Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200122 Rev. F • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • October 31, 2007 1
Features
●2.4–2.5 GHz operation
●Advanced InGaP HBT process
●Integrated output power detector
●Integrated output second harmonic filter
●Low quiescent current: 50 mA
●28 dB small signal gain
●802.11g linear power: 18 dBm (includes integrated filter loss)
●802.11b mask-compliant power: 21 dBm (includes integrated
filter loss)
●Low-cost plastic package
●Available on tape and reel
Description
The SKY65006 is a linear, high-gain, two-stage power
amplifier with integrated second harmonic filter, designed for
low voltage operations. This device is manufactured on our
advanced InGap HBT process. It is designed for power
amplifier applications in WLAN, in PC and handsets, and
spread spectrum systems from 2.4–2.5 GHz. The amplifier
is packaged in a QFN-16, 3 x 3 mm package.
SKY65006: 3.3 V, 2.5 GHz Linear Power Amplifier
PRELIMINARY DATA SHEET
N/C N/C VCC N/C
N/C 1
2
3
4
12
11
10
9
16
5
1415
6
13
7 8
N/C
N/C
RF IN
N/C
VDETOUT
RF OUT/VCC
RF OUT/VCC
VREG1 VREG2VBCC VDCC
LPF
Block Diagram
Exposed Pad
0.008 (0.20 mm)
Ref.
0.001
(0.02 mm)
+0.03
-0.02
(0.001 mm)
0.030 (0.75 mm)
± 0.002 (0.05 mm)
0.118
(3.00 mm)
0.118
(3.00 mm)
Pin 1
Indicator
0.059
(1.500 mm)
0.059 (1.500 mm)
0.029
(0.73 mm)
0.057 (1.45 mm)
± 0.004 (0.10 mm)
0.057 (1.45 mm)
± 0.004 (0.10 mm)
QFN-16 (3 x 3 mm)
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 31, 2007 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. F2
Pin Symbol Description
1, 3, 4, 12, N/C No connect
13, 15, 16
2 RF IN RF input
5 VBCC DC control voltage input that sets bias to the first
amplifier stage.
6V
REG1 DC control voltage input to regulate the current to
the first amplifier stage.
7V
REG2 DC control voltage input to regulate the current to
the 2nd amplifier stage.
8 VDCC Reference voltage input to power detector.
9V
DETOUT Power detector output voltage.
10, 11 RF OUT/VCC RF outputs and supply voltage inputs to second
amplifier stage. These pins must be connected
directly together for current sharing.
14 VCC DC supply voltage input to the first amplifier stage.
17 GND Equipotential point. Connect package backside
center paddle to the printed circuit board common
via the lowest possible impedance.
Pin Assignments
Mode VCC VREG(1) VBCC VDCC
RF IN-RF OUT 3.3 3 3.3 3.3
DC Voltage Control Table
Characteristic Value
Supply voltage (VCC) 5 V
Supply current (VICC) 500 mA
Regulator supply voltage (VREG1 & VREG2) < VCC V
Operating temperature -40 °C to +85 °C
Storage temperature -65 °C to +85 °C
RF input power 10 dBm
Absolute Maximum Ratings
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty.
CAUTION: Although this device is designed to be as robust as
possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all times
from ESD. Static charges may easily produce poten-
tials of several kilovolts on the human body or
equipment, which can discharge without detection.
Industry-standard ESD precautions must be employed
at all times.
1. VREG refers to VREG on the engineering test board.
Parameter Symbol Condition Min. Typ. Max. Unit
Frequency range F 2400 2500 MHz
Gain lS21l Small signal 27.5 dB
Gain variation over frequency l∆S21l Small signal 0.2 dB
Quiescent current ICQ (No RF signal ) 50 mA
Input return loss lS11l Small signal -21.2 dB
Output return loss lS22l Small signal -6.2 dB
Output P1 dB P1 dB CW 23.9 dBm
2nd harmonic F2CW at P1 dB -58.6 dBm
3rd harmonic F3CW at P1 dB -43.2 dBm
Detector voltage VDET CW at POUT = 0 dBm 0.2 V
General RF Transmit Electrical Specifications
TA= 25 °C, VCC = 3.3 V, VREG = 3 V
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200122 Rev. F • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • October 31, 2007 3
Parameter Symbol Condition Min. Typ. Max. Unit
Linear power at 2.442 GHz POUT 54 Mbps at 3.5% EVM 18.1 dBm
Current consumption ICC 54 Mbps at linear power 0.129 A
Detector voltage VDET 54 Mbps at linear power 1V
802.11g Electrical Specifications
OFDM Modulation, 54 Mbps, TA= 25 °C, VCC = 3.3 V, VREG = 3 V
Parameter Symbol Condition Min. Typ. Max. Unit
Compliant power at 2.442 GHz POUT 11 Mbps 21.5 dBm
Current consumption ICC 11 Mbps at compliant power 0.191 A
Detector voltage VDET 11 Mbps at compliant power 1.4 V
802.11b Electrical Specifications
CCK Modulation, 11 Mbps, TA= 25 °C, VCC = 3.3 V, VREG = 3 V
802.11b data is taken with a raised cosine filter and an alpha factor of 0.7.
Small Signal Response
Conditions: VCC = 3.3 V, VREG = 3 V, TA= 25 °C
Frequency (GHz)
lS11l,lS21l,lS22l(dB)
-60
-50
-40
-30
-20
-10
0
10
20
30
0 1 2 3 4 5 6 7 8 9 10 11 12
lS11llS22l
lS21l
Small Signal Response
Conditions: VCC = 3.3 V, VREG = 3 V, TA= 25 °C
Frequency (GHz)
lS11l,lS21l,lS22l(dB)
-60
-50
-40
-30
-20
-10
0
10
20
30
2.40 2.42 2.44 2.46 2.48 2.50
lS11llS22l
lS21l
Typical Performance Data
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 31, 2007 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. F4
006A
XXXX
YXX
Pin 1
Indicator
Pin 1
Top View
Pin 16
Skyworks P/N
Lot #
Date Code
Y = Calendar Year
WW = Week
Device Branding Specifications
802.11g EVM and ICC vs. POUT
OFDM Modulation, 54 Mbps, VCC = 3.3 V,
VREG = 3 V, FC= 2.442 GHz, TA= 25 °C
POUT (dBm)
EVM (%), Gain (dB)
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
0 2 4 6 8 10 12 14 16 18 20
0
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
ICC ( mA )
Gain EVM
ICC
VDET vs. POUT
OFDM Modulation, 54 Mbps, VCC = 3.3 V,
VREG = 3 V, FC= 2.442 GHz, TA= 25 °C
POUT (dBm)
VDET (V)
0 2 4 6 8 10 12 14 16 18 20
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5 VDET
VREG vs. POUT
OFDM Modulation, 54 Mbps,
VCC = 3.3 V, TA= 25 °C
Frequency (GHz)
POUT (dBm)
17.5
17.6
17.7
17.8
17.9
18.0
18.1
18.2
18.3
18.4
18.5
2412 2424 2436 2448 2460 2472 2484
VREG = 3.25 VVREG = 3.15 V
VREG = 3.05 VVREG = 2.95 V VREG = 3.00 V
CW, 2F and 3F Harmonics vs. POUT
VCC = 3.3 V, VREG = 3 V, FC= 2.442 GHz, TA= 25 °C
POUT (dBm)
Gain (dB)
F2and F3(dBm)
20
22
24
26
28
30
32
34
36
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
-90
-80
-70
-60
-50
-40
-30
-20
-10
Gain F3
F2
802.11b POUT,Gain, and ICC vs. Frequency
CCK Modulation, 11 Mbps, VCC = 3.3 V, TA= 25 °C
Frequency (MHz)
POUT (dBm), Gain (dB)
ICC (MHz)
20
21
22
23
24
25
26
27
28
29
30
2412 2424 2436 2448 2460 2472 2484
0.185
0.186
0.187
0.188
0.189
0.190
0.191
0.192
0.193
0.194
0.195
Gain POUT
ICC
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200122 Rev. F • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • October 31, 2007 5
Applications Circuit
C6
C1
C7 R3
C4
L2
R2
C3
L1
R1
C5
C2
C8
C9
L4
C10
C11
L3
121110
1
16
4
EN18-D730
REV 2
RF IN
RF OUT
VCC
1
SKY65006
GND
VREG
GND
GND
VDET
VCC 3.3 V
VREG 3 V
+
+
+
Applications Board
Board Layout Board Photograph
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 31, 2007 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. F6
Part # ID Size Value Units Manufacturer Product Number
1C
10402 6 pF Murata GRM1555C1H6R0CZ01E
2C
20402 6 pF Murata GRM1555C1H6R0CZ01E
3C
30402 10K pF Murata GRM155R71E103KA01
4C
40402 10K pF Murata GRM155R71E103KA01
5C
50402 1.8 pF Murata GRM1555C1H1R8CZ01D
6C
60603 4.7 µF Panasonic ECST1AZ475R
7C
70402 5 pF Murata GRM1555C1H5R0CZ01E
8C
81206 10 µF AVX TAJA106M006R
9C
91206 10 µF AVX TAJA106M006R
10 C10 0402 1 pF Murata GRM1555C1H1R0CZ01E
11 C11 0402 1 pF Murata GRM1555C1H1R0CZ01E
12 L10402 22 nH TDK MLK1005S22NJT000
13 L20402 22 nH TDK MLK1005S22NJT000
14 L30402 2.2 nH TDK MLK1005S2N2ST000
15 L4 0402 2.2 nH TDK MLK1005S2N2ST000
16 R10402 180 ΩPanasonic(1) ERJ2GEJ181X
17 R20402 240 ΩPanasonic(1) ERJ2GEJ241X
18 R30402 51K ΩPanasonic(1) ERJ2GEJ513X
19 PCB Metro circuits EN18-D730
Bill of Material for Applications Board
1. Panasonic is Skyworks preferred vendor, however any suitable equivalent will do.
Test Board Biasing Procedure
1. Connect the RF input and output ports as labeled on the
engineering evaluation board.
2. Set the input power level from the signal generator to
approximately -25 dBm.
3. Apply ground connection from DC voltage supply to all
GND pins before applying any voltage.
4. Adjust the power supply to 3.3 V and set the current limit to
400 mA. Apply voltage to the pin labeled VCC and note that
there is no current draw from the supply. Be sure to apply
the voltage to VCC before applying any other voltages to the
test board.
5. Adjust a second power supply output to 3.0 V and set the
current limit to 30 mA. Apply voltage to the pin labeled VREG
and note that the current draw is approximately 10 mA.
6. Observe that the current on the VCC supply is in the range
of the quiescent current specification. The SKY65006
should be approximately 50 mA.
7. Observe that the small signal gain is within the range speci-
fied. The SKY65006 should be in the range of 27 dB. This
should verify the proper working conditions for this device,
and further testing can proceed.
8. To observe the detector voltage output, connect a voltmeter
or oscilloscope to the VDET pin on the evaluation test board.
Set the signal source to CW mode and increase power until
the output voltage begins to increase. The nominal offset
voltage with low or no signal inputs should be approximately
50–200 mV and should increase monotonically to approxi-
mately 700–1000 mV, when driven at an output level of
approximately 18 dBm. The evaluation circuit contains an
external 51K Ωresistor and an equivalent capacitance of
10 pF to ground.
9. Bias the unit off by first removing the VREG power supply and
finally remove the connection to the VCC power supply.
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200122 Rev. F • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • October 31, 2007 7
Application Information
The Skyworks SKY65006 is a high-performance 2-stage InGaP
power amplifier designed for 2.4–2.5 GHz ISM, IEEE802.11b and
802.11g WLAN band applications. The SKY65006 is a high-effi-
ciency linear amplifier designed for single 3.3 V supply operation,
requiring no input and output matching components for 50 Ω
operation. This device also includes an internal power detector
and integrated harmonic filter for reduced PC board component
count. The integrated low pass filter is also highly effective in
reducing harmonics at their source by localizing harmonic rejec-
tion to a tiny portion of the PA chip. This significantly reduces the
risk of radiation from a high order filter design external to the
amplifier. Filtering of harmonics in this way may eliminate the
need for an external shield over the PA, and reduces overall cost.
If additional suppression of harmonics is required, an external
low pass function can be added to the output of the amplifier.
Refer to data sheet for filter values and response plots.
The SKY65006 requires a nominal VCC supply voltage of 3.3 V
and a positive control voltage VREG1, 2 providing bias for the first
and second stage amplifiers. Nominal control voltage, VREG, is
2.5–2.6 V resulting from the stack of two emitter-base junctions
of about 1.3 V each for typical GaAs HBT device. To insure proper
reference currents into VREG1, 2, for normal operation of the RF
stages, drop-in resistors could be used between VREG1, 2 and a
VREG supply. Bias control would then be set in the range of
2.7–3.5 V allowing added flexibility for both the control voltage
value and desired RF stage currents. If additional output power is
required, VCC can also be increased 4.0 V. Biasing of each stage
consists of an external resistor of 180 Ω(R1) and 240 Ω(R2) for
the recommended typical bias currents of 15 mA and 35 mA for
stage 1 and 2 respectively. In most applications one end of each
of the bias resistors is tied to the VREG supply, so both amplifier
stages are biased with a single common voltage. Capacitor C4,
1.8 pF, bypasses the VREG stage 1 control bias pin and is used to
improve RF rejection of the bias control lines.
Although there is no need for external matching when operating
in a 50 Ωsystem, an input and output 6 pF decoupling capacitor
is shown on the evaluation circuit. This capacitor is only manda-
tory on the RF output side of the device. The RF input is DC
isolated and could be connected to driver circuits directly without
the need for additional blocking capacitors. Capacitors of 6 pF
were chosen because their self-resonant frequency would not
add any unwanted disturbances in the 50 Ωtransmission line
path. The SKY65006 is unconditionally stable at any frequency
and voltage setting as long as it is grounded correctly. It is
extremely important to pay special attention to the RF grounding
pad under the device. Ground pad vias and solder mask patterns
are designed in such a way to ensure minimum parasitic induc-
tance to the underlying ground and at each RF bypassing
component. To ensure reliable soldering of the device paddle, it is
highly recommended that filled vias with a minimal reliable
diameter and filling the entire pattern be used. The filled-via
technique would remove the possibility of solder migration down
via holes, which can cause a large increase in inductance and
possible instabilities.
Each amplifier stage is biased through a series choke and shunt
capacitor combination which is completely integrated on chip to
provide maximum RF isolation and harmonic radiation immunity.
To avoid interferences from the low-frequency gain of the ampli-
fier and to insure stability at low out of band frequencies, stage
1 amplifier is biased through inductor L1. It is also then shunted
by a large value capacitance to ensure proper low-frequency
bypassing of the amplifier. To avoid a shunting effect on the
50 Ωline, a high-impedance, self-resonating choke L2(in the
range of 22–33 nH depending on vendor and size) and a large
value bypass capacitor are used for biasing the output stage.
Capacitor C7, 4.7 µF, on the VCC line should be placed as close
as possible to the biasing network supplying stage 2 or the
output stage of the amplifier. Applications with the DC bias being
generated strictly from a battery as the voltage source may not
require this capacitor, or as large a value as specified in the
applications circuit. However, in that case, a smaller ceramic
capacitor of at least 0.1 µF should be used and also placed as
close as possible to the biasing network supplying stage 2.
Note: Normal operation requires that VCC including VBCC be
applied before the application of the VREG voltages biasing stage
1 and 2 bias currents. If VCC and VBCC are not applied prior to
the application of the VREG biasing, voltage damage could occur
from excessive base current draw through the collector junction
of the bias transistor.
The SKY65006 also includes an on-board, compensated power
detector providing a single-ended output voltage for measuring
power over a wide dynamic range. The detector load and
settling time constant are set external to the device. Nominal
detector load is 51K Ωand 5 pF, yielding a settling time of
approximately 500 ns. Note that there is an internal 5 pF on-chip
capacitance, so the net capacitance value is approximately 10 pF.
Lower resistor values may be used if necessary with the net
impact being a lower output detector voltage over its useful
dynamic range. For proper detector operation, a reference voltage
must be applied to the VDET line. Any voltage between 2 and 4 V
is acceptable for the reference voltage, but it is recommended to
supply VDET from the VREG power supply. The benefit in doing
this is that the approximate 2 mA of current that the reference
circuit consumes will not be wasted with the PA in the “Off”
state. There is also the option of not biasing the detector refer-
ence if the current consumption is of prime importance, but the
detector will then act as a normal unbiased detector, and
sensitivity and accuracy will be degraded.
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 31, 2007 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. F8
The application’s circuit board was constructed as a four-layer
FR4 stack with an overall thickness of 0.062 inches. Top layer
dielectric is 0.01-inch thick with 50 Ωtransmission line widths
of 0.0195 inches. Printed circuit board was constructed using a
symmetrical 0.01-inch stack on the top and bottom layers and
with a 0.032-inch thick pre-preg core. All components were 0402
in size with the exception of the 4.7 µF and 10 µF Tantalum
capacitors. Please note that the 10 µF capacitors were installed
to provide low frequency filtering for lab testing. Actual values, if
necessary, will be dependent upon layout and circuit environ-
ment. All ground vias used were 0.012 inches in diameter and
placed as close to the ground ends of by-passing components as
possible. Four vias were used under the device to create a low
inductance path to ground. If a smaller diameter is to be used, or
if the substrate thickness is greater than 0.01 inches, additional
vias must be placed under the device to reduce the potential risk
of parasitic oscillation.
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape andReel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
PRELIMINARY DATA SHEET • SKY65006
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200122 Rev. F • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • October 31, 2007 9
Copyright © 2002, 2003, 2004, 2005, 2006, 2007, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided
by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and
Conditions of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and
names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are
incorporated by reference.