / B32776-G8x

B32776

MKP DC link high density series up to 480 µF

Page 19 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E9x Lead spacing 37.5 mm / B32776-E9x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G9x Lead spacing 37.5 mm / B32776-G9x

B32776

MKP DC link high density series up to 480 µF

Page 20 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E0x Lead spacing 37.5 mm / B32776-E0x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G0x Lead spacing 37.5 mm / B32776-G0x

B32776

MKP DC link high density series up to 480 µF

Page 21 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-E1x Lead spacing 37.5 mm / B32776-E1x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-G1x Lead spacing 37.5 mm / B32776-G1x

B32776

MKP DC link high density series up to 480 µF

Page 22 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-Tx / 2-pins Lead spacing 37.5 mm / B32776-Tx / 2-pins

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 37.5 mm / B32776-Tx / 4-pins Lead spacing 37.5 mm / B32776-Tx / 4-pins

B32776

MKP DC link high density series up to 480 µF

Page 23 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G4x Lead spacing 52.5 mm / B32778-G4x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G5x Lead spacing 52.5 mm / B32778-G5x

B32778

MKP DC link high density series up to 480 µF

Page 24 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G8x Lead spacing 52.5 mm / B32778-G8x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G9x Lead spacing 52.5 mm / B32778-G9x

B32778

MKP DC link high density series up to 480 µF

Page 25 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G0x Lead spacing 52.5 mm / B32778-G0x

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-G1x Lead spacing 52.5 mm / B32778-G1x

B32778

MKP DC link high density series up to 480 µF

Page 26 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-Tx Lead spacing 52.5 mm / B32778-Tx

Impedance Z versus frequency f

(typical values)

ESR versus frequency f

(typical values)

Lead spacing 52.5 mm / B32778-Jx Lead spacing 52.5 mm / B32778-Jx

B32778

MKP DC link high density series up to 480 µF

Page 27 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Permissible current IRMS versus frequency f at 70 °C

Lead spacing 27.5 mm

B32774-Dx

B32774

MKP DC link high density series up to 480 µF

Page 28 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Permissible current IRMS versus frequency f at 70 °C

Lead spacing 37.5 mm

B32776-Ex

B32776-Gx

B32776

MKP DC link high density series up to 480 µF

Page 29 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Permissible current IRMS versus frequency f at 70 °C

Lead spacing 37.5 mm

B32776-Tx

B32776

MKP DC link high density series up to 480 µF

Page 30 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Permissible current IRMS versus frequency f at 70 °C

Lead spacing 52.5 mm

B32778-Gx, 4 pins

B32778-Tx, 4 pins

B32778

MKP DC link high density series up to 480 µF

Page 31 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Characteristics curves

Permissible current IRMS versus frequency f at 70 °C

Lead spacing 52.5 mm

B32778-Jx, 12 pins

B32778

MKP DC link high density series up to 480 µF

Page 32 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Curves Characteristics (Irms derating vs temperature)

Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor ×IRMS (70 °C)

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 33 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Heat transference for self heating calculation

Figure 1

Box dimensions Equivalent heat

coefficient

w (mm) h (mm) l (mm) G (mW/°C)

11.0 19.0 31.5 25

11.0 21.0 31.5 28

12.5 21.5 31.5 30

13.5 23.0 31.5 32

14.0 24.5 31.5 35

15.0 24.5 31.5 36

16.0 32.0 31.5 45

18.0 27.5 31.5 44

18.0 33.0 31.5 48

19.0 30.0 31.5 48

20.0 11.0 31.5 65

21.0 31.0 31.5 51

22.0 36.5 31.5 58

12.0 22.0 41.5 70

14.0 25.0 41.5 43

16.0 28.5 41.5 50

18.0 32.5 41.5 59

20.0 39.5 41.5 72

24.0 19.0 41.5 50

24.0 15.0 41.5 44

28.0 37.0 42.0 83

28.0 42.5 41.5 90

30.0 45.0 42.0 100

33.0 48.0 42.0 100

43.0 22.0 41.5 80

30.0 45.0 57.5 125

35.0 50.0 57.5 145

43.0 24.0 57.5 103

45.0 57.0 57.5 185

60.0 45.0 57.5 192

130.0 24.0 57.5 200

130.0 58.0 57.5 300

The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral

surface of the plastic box as figure1 shows. By using a thermocouple and avoiding effect of

radiation and convection the temperature measured during operation conditions should be a

result of the dissipated power divided by the equivalent heat coefficient.

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 34 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Self Heating by power dissipation & equivalent heat coefficient

The IRMS and consequently the power dissipation must be limited during operation in order to not

exceed the maximum limit of ∆T allowed for this series. ∆Tmax given for this series is equal or

lower than 20 °C at rated temperature (70 °C), for higher ambient temperatures ∆Tmax (T) will have

the same derating factor than IRMS vs temperature and then an equivalent derating as per:

ambient temperatures ∆Tmax (T) will have the same derating factor than IRMS vs temperature and

then an equivalent derating as per:

∆Tmax (T) = (Factor)2× ∆T (70 °C).

For any particular IRMS the ∆T may be calculated by:

∆T (°C) = Pdis (mW) / G(mW/°C).

Where ∆T (°C) is the difference between the temperature measured on the box (see figure 1) and

the ambient temperature when capacitor is working during normal operation;

∆T (°C) = Top (°C) TA(°C).

It represents the increasing of temperature provoked by the IRMS during operation.

G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated

power defined by:

Pdis (mW) = ESRtyp (mΩ)×Irms2(ARMS).

Example for thermal calculation:

We will take as reference B32778G0306K (30 µF/1100 V) type for thermal calculation.

Considering the following load and capacitor characteristics:

IRMS : 12 ARMS at 20 kHz TA:85°C 30 ×45 ×57.5 box

G (mW/°C): 125

Then we have to find the ESRtyp at 20 kHz what is approx . 8.2 mΩ.

So according to:

Pdis (mW) = ESRtyp (mΩ)×Irms2(ARMS)

we have the following:

Pdis (mW) = 8.2 mΩ×12 ARMS2= 1181 mW

and as per: ∆T (°C) = Pdis (mW) / G (mW/°C)

we have the following: ∆T (°C) = 1181 (mW) / 125 (mW/°C) = 9.5 °C.

What is below of the ∆Tmax (85 °C) = (Factor)2× ∆T (70 °C) = (0.7)2×20 °C=9.8°C.

On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 17.5 ARMS

And then max IRMS for 85 °C of ambient temperature is defined as follows:

IRMS (85 °C) = Factor ×IRMS (70 °C) = 0.7 ×17.5 ARMS = 12.25 ARMS.

What confirms once again that IRMS (12 ARMS at 20 kHz) is below the max specified for such

frequency and ambient temperature.

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 35 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Life time expectancy - typical curve (450 V DC / B3277x-X4

Life time expectancy - typical curve (575 V DC / 800 V DC / 900 V DC / 1100 V DC /

1300 V DC / B3277X-5/8/9/0/1)

Note: Confidence level of 95%

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 36 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Testing and Standards

Test Reference Conditions of test Performance requirements

Electrical

Parameters

(Routine test)

IEC 61071-11 Voltage between terminals,

1.5 VR, during 10 s

Insulation resistance, RINS at

VRif VR< 500 V or

500 V if VR≥500 V

Capacitance, C at 1 kHz

(room temperature)

Dissipation factor, tan δat

1/10 kHz (room temperature)

Within specified limits

Robustness

of termina-

tions

(Type test)

IEC 60068-2-21 Tensile strength (test Ua1) Capacitance and tan δ

within specified limits

Wire diameter

Tensile

force

0.5 < d1≤0.8 mm

0.8 < d1≤1.25 mm

10 N

20 N

Resistance to

soldering

heat

(Type test)

IEC 60068-2-20,

test Tb,

method 1A

Solder bath temperature at

260 ±5°C, immersion for

10 seconds

∆C/C0≤2%

|∆tan δ|≤0.002

Rapid

change of

temperature

(Type test)

IEC 60384-16 TA= lower category temperature

TB= upper category temperature

Five cycles, duration t = 30 min.

|∆C/C0|≤2%

|∆tan δ|≤0.002

RINS ≥50% of initial limit

Vibration

(Type test)

IEC 60384-16 Test FC: vibration sinusoidal

Displacement: 0.75 mm

Accleration: 98 m/s2

Frequency: 10 Hz ... 500 Hz

Test duration: 3 orthogonal axes,

2 hours each axe

No visible damage

Bump

(Type test)

IEC 60384-16 Test Eb: Total 4000 bumps with

390 m/s2mounted on PCB

6 ms duration

No visible damage

|∆C/C0|≤2%

I∆tan δI≤0.002

RINS ≥50% of initial limit

Climatic

sequence

(Type test)

IEC 60384-16 Dry heat Tb / 16 h.

Damp heat cyclic, 1st cycle

+55°C / 24h / 95% ... 100% RH

Cold Ta / 2h

Damp heat cyclic, 5 cycles

+55°C / 24h / 95% ... 100% RH

No visible damage

|∆C/C0|≤3%

|∆tan δ|≤0.001

RINS ≥50% of initial limit

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 37 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Test Reference Conditions of test Performance requirements

Damp Heat

Steady State

(Type test)

IEC 60384-16 Test Ca

40 °C / 93% RH / 56 days

No visible damage

I∆C/C0|≤5%

I∆tan δ|≤0.005

RINS ≥50% of initial limit

Endurance

(Type test)

IEC 60384-16 70 °C / 1.25 VR/ 1000 hours or

85 °C / 1.25 Vop / 1000 hours or

100 °C / 1.25 Vop / 1000 hours

No visible damage

|∆C/C0|≤5% at 1 kHz

|∆tan δ|≤0.005

RINS ≥50% of initial limit

Mounting guidelines

1 Soldering

1.1 Solderability of leads

The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.

Before a solderability test is carried out, terminals are subjected to accelerated ageing (to

IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far

higher than the upper category temperature of the capacitors, the terminal wires should be cut off

from the capacitor before the ageing procedure to prevent the solderability being impaired by the

products of any capacitor decomposition that might occur.

Solder bath temperature 235 ±5°C

Soldering time 2.0 ±0.5 s

Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane

Evaluation criteria:

Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 38 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1.2 Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.

Conditions:

Series Solder bath temperature Soldering time

MKT boxed (except 2.5 ×6.5 ×7.2 mm)

coated

uncoated (lead spacing > 10 mm)

260 ±5°C 10 ±1 s

MFP

MKP (lead spacing > 7.5 mm)

MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1 s

MKP

MKT

(lead spacing ≤7.5 mm)

uncoated (lead spacing ≤10 mm)

insulated (B32559)

<4s

recommended soldering

profile for MKT uncoated

(lead spacing ≤10 mm) and

insulated (B32559)

Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane

Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor

body and liquid solder

Evaluation criteria:

Visual inspection No visible damage

∆C/C0

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

tan δAs specified in sectional specification

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 39 of 48Please read Cautions and warnings and

Important notes at the end of this document.

1.3 General notes on soldering

Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-

gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit

can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical

characteristics. For short exposures (as in practical soldering processes) the heat load (and thus

the possible effects on a capacitor) will also depend on other factors like:

Pre-heating temperature and time

Forced cooling immediately after soldering

Terminal characteristics:

diameter, length, thermal resistance, special configurations (e.g. crimping)

Height of capacitor above solder bath

Shadowing by neighboring components

Additional heating due to heat dissipation by neighboring components

Use of solder-resist coatings

The overheating associated with some of these factors can usually be reduced by suitable coun-

termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced

cooling process may possibly have to be included.

EPCOS recommendations

As a reference, the recommended wave soldering profile for our film capacitors is as follows:

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 40 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Body temperature should follow the description below:

MKP capacitor

During pre-heating: Tp≤110 °C

During soldering: Ts≤120 °C, ts≤45 s

MKT capacitor

During pre-heating: Tp≤125 °C

During soldering: Ts≤160 °C, ts≤45 s

When SMD components are used together with leaded ones, the film capacitors should not pass

into the SMD adhesive curing oven. The leaded components should be assembled after the SMD

curing step.

Leaded film capacitors are not suitable for reflow soldering.

In order to ensure proper conditions for manual or selective soldering, the body temperature of

the capacitor (Ts) must be ≤120 °C.

One recommended condition for manual soldering is that the tip of the soldering iron should

be < 360 °C and the soldering contact time should be no longer than 3 seconds.

For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-

sures are recommended:

pre-heating to not more than 110 °C in the preheater phase

rapid cooling after soldering

Please refer to EPCOS Film Capacitor Data Book in case more details are needed.

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 41 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Cautions and warnings

Do not exceed the upper category temperature (UCT).

Do not apply any mechanical stress to the capacitor terminals.

Avoid any compressive, tensile or flexural stress.

Do not move the capacitor after it has been soldered to the PC board.

Do not pick up the PC board by the soldered capacitor.

Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified

lead spacing.

Do not exceed the specified time or temperature limits during soldering.

Avoid external energy inputs, such as fire or electricity.

Avoid overload of the capacitors.

The table below summarizes the safety instructions that must always be observed. A detailed

description can be found in the relevant sections of the chapters "General technical information"

and "Mounting guidelines".

Topic Safety information Reference chapter

"General technical

information"

Storage

conditions

Make sure that capacitors are stored within the specified

range of time, temperature and humidity conditions.

4.5

"Storage conditions"

Flammability Avoid external energy, such as fire or electricity (passive

flammability), avoid overload of the capacitors (active

flammability) and consider the flammability of materials.

5.3

"Flammability"

Resistance to

vibration

Do not exceed the tested ability to withstand vibration.

The capacitors are tested to IEC 60068-2-6.

EPCOS offers film capacitors specially designed for

operation under more severe vibration regimes such as

those found in automotive applications. Consult our

catalog "Film Capacitors for Automotive Electronics".

5.2

"Resistance to

vibration"

Topic Safety information Reference chapter

"Mounting guidelines"

Soldering Do not exceed the specified time or temperature limits

during soldering.

1 "Soldering"

Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"

Embedding of

capacitors in

finished

assemblies

When embedding finished circuit assemblies in plastic

resins, chemical and thermal influences must be taken

into account.

Caution: Consult us first, if you also wish to embed other

uncoated component types!

3 "Embedding of

capacitors in finished

assemblies"

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 42 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Display of ordering codes for EPCOS products

The ordering code for one and the same product can be represented differently in data sheets,

data books, other publications and the website of EPCOS, or in order-related documents such as

shipping notes, order confirmations and product labels. The varying representations of the or-

dering codes are due to different processes employed and do not affect the specifications

of the respective products.

Detailed information can be found on the Internet under www.epcos.com/orderingcodes.

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 43 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Symbols and terms

Symbol English German

αHeat transfer coefficient Wärmeübergangszahl

αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität

A Capacitor surface area Kondensatoroberfläche

βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität

C Capacitance Kapazität

CRRated capacitance Nennkapazität

∆C Absolute capacitance change Absolute Kapazitätsänderung

∆C/C Relative capacitance change (relative

deviation of actual value)

Relative Kapazitätsänderung (relative

Abweichung vom Ist-Wert)

∆C/CRCapacitance tolerance (relative deviation

from rated capacitance)

Kapazitätstoleranz (relative Abweichung

vom Nennwert)

dt Time differential Differentielle Zeit

∆t Time interval Zeitintervall

∆T Absolute temperature change

(self-heating)

Absolute Temperaturänderung

(Selbsterwärmung)

∆tan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors

∆V Absolute voltage change Absolute Spannungsänderung

dV/dt Time differential of voltage function (rate

of voltage rise)

Differentielle Spannungsänderung

(Spannungsflankensteilheit)

∆V/∆t Voltage change per time interval Spannungsänderung pro Zeitintervall

E Activation energy for diffusion Aktivierungsenergie zur Diffusion

ESL Self-inductance Eigeninduktivität

ESR Equivalent series resistance Ersatz-Serienwiderstand

f Frequency Frequenz

f1Frequency limit for reducing permissible

AC voltage due to thermal limits

Grenzfrequenz für thermisch bedingte

Reduzierung der zulässigen

Wechselspannung

f2Frequency limit for reducing permissible

AC voltage due to current limit

Grenzfrequenz für strombedingte

Reduzierung der zulässigen

Wechselspannung

frResonant frequency Resonanzfrequenz

FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur

Diffusion

FTDerating factor Deratingfaktor

i Current (peak) Stromspitze

ICCategory current (max. continuous

current)

Kategoriestrom (max. Dauerstrom)

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 44 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

IRMS (Sinusoidal) alternating current,

root-mean-square value

(Sinusförmiger) Wechselstrom

izCapacitance drift Inkonstanz der Kapazität

k0Pulse characteristic Impulskennwert

LSSeries inductance Serieninduktivität

λFailure rate Ausfallrate

λ0Constant failure rate during useful

service life

Konstante Ausfallrate in der

Nutzungsphase

λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate

Pdiss Dissipated power Abgegebene Verlustleistung

Pgen Generated power Erzeugte Verlustleistung

Q Heat energy Wärmeenergie

ρDensity of water vapor in air Dichte von Wasserdampf in Luft

R Universal molar constant for gases Allg. Molarkonstante für Gas

R Ohmic resistance of discharge circuit Ohmscher Widerstand des

Entladekreises

RiInternal resistance Innenwiderstand

Rins Insulation resistance Isolationswiderstand

RPParallel resistance Parallelwiderstand

RSSeries resistance Serienwiderstand

S severity (humidity test) Schärfegrad (Feuchtetest)

t Time Zeit

T Temperature Temperatur

τTime constant Zeitkonstante

tan δDissipation factor Verlustfaktor

tan δDDielectric component of dissipation

factor

Dielektrischer Anteil des Verlustfaktors

tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors

tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors

TATemperature of the air surrounding the

component

Temperatur der Luft, die das Bauteil

umgibt

Tmax Upper category temperature Obere Kategorietemperatur

Tmin Lower category temperature Untere Kategorietemperatur

tOL Operating life at operating temperature

and voltage

Betriebszeit bei Betriebstemperatur und

-spannung

Top Operating temperature, TA+∆T Beriebstemperatur, TA+∆T

TRRated temperature Nenntemperatur

Tref Reference temperature Referenztemperatur

tSL Reference service life Referenz-Lebensdauer

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 45 of 48Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

VAC AC voltage Wechselspannung

VCCategory voltage Kategoriespannung

VC,RMS Category AC voltage (Sinusförmige)

Kategorie-Wechselspannung

VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung

Vch Charging voltage Ladespannung

VDC DC voltage Gleichspannung

VFB Fly-back capacitor voltage Spannung (Flyback)

ViInput voltage Eingangsspannung

VoOutput voltage Ausgangssspannung

Vop Operating voltage Betriebsspannung

VpPeak pulse voltage Impuls-Spitzenspannung

Vpp Peak-to-peak voltage Impedance Spannungshub

VRRated voltage Nennspannung

RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung

VRMS (Sinusoidal) alternating voltage,

root-mean-square value

(Sinusförmige) Wechselspannung

VSC S-correction voltage Spannung bei Anwendung "S-correction"

Vsn Snubber capacitor voltage Spannung bei Anwendung

"Beschaltung"

Z Impedance Scheinwiderstand

Lead spacing Rastermaß

B32774 ... B32778

MKP DC link high density series up to 480 µF

Page 46 of 48Please read Cautions and warnings and

Important notes at the end of this document.

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

tailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order. We also

reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the fore-

going for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-

sion of the "General Terms of Delivery for Products and Services in the Electrical In-

dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

Important notes

Page 47 of 48

7. The trade names EPCOS, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,

MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,

SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,

ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-

tries. Further information will be found on the Internet at www.epcos.com/trademarks.

Important notes

Page 48 of 48