Philips Semiconductors Product specification
TrenchMOS transistor BUK9516-55A
Logic level FET BUK9616-55A
STATIC CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V(BR)DSS Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 55 - - V
voltage Tj = -55˚C 50 - - V
VGS(TO) Gate threshold voltage VDS = VGS; ID = 1 mA 1 1.5 2.0 V
Tj = 175˚C 0.5 - - V
Tj = -55˚C - - 2.3 V
IDSS Zero gate voltage drain current VDS = 55 V; VGS = 0 V; - 0.05 10 µA
Tj = 175˚C - - 500 µA
IGSS Gate source leakage current VGS = ±10 V; VDS = 0 V - 2 100 nA
RDS(ON) Drain-source on-state VGS = 5 V; ID = 25 A - 12.5 16 mΩ
resistance Tj = 175˚C - - 32 mΩ
VGS = 10 V; ID = 25 A - 10 15 mΩ
VGS = 4.5 V; ID = 25 A - - 17 mΩ
DYNAMIC CHARACTERISTICS
Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Ciss Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 2314 3085 pF
Coss Output capacitance - 347 416 pF
Crss Feedback capacitance - 243 333 pF
td on Turn-on delay time VDD = 30 V; Rload =1.2Ω; - 45 68 ns
trTurn-on rise time VGS = 5 V; RG = 10 Ω- 130 195 ns
td off Turn-off delay time - 400 560 ns
tfTurn-off fall time - 130 182 ns
LdInternal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
LdInternal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die(TO220AB)
LdInternal drain inductance Measured from upper edge of drain - 2.5 - nH
tab to centre of die(SOT404)
LsInternal source inductance Measured from source lead to - 7.5 - nH
source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IDR Continuous reverse drain - - 66 A
current
IDRM Pulsed reverse drain current - - 263 A
VSD Diode forward voltage IF = 25 A; VGS = 0 V - 0.85 1.2 V
IF = 66 A; VGS = 0 V - 1.1 - V
trr Reverse recovery time IF = 20 A; -dIF/dt = 100 A/µs; - 51 164 ns
Qrr Reverse recovery charge VGS = -10 V; VR = 30 V - 102 126 nC
May 2000 2 Rev 1.000