AP2162/ AP2172 1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2162 and AP2172 are integrated high-side power switches ( Top View ) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and GND 1 8 FLG1 IN 2 7 OUT1 EN1 3 6 OUT2 EN2 4 5 FLG2 thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SO-8 and MSOP-8EP packages. SO-8 Features ( Top View ) * Dual USB Port Power Switches * Over-Current and Thermal Protection * 1.5A Accurate Current Limiting * Reverse Current Blocking * GND 1 8 FLG1 IN 2 7 OUT1 115m On-Resistance EN1 3 6 OUT2 * Input Voltage Range: 2.7V - 5.5V EN2 4 5 FLG2 * 0.6ms Typical Rise Time * Very Low Shutdown Current: 1A (max) * Fault Report (FLG) with Blanking Time (7ms typ) * ESD Protection: 4.5KV HBM, 350V MM * Active High (AP2172) or Active Low (AP2162) Enable Applications * Ambient Temperature Range -40C to +85C * Consumer Electronics - LCD TV & Monitor, Game Machines * SO-8 and MSOP-8EP (Exposed Pad): Available in "Green" * Communications - Set-Top-Box, GPS, Smartphone Molding Compound (No Br, Sb) * MSOP-8EP Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) * UL Recognized, File Number E322375 * IEC60950-1 CB Scheme Certified Notes: Computing - Laptop, Desktop, Servers, Printers, Docking Station, HUB 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit AP2172 Enable Active High Power Supply 2.7V to 5.5V IN 10k 10k 10uF OFF AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 0.1uF 68uF 0.1uF 68uF 0.1uF FLG1 FLG2 ON Load OUT1 EN1 EN2 OUT2 Load GND 1 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Available Options Part Number Channel Enable Pin (EN) Current Limit (Typical) Recommended Maximum Continuous Load Current AP2162 AP2172 2 2 Active Low Active High 1.5A 1.5A 1.0A 1.0A Pin Descriptions Pin Name GND IN EN1 Pin Number SO-8 MSOP-8EP 1 1 2 2 3 3 EN2 FLG2 OUT2 OUT1 FLG1 4 5 6 7 8 Exposed Tab -- Function Ground Voltage input pin Switch 1 enable input, active low (AP2162) or active high (AP2172) 4 5 6 7 8 Switch 2 enable input, active low (AP2162) or active high (AP2172) Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered Switch 2 voltage output pin Switch 1 voltage output pin Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance. Exposed Tab It should not be used as electrical ground conduction path. Functional Block Diagram AP2162, AP2172 FLG 1 T h e rm a l S ense D e g litc h EN1 D riv e r C u rre n t L im it GND U VLO C u rre n t S ense OUT1 C u rre n t S ense OUT2 IN U VLO EN2 FLG 2 D riv e r C u rre n t L im it D e g litc h T h e rm a l S ense AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 GND 2 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Symbol ESD HBM ESD MM Parameter Human Body Model ESD Protection Machine Model ESD Protection Rating 3 300 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V VIN ILOAD TJ(MAX) TST Caution: Input Voltage Unit kV V Maximum Continuous Load Current Internal Limited A 150 C -65 to +150 C Maximum Junction Temperature Storage Temperature Range (Note 4) Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at conditions between maximum recommended operating conditions and absolute maximum ratings is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Note: 4. UL Recognized Rating from -30C to +70C (Diodes qualified TST from -65C to +150C) Recommended Operating Conditions (@TA = +25C, unless otherwise specified.) Symbol Parameter Min Max Units 2.7 5.5 V VIN Input voltage IOUT Output Current 0 1.0 A VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature -40 +85 C AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 3 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Electrical Characteristics (@TA = +25C, VIN = +5V, unless otherwise specified.) Symbol Parameter Test Conditions Min Max Unit VUVLO Input UVLO RLOAD = 1k 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 0.5 1 A Input Quiescent Current, Dual Enabled, IOUT = 0 100 160 A ILEAK Input Leakage Current Disabled, OUT grounded 1 A IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 150 m IQ RDS(ON) ISHORT ILIMIT Switch on-resistance Short-Circuit Current Limit Over-Load Current Limit 1.6 Typ VIN = 5V, IOUT = 0.5A, -40C TA +85C 1 MSOP-8EP SO-8 120 160 m 140 180 m Enabled into short circuit, CL = 68F 1.4 1.9 A VIN = 5V, VOUT = 4.6V, CL = 68F, -40C TA +85C Current Limiting Trigger Threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68F VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V ISINK A VIN = 3.3V, IOUT = 0.5A, -40C TA 85C ITrig TD(ON) 115 EN Input Leakage VEN = 5V Output Turn-On Delay Time CL=1F, RLOAD = 10 Output Turn-On rise time 1.1 1.5 A 2.4 A 0.8 V 2 V 1 A 0.05 ms CL=1F, RLOAD = 10 0.6 Output Turn-Off Delay Time CL=1F, RLOAD = 10 0.01 Output Turn-Off Fall Time CL=1F, RLOAD = 10 0.05 0.1 RFLG FLG Output FET On-Resistance IFLG =10mA 30 50 TBlank FLG Blanking Time CIN =10F, CL = 68F 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1k THYS Thermal Shutdown Hysteresis TR TD(OFF) TF JA Notes: Thermal Resistance Junction-toAmbient 4 1.5 ms ms ms 140 C 25 C SO-8 (Note 5) 110 o MSOP-8EP (Note 6) 60 o C/W C/W 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane. AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 4 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics VEN 50% TD(ON) 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% TF TD(ON) 90% VOUT 10% 90% 10% 90% 10% Figure 1 Voltage Waveforms: AP2162 (left), AP2172 (right) All Enable Plots are for AP2172 Active High Channel 1 Turn-Off Delay and Fall Time Channel 1 Turn-On Delay and Rise Time Ven 1 5V/div Ven 1 5V/div Vout 1 2V/div Vout 1 2V/div CL = 1F TA = +25C RL = 10 CL = 1F TA = +25C RL = 10 500s/div 500s/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div Vout 2 2V/div Vout 2 2V/div CL = 1F TA = +25C RL = 10 CL = 1F TA = +25C RL = 10 500s/div 500s/div AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 5 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Channel 1 Turn-Off Delay and Fall Time Channel 1 Turn-On Delay and Rise Time Ven 1 5V/div Ven 1 5V/div CL=100uF Vout 1 2V/div TA=25C Vout 1 2V/div RL=10 CL=100uF TA=25C RL=10 500s/div 500s/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div CL = 100F TA = +25C Vout 2 2V/div Vout 2 2V/div RL = 10 CL = 100F TA = +25C RL = 10 500s/div 500s/div Channel 1 Short Circuit Current, Device Enabled Into Short Channel 2 Short Circuit Current, Device Enabled Into Short Ven 1 5V/div Ven 2 5V/div Iout 1 500mA/div Iout 2 500mA/div VIN = 5V VIN = 5V TA = +25C TA = +25C CL = 68F CL = 68F 500s/div AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 500s/div 6 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Channel 1 Inrush Current Ven 1 5V/div Channel 2 Inrush Current Ven 2 5V/div CL = 100F CL = 100F VIN = 5V TA = +25C RL = 5 Iout 1 200mA/div VIN = 5V TA = +25C RL = 5 Iout 2 200mA/div CL = 470F CL = 470F CL = 220F CL = 220F 1ms/div 1ms/div Channel 1 2 Load Connected to Enabled Device Channel 1 1 Load Connected to Enabled Device VIN = 5V TA = +25C Vflag 1 2V/div CL = 68F Iout 1 1A/div VIN = 5V TA = +25C Vflag 1 2V/div CL = 68F Iout 1 1A/div 2ms/div 2ms/div Channel 2 1 Load Connected to Enabled Device Channel 2 2 Load Connected to Enabled Device VIN = 5V VIN = 5V TA = +25C Vflag 2 2V/div CL = 68F TA = +25C Vflag 2 2V/div CL = 68F Iout 2 1A/div Iout 2 1A/div 2ms/div 2ms/div AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 7 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Channel 1 Short Circuit with Blanking Time and Recovery Vout 5V/div Channel 2 Short Circuit with Blanking Time and Recovery VIN = 5V TA = +25C Vout 5V/div VIN = 5V TA = +25C CL = 68F CL = 68F Iout 500mA/div Vflag 5V/div Iout 1A/div Iout 1A/div 20ms/div 20ms/div Channel 1 Power On Channel 2 Power On Vflag 5V/div Vflag 5V/div Iout 500mA/div TA = +25C Iout 500mA/div TA = +25C CL = 68F CL = 68F RL = 5 RL = 5 Ven 5V/div Ven 5V/div Vin 5V/div Vin 5V/div 1ms/div 1ms/div Channel 1 UVLO Increasing Channel 1 UVLO Decreasing TA = +25C Vin 2V/div CL = 68F Vin 2V/div RL = 5 TA = +25C CL = 68F RL = 5 Iout 500mA/div Iout 500mA/div 10ms/div 1ms/div AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 8 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Channel 2 UVLO Decreasing Channel 2 UVLO Increasing TA = +25C Vin 2V/div CL = 68F Vin 2V/div RL = 5 TA = +25C CL = 68F RL = 5 Iout 500mA/div Iout 500mA/div 1ms/div 10ms/div Channel 1 Enabled and Shorted with Channel 2 Disabled Channel 1 Disabled and Channel 2 Enabled Vout 1 5V/div Ven1 5V/div Vout 2 5V/div Vout 1 5V/div Vflag 1 5V/div TA = +25C Ven2 5V/div CL = 68F TA = +25C CL = 68F Iout 2 500mA/div Vout 2 5V/div 100ms/div 50ms/div Turn-Off Time vs Input Voltage 750 30 700 29 650 CL = 1F 29 RL = 10 28 TA = +25C 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 550 500 450 28 27 27 400 CL = 1F 350 RL = 10 26 300 TA = +25C 26 25 250 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) 9 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Fall Time vs Input Voltage Rise Time vs Input Voltage 22 650 600 22 Fall Time (us) Rise Time (us) 550 500 450 400 CL = 1F 350 RL = 10 300 TA = +25C 21 21 CL = 1F 20 RL = 10 20 TA = +25C 19 250 2 2.5 3 3.5 4 4.5 5 5.5 2 6 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 63 Supply Current, Output Disabled (uA) Supply Current, Output Enabled (uA) 68 Vin=5.0V 58 Vin=5.5V 53 48 43 38 33 Vin=3.3V Vin=2.7V Vin=5.5V 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Vin=2.7V 0.0 28 -60 -40 -20 0 20 40 60 80 -60 100 Vin=5.0V Vin=3.3V -40 -20 0 20 40 60 80 100 Ambient Temperature (C) Ambient Temperature (C) Static Drain-Source On-State Resistance vs Ambient Temperature Short-Circuit Output Current vs Ambient Temperature 1.56 Short-Circuit Output Current (A) Static Drain-Source On-State Resistance (m) 170 Vin=2.7V 160 150 140 130 Vin=3.3V 120 110 100 Vin=5V 90 CL = 100F 1.55 1.54 Vin=3.3V Vin=2.7V 1.53 Vin=5.0V 1.52 1.51 1.50 1.49 1.48 1.47 1.46 Vin=5.5V 1.45 80 -60 -40 -20 0 20 40 60 80 100 -60 Document number: DS31570 Rev. 6 - 2 -20 0 20 40 60 80 100 Ambient Temperature (C) Ambient Temperature (C) AP2162/ AP2172 -40 10 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Typical Performance Characteristics (cont.) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.99 2.20 Threshold Trip Current (A) Undervoltage Lockout (V) 1.98 2.10 2.00 UVLO Rising 1.90 1.80 UVLO Falling 1.70 1.97 1.96 1.95 1.94 1.93 1.92 TA = +25C 1.91 CL = 68F 1.90 1.89 1.88 1.60 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (C) Current Limit Response vs Peak Current Current Limit Response (us) 120 100 80 VIN = 5V TA = +25C CL = 68F 60 40 20 0 0 2 4 6 8 10 12 Peak Current (A) AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 11 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Application Information Power Supply Considerations A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2162/AP2172 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2162/AP2172 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2162/AP2172 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)x I Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2162/AP2172 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 12 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Application Information (cont.) Under-voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Figure 2. Typical Two-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2162/AP2172, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2162/AP2172 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2162/AP2172 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 13 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Ordering Information Part Number Package Code Packaging AP21X2SG-13 AP21X2MPG-13 S MP SO-8 MSOP-8EP 13" Tape and Reel Quantity 2500/Tape & Reel 2500/Tape & Reel Part Number Suffix -13 -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 4 : Active Low 5 : Active High YY WW X X 2 1 (2) 2 : 2 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 3 4 MSOP-8EP ( Top view ) 8 7 Logo AP21X X 1 Document number: DS31570 Rev. 6 - 2 5 YWXE Part Number 4 : Active Low 5 : Active High AP2162/ AP2172 6 2 3 A~Z : Green MSOP-8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week 2 : 2 Channel 4 14 of 17 www.diodes.com May 2014 (c) Diodes Incorporated AP2162/ AP2172 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 0.254 (1) Package type: SO-8 E1 E A1 Gauge Plane Seating Plane L Detail `A' h 7~9 45 Detail `A' A2 A A3 b e SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm D (2) Package type: MSOP-8EP D 4X 10 x E 0.25 D1 E2 Gauge Plane Seating Plane a y 1 4X 10 8Xb e Detail C E3 A1 A3 c A2 A D L E1 See Detail C AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 15 of 17 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm May 2014 (c) Diodes Incorporated AP2162/ AP2172 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package Type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 16 of 17 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 May 2014 (c) Diodes Incorporated AP2162/ AP2172 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2014, Diodes Incorporated www.diodes.com AP2162/ AP2172 Document number: DS31570 Rev. 6 - 2 17 of 17 www.diodes.com May 2014 (c) Diodes Incorporated